# US 10,770,493 B2 · Solid-state imaging apparatus with high handling reliability and method for manufacturing solid-state imaging apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,770,493 B2 - Document ID: US10770493B2 - Status: Granted - Kind: B2 - Application number: 16/081,712 - Filed: 2017-02-14 - Published: 2019-01-17 - Granted: 2020-09-08 - Earliest claimed: 2016-03-15 - Assignees: Sony Corporation - Applicants: Sony Corporation - Inventors: Takayuki Gotou; Kiyotaka Hori - Web page: https://patentgrep.com/patent/US10770493B2 ## CPC - H10F 39/804: {Containers or encapsulations} - H10F 39/011: {Manufacture or treatment of image sensors covered by group H10F39/12} - H10F 39/8057: {Optical shielding} - H10F 39/811: {Interconnections} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/682: {comprising holes having chips therein} - H10W 72/0198: {batch processes} - H10W 72/073: {of die-attach connectors} - H10W 72/874: {On different surfaces} - H10W 90/00: Package configurations - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Provided are a solid-state imaging apparatus capable of having reduction in height and size while easily controlling warp with high handling reliability when the solid-state imaging apparatus is mounted on another substrate, and a method for manufacturing the solid-state imaging apparatus. The solid-state imaging apparatus includes a substrate having a recess on a surface thereof, an imaging chip disposed and fixed on an inner bottom surface of the recess, and a filler filled and solidified in the whole of a gap between a side surface of the imaging chip and an inner surface of the recess. A groove having a substantially constant width is formed between the side surface of the imaging chip and the inner surface of the recess. An expansion portion having width equal to or larger than the constant width is in a portion of the groove. ## Claims ### Claim 1 A solid-state imaging apparatus, comprising: a substrate having a recess on a surface thereof; an imaging chip disposed and fixed on an inner bottom surface of the recess; and a filler filled and solidified in whole of a gap between a side surface of the imaging chip and an inner surface of the recess, wherein a groove having a substantially constant width is between the side surface of the imaging chip and the inner surface of the recess, and an expansion portion is in a part of the groove, and a width of the expansion portion is equal to or larger than the substantially constant width of the groove. ### Claim 2 (depends on 1) The solid-state imaging apparatus according to claim 1, wherein the recess and the imaging chip are substantially rectangular, and the expansion portion is in the groove at a portion corresponding to a corner of each of the recess and the imaging chip. ### Claim 3 (depends on 2) The solid-state imaging apparatus according to claim 2, wherein the expansion portion is of a size capable of insertion of a first cylindrical member having a diameter larger than a size of a second cylindrical member for insertion into the corner in a case where the groove is of the substantially constant width. ### Claim 4 (depends on 1) The solid-state imaging apparatus according to claim 1, wherein the recess and the imaging chip are substantially rectangular, and the expansion portion is in the groove corresponding to a side of each of the recess and the imaging chip. ### Claim 5 (depends on 4) The solid-state imaging apparatus according to claim 4, wherein the expansion portion is of a size capable of insertion of a cylindrical member having a diameter larger than the substantially constant width of the groove. ### Claim 6 (depends on 1) The solid-state imaging apparatus according to claim 1, wherein a plurality of expansion portions is in a plurality of locations of the groove, and the plurality of expansion portions is in points having symmetric positional relationship with a center of the recess or a center of the imaging chip as a target axis. ### Claim 7 (depends on 1) The solid-state imaging apparatus according to claim 1, wherein wiring on an upper surface outside the recess of the substrate is connected to a terminal on an upper surface of the imaging chip via a bridge metal wiring in a thin film across the filler filled in the groove, and an upper surface side of the bridge metal wiring is covered with a light shielding film. ### Claim 8 (depends on 7) The solid-state imaging apparatus according to claim 7, wherein a plurality of bridge metal wirings is juxtaposed in a direction in which the groove extends, and the light shielding film covers the plurality of bridge metal wirings and whole of the groove. ### Claim 9 (depends on 1) The solid-state imaging apparatus according to claim 1, wherein the filler includes a filler material, a relationship of x1