# US 10,770,421 B2 · Bond chucks having individually-controllable regions, and associated systems and methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,770,421 B2 - Document ID: US10770421B2 - Status: Granted - Kind: B2 - Application number: 16/236,446 - Filed: 2018-12-29 - Published: 2020-07-02 - Granted: 2020-09-08 - Earliest claimed: 2018-12-29 - Assignees: Micron Technology, Inc. - Applicants: Micron Technology, Inc. - Inventors: Andrew M. Bayless; Cassie L. Bayless - Web page: https://patentgrep.com/patent/US10770421B2 ## CPC - B32B 37/12: characterised by using adhesives - B32B 37/1207: {Heat-activated adhesive (B32B37/04 takes precedence)} - B32B 37/06: characterised by the heating method - H10P 74/23: {characterised by multiple measurements, corrections, marking or sorting processes} - B32B 2037/1253: {curable adhesive} - B32B 2309/02: Temperature - B32B 2457/00: Electrical equipment - B32B 2457/14: Semiconductor wafers - H10W 72/01323: {in liquid form, e.g. by dispensing droplets or by screen printing} - H10W 72/01351: {Changing the shapes of die-attach connectors} - H10W 72/0198: {batch processes} - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - H10W 72/07163: {Means for mechanical processing, e.g. for planarising, pressing, stamping or drilling} - H10W 72/07173: {Means for moving chips, wafers or other parts, e.g. conveyor belts} - H10W 72/07183: {Means for monitoring} - H10W 72/07188: {Apparatus chuck} - H10W 72/07311: {Treating the bonding area before connecting, e.g. by applying flux or cleaning} - H10W 72/07331: {Connecting techniques} - H10W 72/07332: {Compression bonding, e.g. thermocompression bonding} - H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting} - H10W 90/732: {between stacked chips} - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A bond chuck having individually-controllable regions, and associated systems and methods are disclosed herein. The bond chuck comprises a plurality of individual regions configured to be individually heated independent of one another. In some embodiments, the individual regions include a first region configured to be heated to a first temperature, and a second region peripheral to the first region and configured to be heated to a second temperature different than the first temperature. In some embodiments, the bond chuck further comprises (a) a first coil disposed within the first region and configured to heat the first region to the first temperature, and (b) a second coil disposed within the second region and configured to heat the second region to the second temperature. The bond chuck can be positioned proximate a substrate of a semiconductor device such that heating the first region and/or second region affect the viscosity of an adhesive used to bond substrates of the semiconductor device to one another. Accordingly, heating the first region and/or the second region can cause the adhesive on the substrate to flow in a lateral, predetermined direction. ## Claims ### Claim 1 A system for manufacturing semiconductor devices, comprising: a chuck having a plurality of regions including a first region, and a second region peripheral to the first region; and a controller having instructions that, when executed, cause (a) the first region to be heated to a first temperature, and (b) the second region to be heated to a second temperature different than the first temperature. ### Claim 2 (depends on 1) The system of claim 1 wherein the chuck further comprises (a) a first coil disposed within the first region and configured to heat the first region to the first temperature, and (b) a second coil disposed within the second region and configured to heat the second region to the second temperature, and wherein the controller is in electrical communication with the first coil and the second coil. ### Claim 3 (depends on 2) The system of claim 2, further comprising a first circuit associated with the first coil and a second circuit associated with the second coil, wherein the controller is in electrical communication with the first coil via the first circuit and the second coil via the second circuit. ### Claim 4 (depends on 2) The system of claim 2 wherein: the plurality of regions further comprises a third region peripheral to the second region, and the chuck further comprises a third coil disposed within the third region and configured to heat the third region to a third temperature different than the first temperature and the second temperature. ### Claim 5 (depends on 1) The system of claim 1 wherein the plurality of regions further comprises a third region peripheral to the second region, wherein the instructions, when executed, cause the third region to be heated to a third temperature different than the first temperature and the second temperature. ### Claim 6 (depends on 1) The system of claim 1 wherein the first temperature and the second temperature are within a temperature range of from about 5° F. to 20° F. ### Claim 7 (depends on 1) The system of claim 1 wherein at least one of the first region or the second region is movable relative to the other in a longitudinal direction. ### Claim 8 A tool for use in manufacturing semiconductor devices, comprising: a first region; a first coil disposed within the first region and configured to heat the first region to a first temperature; a second region adjacent the first region; and a second coil disposed within the second region and configured to heat the second region to a second temperature different than the first temperature. ### Claim 9 (depends on 8) The tool of claim 8 wherein the tool includes an outer continuous surface that includes the first region and the second region. ### Claim 10 (depends on 8) The tool of claim 8 wherein the second region is peripheral to and entirely surrounds the first region. ### Claim 11 (depends on 8) The tool of claim 8, further comprising: a third region adjacent the second region; and a third coil disposed within the third region and configured to heat the third region to a third temperature different than at least one of the first temperature or the second temperature. ### Claim 12 (depends on 11) The tool of claim 11 wherein the third region is peripheral to and entirely surrounds the second region. ### Claim 13 A method for bonding semiconductor devices, comprising: providing a chuck having multiple regions including a first region and a second region at least partially surrounding the first region; heating the first region to a first temperature; and heating the second region to a second temperature different than the first temperature. ### Claim 14 (depends on 13) The method of claim 13 wherein: the chuck includes (a) a first coil disposed at least partially within the first region and comprising a first circuit, and (b) a second coil disposed at least partially within the second region and comprising a second circuit, heating the first region includes heating the first coil to the first temperature, and heating the second region includes heating the second coil to the second temperature. ### Claim 15 (depends on 14) The method of claim 14 wherein heating the first region and heating the second region are done via a controller, the controller being in electrical communication with the first coil via the first circuit and with the second coil via the second circuit. ### Claim 16 (depends on 13) The method of claim 13 wherein the multiple regions include a third region at least partially surrounding the second region, the method further comprising heating the third region to a third temperature different than at least one of the first temperature or the second temperature. ### Claim 17 (depends on 13) The method of claim 13, further comprising: positioning the chuck over a semiconductor device comprising a first substrate, a second substrate, and an adhesive between the first substrate and the second substrate; wherein— the first region is over a first area of the first substrate and the second region is over a second area of the first substrate, heating the first region of the chuck includes heating a first portion of the adhesive, via the first area, to a third temperature associated with the first temperature, and heating the second region of the chuck includes heating a second portion of the adhesive, via the second area, to a fourth temperature associated with the second temperature. ### Claim 18 (depends on 17) The method of claim 17, further comprising: curing the first portion of the adhesive at a first rate; and curing the second portion of the adhesive at a second rate different than the first rate. ### Claim 19 (depends on 17) The method of claim 17, further comprising: after heating the first region and the second region, measuring a thickness of the adhesive between the first substrate and the second substrate, and heating at least one of the first region or the second region based on the measured thickness. ### Claim 20 (depends on 17) The method of claim 17 wherein heating the first region and heating the second region is done via a controller, the method further comprising: inputting to the controller one or more parameter(s), wherein the parameters are based at least in part on characteristics of at least one of the first substrate, the adhesive, or the second substrate, wherein heating the first region is based on the inputted one or more parameter(s).