# US 10,770,416 B2 · Semiconductor package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,770,416 B2 - Document ID: US10770416B2 - Status: Granted - Kind: B2 - Application number: 16/282,980 - Filed: 2019-02-22 - Published: 2020-03-05 - Granted: 2020-09-08 - Earliest claimed: 2018-08-30 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Byung Ho Kim; Jae Hoon Choi; Joo Young Choi - Web page: https://patentgrep.com/patent/US10770416B2 ## CPC - H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs - H10W 72/90: Bond pads, in general - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/652: Cross-sectional shapes - H10W 70/655: Fan-out layouts - H10W 70/66: Conductive materials thereof - H10W 70/69: Insulating materials thereof - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/244: {relative to underlying supporting features, e.g. bond pads, RDLs or vias} - H10W 72/9413: {on encapsulations} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor package includes a connection member having first and second surfaces opposing each other and including at least one insulating layer and redistribution layer, the redistribution layer including a via penetrating through the insulating layer and a RDL pattern connected to the via while being located on an upper surface of the insulating layer; a semiconductor chip disposed on the first surface and including a connection pad connected to the redistribution layer; and an encapsulant disposed on the first surface and encapsulating the semiconductor chip. The redistribution layer includes a seed layer disposed on a surface of the insulating layer and a plating layer disposed on the seed layer. An interface between the insulating layer and a portion of the seed layer constituting the via includes a first uneven surface with a surface roughness of 30 nm or more. ## Claims ### Claim 1 A semiconductor package comprising: a connection member having a first surface and a second surface opposing each other, the connection member including at least one insulating layer formed of a photoimageable dielectric material and at least one redistribution layer, a first surface of the at least one insulating layer corresponding to the first surface of the connection member, the at least one redistribution layer including a via penetrating through the at least one insulating layer and a RDL pattern connected to the via while being disposed on a second surface of the at least one insulating layer opposing the first surface of the at least one insulating layer; a semiconductor chip disposed on the first surface of the connection member, and including a connection pad connected to the at least one redistribution layer; and an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip, wherein the at least one redistribution layer includes a seed layer disposed on the second surface of the at least one insulating layer, and a plating layer disposed on the seed layer, and the via has a shape in which a width adjacent to the second surface of the connection member is greater than a width adjacent to the first surface of the connection member, and wherein an interface between the at least one insulating layer and the seed layer constituting the via includes a first uneven surface with a surface roughness of 30 nm or more, and the first uneven surface extends to the entire second surface of the at least one insulating layer. ### Claim 2 (depends on 1) The semiconductor package of claim 1, wherein an interface between the seed layer and a portion of the plating layer, comprises a second uneven surface. ### Claim 3 (depends on 1) The semiconductor package of claim 1, wherein the first uneven surface has a surface roughness greater than a surface roughness of a portion of the seed layer on a surface of the via abutting the first surface of the at least one insulating layer. ### Claim 4 (depends on 1) The semiconductor package of claim 1, wherein a surface roughness of the first uneven surface is 50 nm or more. ### Claim 5 (depends on 1) The semiconductor package of claim 1, wherein the seed layer comprises at least one of titanium (Ti), nickel (Ni), chromium (Cr), and tungsten (W), and the plating layer comprises copper (Cu). ### Claim 6 (depends on 1) The semiconductor package of claim 1, wherein the at least one insulating layer comprises a plurality of insulating layers, and the at least one redistribution layer comprises a plurality of redistribution layers disposed on corresponding insulating layers. ### Claim 7 (depends on 6) The semiconductor package of claim 6, wherein each of the portions of the seed layer constituting vias of the plurality of redistribution layers respectively comprises an uneven surface at an interface with the corresponding insulating layers. ### Claim 8 (depends on 1) The semiconductor package of claim 1, further comprising a support frame disposed on the first surface of the connection member, and including a cavity accommodating the semiconductor chip. ### Claim 9 (depends on 8) The semiconductor package of claim 8, wherein the support frame comprises a wiring structure connecting an upper surface and a lower surface of the support frame to each other, wherein the wiring structure is electrically connected to the at least one redistribution layer. ### Claim 10 (depends on 1) The semiconductor package of claim 1, further comprising an electrical connection structure disposed on the second surface of the connection member, and an under bump metal (UBM) layer electrically connecting the electrical connection structure and the at least one redistribution layer to each other. ### Claim 11 A semiconductor package comprising: a connection member having a first surface and a second surface opposing each other, the connection member including an insulating layer formed of a photoimageable dielectric material and a redistribution layer, the redistribution layer including a via penetrating through the insulating layer; a semiconductor chip disposed on the first surface of the connection member and including a connection pad connected to the redistribution layer; and an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip, wherein the insulating layer includes an opening through which the via penetrates, and the redistribution layer includes a seed layer disposed on a side wall of the opening and on a first surface of the insulating layer, and a plating layer disposed on the seed layer, and the via has a shape in which a width adjacent to the second surface of the connection member is greater than a width adjacent to the first surface of the connection member, wherein the side wall of the opening and the first surface of the insulating layer have a surface roughness greater than a surface roughness of a portion of the seed layer located on a surface of the via opposing the first surface of the insulating layer, and wherein an interface between the insulating layer and the seed layer constituting the via includes a first uneven surface that extends to the entire first surface of the insulating layer. ### Claim 12 (depends on 11) The semiconductor package of claim 11, wherein the surface roughness of the side wall of the opening is 30 nm or more. ### Claim 13 A semiconductor package, comprising: a semiconductor chip having a connection pad on an active surface, disposed on a connection member such that the active surface directly contacts a first surface of the connection member; the connection member comprising an insulating layer formed of a photoimageable dielectric material and comprising a via hole penetrating the insulating layer, a redistribution layer electrically connected to the connection pad and disposed on a first surface of the insulating layer opposite the first surface of the connection member, the redistribution layer including a via disposed in the via hole, wherein the redistribution layer comprises a seed layer disposed on a sidewall of the via hole and the first surface of the insulating layer, and a plating layer disposed on the seed layer, and the via has a shape in which a width adjacent to a second surface of the connection member is greater than a width adjacent to the first surface of the connection member, and wherein an interface between the seed layer and the insulating layer and at an interface between the seed layer and the sidewall of the via hole form a first uneven surface having a surface roughness greater than that at an interface between the seed layer and a layer underlying the via hole on a second surface of the insulating layer opposing the first surface of the insulating layer, and the first uneven surface extends to the entire first surface of the insulating layer. ### Claim 14 (depends on 13) The semiconductor package of claim 13, wherein an interface between the seed layer and a portion of the plating layer, comprises a second uneven surface. ### Claim 15 (depends on 13) The semiconductor package of claim 13, wherein the surface roughness of the first uneven surface is about 30 nm or more. ### Claim 16 (depends on 13) The semiconductor package of claim 13, further comprising an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip. ### Claim 17 (depends on 13) The semiconductor package of claim 13, wherein the seed layer comprises at least one of titanium (Ti), nickel (Ni), chromium (Cr), and tungsten (W), and the plating layer comprises copper (Cu).