# US 10,770,408 B2 · Wiring board and semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,770,408 B2 - Document ID: US10770408B2 - Status: Granted - Kind: B2 - Application number: 16/393,056 - Filed: 2019-04-24 - Published: 2019-11-14 - Granted: 2020-09-08 - Earliest claimed: 2018-05-08 - Assignees: Shinko Electric Industries Co., Ltd. - Applicants: Shinko Electric Industries Co., Ltd. - Inventors: Masayuki Ogawa - Web page: https://patentgrep.com/patent/US10770408B2 ## CPC - H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/66: Conductive materials thereof - H10W 70/685: comprising multiple insulating layers - H10W 70/69: Insulating materials thereof - H10W 70/695: Organic materials - H10W 72/072: {of bump connectors} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 72/241: {Dispositions, e.g. layouts} - H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A wiring board includes an insulating layer, a plurality of pads formed on a surface of the insulating layer, and a chip mounting region defined on a surface of the wiring board formed with the plurality of pads. The plurality of pads are arranged in the chip mounting region. A cavity is formed in a surface of at least some of the plurality of pads. The cavity caves in, from the surface of the at least some of the plurality of pads, toward the insulating layer. The chip mounting region is segmented into a plurality of segmented regions, and a depth of the cavity is different for each of the plurality of segmented regions. ## Claims ### Claim 1 A wiring board comprising: an insulating layer; a plurality of pads formed on a surface of the insulating layer; and a chip mounting region defined on a surface of the wiring board formed with the plurality of pads, wherein the plurality of pads are arranged in the chip mounting region, wherein a cavity is formed in a surface of at least some of the plurality of pads, wherein the cavity caves in, from the surface of the at least some of the plurality of pads, toward the insulating layer, and wherein the chip mounting region is segmented into a plurality of segmented regions, and a depth of the cavity is different for each of the plurality of segmented regions. ### Claim 2 (depends on 1) The wiring board as claimed in claim 1, wherein the chip mounting region is warped so that a side of the plurality of pads forms a convex shape, the chip mounting region is segmented into the plurality of segmented regions from a center part toward an outer peripheral part of the chip mounting region, and a depth of the cavity formed in the pad that is arranged in the segmented region at the center part is deepest, and depths of cavities formed in the pads that are arranged in the segmented regions closer to an outer edge of the chip mounting region are shallower. ### Claim 3 (depends on 2) The wiring board as claimed in claim 2, wherein a difference between the depths of the cavities in adjacent segmented regions is smaller toward the outer edge of the chip mounting region. ### Claim 4 (depends on 2) The wiring board as claimed in claim 2, wherein widths of the plurality of segmented regions are wider toward the outer edge of the chip mounting region, except for an outermost segmented region of the chip mounting region. ### Claim 5 (depends on 4) The wiring board as claimed in claim 4, wherein a difference between the widths of the adjacent segmented regions is larger toward the outer edge of the chip mounting region, except for an outermost segmented region of the chip mounting region. ### Claim 6 (depends on 1) The wiring board as claimed in claim 1, wherein the chip mounting region is warped so that a side of the plurality of pads forms a concave shape, the chip mounting region is segmented into the plurality of segmented regions from a center part toward an outer peripheral part of the chip mounting region, and a depth of the cavity formed in the pad that is arranged in the segmented region at the center part is shallowest, and depths of cavities formed in the pads that are arranged in the segmented regions closer to an outer edge of the chip mounting region are deeper. ### Claim 7 (depends on 6) The wiring board as claimed in claim 6, wherein a difference between the depths of the cavities in adjacent segmented regions is smaller toward the outer edge of the chip mounting region. ### Claim 8 (depends on 6) The wiring board as claimed in claim 6, wherein widths of the plurality of segmented regions are wider toward the outer edge of the chip mounting region, except for an outermost segmented region of the chip mounting region. ### Claim 9 (depends on 8) The wiring board as claimed in claim 8, wherein a difference between the widths of the adjacent segmented regions is larger toward the outer edge of the chip mounting region, except for an outermost segmented region of the chip mounting region. ### Claim 10 (depends on 1) The wiring board as claimed in claim 1, wherein the plurality of pads include pads having no cavity formed therein. ### Claim 11 (depends on 1) A semiconductor device comprising: a wiring board according to claim 1; and a semiconductor chip, including a plurality of electrodes, mounted on the chip mounting region of the wiring board, wherein the plurality of pads of the wiring board respectively are electrically connected to the plurality of electrodes of the semiconductor chip, via solder bumps. ### Claim 12 (depends on 11) The semiconductor device as claimed in claim 11, wherein positions of vertexes of the solder bumps on the wiring board are approximately constant from a center part toward an outer peripheral part of the chip mounting region.