# US 10,770,394 B2 · Fan-out semiconductor packaging structure with antenna module and method making the same

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- Number: US 10,770,394 B2
- Document ID: US10770394B2
- Status: Granted
- Kind: B2
- Application number: 16/212,487
- Filed: 2018-12-06
- Published: 2019-06-13
- Granted: 2020-09-08
- Earliest claimed: 2017-12-07
- Assignees: SJ Semiconductor(Jiangyin) Corporation
- Applicants: SJ Semiconductor (Jiangyin) Corporation
- Inventors: Yenheng Chen; Chengtar Wu; Jangshen Lin; Chengchung Lin
- Web page: https://patentgrep.com/patent/US10770394B2

## CPC

- H10W 20/43: Layouts of interconnections
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/614: {the multiple chips being integrally enclosed}
- H10W 70/635: {Through-vias}
- H10W 70/685: comprising multiple insulating layers
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/90: Bond pads, in general
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 74/47: comprising organic materials, e.g. plastics or resins
- H10W 76/40: Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70)
- H10W 44/248: {for antennas}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/655: Fan-out layouts
- H10W 72/0198: {batch processes}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/9413: {on encapsulations}
- H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The present application provides a fan-out semiconductor packaging structure with an antenna module and a method making the same. The fan-out semiconductor packaging structure with the antenna module comprises: a semiconductor chip; a plastic packaging material layer enclosing a periphery of the semiconductor chip; a filling structure disposed in the plastic packaging material layer and disposed on the periphery of the semiconductor chip, a loss caused by the filling structure to an antenna signal is smaller than a loss caused by the plastic packaging material layer to an antenna signal; an antenna module disposed on the first surface of the plastic packaging material layer, an orthographic projection of the antenna module on the filling structure is disposed on the filling structure; a redistribution layer disposed on the second surface of the plastic packaging material layer; and a solder bump disposed on a surface of the redistribution layer.

## Claims

### Claim 1

A fan-out semiconductor packaging structure with an antenna module, comprising:
a semiconductor chip;
a plastic packaging material layer comprising a first surface and a second surface opposite to the first surface, wherein the plastic packaging material layer is patterned to enclose a periphery of the semiconductor chip and exposes a front surface of the semiconductor chip;
a filling structure patterned inside the plastic packaging material layer, wherein the filling structure is made of a material matching an antenna signal better than a material of the plastic packaging layer, such that a loss caused by the filling structure to the antenna signal is smaller than a loss caused by the plastic packaging material layer to the antenna signal;
wherein a top surface of the filling structure, the first surface of the plastic packaging material layer, and the front surface of the semiconductor chip are arranged in a same plane;
an antenna module disposed directly on the top surface of the filling structure;
a redistribution layer disposed on the second surface of the plastic packaging material layer, and electrically connecting with the semiconductor chip; and
a solder bump disposed on a surface of the redistribution layer, and electrically connecting with the redistribution layer.

### Claim 2 (depends on 1)

The fan-out semiconductor packaging structure with the antenna module according to claim 1, wherein the semiconductor chip is unpackaged and comprises:
a contact pad disposed on the front surface of the semiconductor chip connecting electrically with the unpackaged chip.

### Claim 3 (depends on 1)

The fan-out semiconductor packaging structure with the antenna module according to claim 1, wherein the filling structure comprises a glass filling structure, a silicon filling structure, a Roger 5880 filling structure, a polymer material filling structure or a composite material filling structure.

### Claim 4 (depends on 1)

The fan-out semiconductor packaging structure with the antenna module according to claim 1, wherein the filling structure is a ring structure, wherein the filling structure surround the periphery of the semiconductor chip, and has a space from the semiconductor chip.

### Claim 5 (depends on 4)

The fan-out semiconductor packaging structure with the antenna module according to claim 4, wherein the antenna module comprises a plurality of antenna units, wherein the plurality of antenna units are arranged with a space from each other along a circumferential direction of the filling structure on the first surface of the plastic packaging material layer.

### Claim 6 (depends on 5)

The fan-out semiconductor packaging structure with the antenna module according to claim 5, wherein the plurality of antenna units each is a block antenna or a spiral antenna.

### Claim 7 (depends on 4)

The fan-out semiconductor packaging structure with the antenna module according to claim 4, wherein the antenna module comprises a spiral antenna surrounding a circumferential direction of the filling structure.

### Claim 8 (depends on 1)

The fan-out semiconductor packaging structure with the antenna module according to claim 1, further comprising an interconnecting structure, wherein the interconnecting structure is disposed between the antenna module and the redistribution layer, and is electrically connected with the antenna module and the redistribution layer.

### Claim 9 (depends on 1)

The fan-out semiconductor packaging structure with the antenna module according to claim 1, wherein the redistribution layer comprises:
an insulating layer disposed on the second surface of the plastic packaging material layer;
at least one metal wire layer disposed in the insulating layer; and
an under-bump metal layer disposed on a surface of the insulating layer, and electrically connecting with the metal wire layer.

### Claim 10

A method for fabricating a fan-out semiconductor packaging structure with an antenna module, comprising the following steps:
1) providing a carrier and forming a peeling layer on a top surface of the carrier;
2) providing a semiconductor chip and mounting the semiconductor chip on a surface of the peeling layer with a front surface facing downward;
3) providing a filling structure on the surface of the peeling layer, wherein the filling structure is disposed at a periphery of the semiconductor chip;
4) forming a plastic packaging material layer on the surface of the peeling layer, wherein the plastic packaging material layer encloses the semiconductor chip and the filling structure; further planarizing the plastic packaging material layer to form a first surface and a second surface opposite to the first surface, wherein the first surface of the plastic packaging material layer, a top surface of the filling structure, and the front surface of the semiconductor chip are arranged in a same plane, and wherein the second surface of the plastic packaging material layer is in contact with the peeling layer; and wherein a material of the filling structure matches an antenna signal better than the plastic packaging material does such that a loss caused by the filling structures to the antenna signal is smaller than a loss caused by the plastic packaging material layer to the antenna signal;
5) removing the carrier and the peeling layer;
6) forming a redistribution layer on the second surface of the plastic packaging material layer, wherein the redistribution layer is electrically connected with the semiconductor chip;
7) forming an antenna module in direct contact with the top surface of the filling structure; and
8) forming a solder ball bump on a surface of the redistribution layer, wherein the solder ball bump is electrically connected with the redistribution layer.

### Claim 11 (depends on 10)

The method for fabricating the fan-out semiconductor packaging structure with the antenna module according to claim 10, wherein the filling structure provided in step 3) comprises a glass filling structure, a silicon filling structure, a Roger 5880 filling structure, a polymer material filling structure or a composite material filling structure.

### Claim 12 (depends on 10)

The method for fabricating the fan-out semiconductor packaging structure with the antenna module according to claim 10, wherein the filling structure provided in step 3) is a ring structure, wherein the filling structure surrounds the periphery of the semiconductor chip, and has a space from the semiconductor chip.

### Claim 13 (depends on 10)

The method for fabricating the fan-out semiconductor packaging structure with the antenna module according to claim 10, wherein, in step 7), forming the antenna module on the top surface of the filling structure comprises:
forming a plurality of antenna units arranged with a space from each other along a circumferential direction of the filling structure, wherein the plurality of antenna units are jointly used as the antenna module, and wherein the antenna units comprise block antennas or spiral antennas.

### Claim 14 (depends on 10)

The method for fabricating the fan-out semiconductor packaging structure with the antenna module according to claim 10, wherein, in step 7), forming the antenna module in direct contact with the top surface of the filling structure comprises:
forming a spiral antenna surrounding a circumferential direction of the filling structure as the antenna module.

### Claim 15 (depends on 10)

The method for fabricating the fan-out semiconductor packaging structure with the antenna module according to claim 10, further comprising the following step between step 6) and step 7): forming an interconnecting structure running through the filling structure and the plastic packaging material layer, wherein the interconnecting structure is electrically connected with the redistribution layer; and wherein the antenna formed in step 7) is electrically connected with the interconnecting structure.