# US 10,770,370 B2 · Electronic device and heat dissipating sheet

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- Number: US 10,770,370 B2
- Document ID: US10770370B2
- Status: Granted
- Kind: B2
- Application number: 16/455,260
- Filed: 2019-06-27
- Published: 2019-10-17
- Granted: 2020-09-08
- Earliest claimed: 2016-08-25
- Assignees: Fujitsu Limited
- Applicants: Fujitsu Limited
- Inventors: Shinichi Hirose; Daiyu Kondo
- Web page: https://patentgrep.com/patent/US10770370B2

## CPC

- H10W 40/251: {Organics}
- F28F 13/18: by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F 21/02: of carbon, e.g. graphite
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 40/25: characterised by their materials
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- B82Y 30/00: Nanotechnology for materials or surface science, e.g. nanocomposites
- F28F 2013/006: {Heat conductive materials}
- F28F 2255/20: with nanostructures
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 76/13: Containers comprising a conductive base serving as an interconnection
- H10W 76/15: Containers comprising an insulating or insulated base
- H10W 76/60: Seals
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16)
- B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES

## Abstract

An electronic device includes a component, a resin film formed to the component, and a plurality of carbon nanotubes whose end portions pass through the resin film and are in contact with the component, wherein a first portion of each of the carbon nanotubes is covered with the resin film, the first portion has a first length which is greater than a thickness of the resin film, and an intermediate portion of each of the carbon nanotubes other than the first portion is uncovered with and exposed from the resin.

## Claims

### Claim 1

An electronic device comprising:
a component;
a resin film formed to the component; and
a plurality of carbon nanotubes whose end portions pass through the resin film and are in contact with the component,
wherein
a first portion of each of the carbon nanotubes is covered with the resin film,
the first portion has a first length which is greater than a thickness of the resin film, and
an intermediate portion of each of the carbon nanotubes other than the first portion is uncovered with and exposed from the resin film.

### Claim 2 (depends on 1)

The electronic device according to claim 1, wherein the component comprises first and second components that are provided to face each other, and the resin film comprises first and second resin films, the first resin film being formed to the first component, the second resin film being formed to the second component, and each of the carbon nanotubes extending from the first component to the second component.

### Claim 3 (depends on 1)

The electronic device according to claim 1, wherein the thickness of the resin film is greater than or equal to 2 μm and less than or equal to 10 μm.

### Claim 4

A heat dissipating sheet comprising:
a resin film formed to a component; and
a plurality of carbon nanotubes whose end portions pass through the resin film and are in contact with the component,
wherein
a first portion of each of the carbon nanotubes is covered with the resin film,
the first portion has a first length which is greater than a thickness of the resin film, and
an intermediate portion of each of the carbon nanotubes other than the first portion is uncovered with and exposed from the resin film.

### Claim 5 (depends on 4)

The heat dissipating sheet according to claim 4, wherein the resin film comprises first and second resin films that are provided to face each other, one of the end portions of the carbon nanotubes passing through the first resin film, and another of the end portions of the carbon nanotubes passing through the second resin film.