# US 10,770,363 B2 · Power switching system for ESC with array of thermal control elements > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,770,363 B2 - Document ID: US10770363B2 - Status: Granted - Kind: B2 - Application number: 16/056,967 - Filed: 2018-08-07 - Published: 2018-12-27 - Granted: 2020-09-08 - Earliest claimed: 2012-11-30 - Assignees: Lam Research Corporation - Applicants: Lam Research Corporation - Inventors: Keith William Gaff; Tom Anderson; Keith Comendant; Ralph Jan-Pin Lu; Paul Robertson; Eric A. Pape; Neil Benjamin - Web page: https://patentgrep.com/patent/US10770363B2 ## CPC - H10P 74/207: {Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics} - H10P 72/0432: {mainly by conduction} - H10P 72/0434: {mainly by convection} - H10P 72/0602: {Temperature monitoring} - H10P 72/72: using electrostatic chucks - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor substrate support for supporting a semiconductor substrate in a plasma processing chamber includes a heater array comprising thermal control elements operable to tune a spatial temperature profile on the semiconductor substrate, the thermal control elements defining heater zones each of which is powered by two or more power supply lines and two or more power return lines wherein each power supply line is connected to at least two of the heater zones and each power return line is connected to at least two of the heater zones. A power distribution circuit is mated to a baseplate of the substrate support, the power distribution circuit being connected to each power supply line and power return line of the heater array. A switching device is connected to the power distribution circuit to independently provide time-averaged power to each of the heater zones by time divisional multiplexing of a plurality of switches. ## Claims ### Claim 1 A substrate support for supporting a substrate in a plasma processing chamber, comprising: a heater array comprising thermal control elements to control a temperature of the substrate, the thermal control elements configured to receive power via two or more power supply lines and two or more power return lines, wherein each power supply line is connected to at least two of the thermal control elements and each power return line is connected to at least two of the thermal control elements; a power distribution circuit mated to a baseplate of the substrate support, the power distribution circuit connected to each power supply line and power return line of the heater array, wherein the power distribution circuit is formed on a first circuit board having a conductive common plane that is attached to the baseplate and that is at an electrical potential of the baseplate; a power switching device connected to the power distribution circuit to independently supply power to each one of the thermal control elements via one of the power supply lines and one of the power return lines; and a capacitor connected between each power supply line and the baseplate and between each power return line and the baseplate to shunt RF between the baseplate and the heater array so that the baseplate and the heater array are at a same RF potential, wherein one end of each capacitor is connected to a power supply line or a power return line and another end of each capacitor is connected to the conductive common plane that is attached to the baseplate. ### Claim 2 (depends on 1) The substrate support of claim 1 further comprising a diode serially connected between each of the thermal control elements and the power supply lines or between each of the thermal control elements and the power return lines. ### Claim 3 (depends on 1) The substrate support of claim 1 wherein the power switching device calculates a duty cycle for each of the thermal control elements based on a setpoint temperature for each of the thermal control elements. ### Claim 4 (depends on 1) The substrate support of claim 1 wherein the power switching device provides time-averaged power to each of the thermal control elements by time division multiplexing of a plurality of switches. ### Claim 5 (depends on 1) The substrate support of claim 1 wherein the power switching device is formed on the first circuit board. ### Claim 6 (depends on 1) The substrate support of claim 1 comprising an RF filter configured to receive power from a source and provide conditioned power to the heater array via the power switching device and the power distribution circuit. ### Claim 7 (depends on 1) The substrate support of claim 1 further comprising a facilities plate attached to the baseplate of the substrate support such that at least the power distribution circuit is located in an electrostatically-shielded volume between the baseplate and the facilities plate. ### Claim 8 (depends on 7) The substrate support of claim 7 further comprising an electrically conductive gasket between outer peripheries of the baseplate and the facilities plate. ### Claim 9 (depends on 7) The substrate support of claim 7 wherein the electrostatically-shielded volume between the baseplate and the facilities plate is a first electrostatically-shielded volume, the substrate support further comprising: a metal cage attached to the facilities plate such that a second electrostatically-shielded volume is formed between the metal cage and the facilities plate. ### Claim 10 (depends on 9) The substrate support of claim 9 wherein the second electrostatically-shielded volume is below the first electrostatically-shielded volume. ### Claim 11 (depends on 10) The substrate support of claim 10 wherein the power switching device is formed on a second circuit board, the second circuit board is DC isolated from ground and having a conductive common plane that is floated from ground and electrically connected to the facilities plate. ### Claim 12 (depends on 11) The substrate support of claim 11 wherein the second circuit board is attached to a lower surface of the facilities plate, such that the second circuit board is within the second electrostatically-shielded volume between the metal cage and the facilities plate. ### Claim 13 (depends on 7) The substrate support of claim 7 wherein the power switching device is formed on a second circuit board, the second circuit board having a conductive common plane that is attached to the facilities plate and is at a DC potential of the facilities plate. ### Claim 14 (depends on 13) The substrate support of claim 13 wherein the second circuit board of the power switching device is attached to a first surface of the facilities plate and comprises a plurality of switches on at least one surface of the second circuit board, each of the switches extending between the first surface of the facilities plate and a second surface of the facilities plate, and wherein at a point of termination on the second surface of the facilities plate, the switches are sealed from RF with a sealing member. ### Claim 15 (depends on 13) The substrate support of claim 13 wherein each of the first and second circuit boards comprises plural signal wiring or traces and filtering elements connected between each trace and respective conductive common voltage planes. ### Claim 16 (depends on 13) The substrate support of claim 13 wherein the second circuit board is attached to an upper surface of the facilities plate and in a recess of the facilities plate such that the second circuit board is within the electrostatically-shielded volume between the baseplate and the facilities plate. ### Claim 17 (depends on 16) The substrate of claim 16 wherein the first circuit board is attached to a lower surface of the baseplate and in a recess of the baseplate. ### Claim 18 (depends on 17) The substrate of claim 17 wherein the recesses of the baseplate and the facilities plate establish an RF shielded volume such that when RF is applied to the facilities plate, RF current flows around the first and second circuit boards along outer surfaces of the facilities plate and the baseplate. ### Claim 19 (depends on 1) The substrate support of claim 1 wherein the power distribution circuit includes memory that stores at least one of configuration data, identification data, operating data of the power switching device. ### Claim 20 (depends on 1) The substrate support of claim 1 further comprising a communication module that provides wireless communication between the power switching device and a processor external to the plasma processing chamber, wherein the power switching device is configured to encrypt and decrypt data signals communicated with the external processor.