# US 10,770,331 B2 · Semiconductor wafer device and manufacturing method thereof

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- Number: US 10,770,331 B2
- Document ID: US10770331B2
- Status: Granted
- Kind: B2
- Application number: 16/105,893
- Filed: 2018-08-20
- Published: 2018-12-13
- Granted: 2020-09-08
- Earliest claimed: 2013-10-09
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company Ltd.
- Inventors: Bor-Ping Jang; Chien Ling Hwang; Hsin-Hung Liao; Yeong-Jyh Lin
- Web page: https://patentgrep.com/patent/US10770331B2

## CPC

- H10P 72/74: {using temporarily an auxiliary support}
- B23K 26/364: for making a groove or trench, e.g. for scribing a break initiation groove
- B23K 26/40: taking account of the properties of the material involved
- B23K 26/402: involving non-metallic material, e.g. isolators
- H10P 54/00: Cutting or separating of wafers, substrates or parts of devices
- H10W 46/00: Marks applied to devices, e.g. for alignment or identification
- B23K 2103/50: {Inorganic materials other than metals or composite materials}
- H10P 72/7416: {used during dicing or grinding}
- Y02P 80/30: Reducing waste in manufacturing processes; Calculations of released waste quantities
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

A semiconductor device includes a carrier having a first central axis extending along a first direction and a second central axis extending along a second direction, a plurality of dies disposed on a surface of the carrier, and a plurality of scribing lines separating the plurality of dies from each other. The plurality of scribing lines include a plurality of continuous lines along the first direction and a plurality of discontinuous lines along the second direction, at least one of the plurality of continuous lines overlaps the first central axis, at least one of the plurality of discontinuous lines overlaps the second central axis. The plurality of dies are symmetrically arranged on the carrier about the first central axis and the second central axis.

## Claims

### Claim 1

A method for manufacturing a semiconductor device, comprising:
providing a carrier;
defining a plurality of die regions over the carrier along a first direction and a second direction to arrange the plurality of die regions in a plurality of rows and a plurality of columns, wherein each of the die regions has a first side parallel to the first direction and a second side parallel to the second direction;
identifying a row when a shortest distance between an edge of the carrier and the second side of a die region disposed at an end of the row is larger than a half of a length of the first side;
shifting the row along the first direction in a predetermined distance;
disposing an additional die region at an end of the shifted row; and
forming a die in each of the plurality of die regions and the additional die region.

### Claim 2 (depends on 1)

The method of claim 1, wherein the plurality of die regions and the additional die region have similar dimension.

### Claim 3 (depends on 1)

The method of claim 1, wherein a shortest distance between an edge of the carrier and a corner of the additional die region is substantially equal to or smaller than a half of a length of the first side of the die region.

### Claim 4 (depends on 1)

The method of claim 1, wherein the first direction is substantially orthogonal to the second direction.

### Claim 5 (depends on 1)

The method of claim 1, wherein the plurality of die regions are separated from each other by a plurality of scribing lines.

### Claim 6 (depends on 5)

The method of claim 5, wherein the plurality of scribing lines include a plurality of continuous lines along the first direction and a plurality of continuous lines along the second direction before the shifting of the row.

### Claim 7 (depends on 6)

The method of claim 6, wherein the plurality of scribing lines include a plurality of discontinuous lines along the second direction after the shifting of the row.

### Claim 8 (depends on 7)

The method of claim 7, wherein at least one of the plurality of continuous lines overlaps a first central axis of the carrier, at least one of the plurality of discontinuous lines overlaps a second central axis of the carrier, and the plurality of dies are symmetrically arranged on the carrier about the first central axis and the second central axis.

### Claim 9

A method for manufacturing a semiconductor device, comprising:
providing a carrier;
defining a plurality of die regions over the carrier along a first direction to arrange the plurality of die regions in a plurality of rows, wherein each of the plurality of rows has an edge die region having a corner contacting an edge of the carrier;
shifting each of the plurality of rows along the first direction in a predetermined distance, wherein all of the die regions are within the carrier after the shifting of each of the plurality of rows, and each of the edge die region is entirely within the carrier after the shifting of each of the plurality of rows; and
forming a die in each of the plurality of die regions.

### Claim 10 (depends on 9)

The method of claim 9, wherein a shortest distance between the edge of the carrier and the corner of the edge die region is greater than 0 and substantially equal to or smaller than a half of a length of the die region after the shifting of each of the plurality of rows.

### Claim 11 (depends on 9)

The method of claim 9, wherein the plurality of die regions are separated from each other by a plurality of scribing lines, and the plurality of scribing lines include a plurality of continuous lines along the first direction and a plurality of discontinuous lines along a second direction.

### Claim 12 (depends on 11)

The method of claim 11, wherein the first direction is substantially orthogonal to the second direction.

### Claim 13 (depends on 11)

The method of claim 11, wherein at least one of the plurality of continuous lines overlaps a first central horizontal axis of the carrier, at least one of the plurality of discontinuous lines overlaps a second central vertical axis of the carrier, and the plurality of dies are symmetrically arranged on the carrier about the first central axis and the second central axis.

### Claim 14 (depends on 13)

The method of claim 13, wherein the plurality of rows are symmetrical about the first central axis and the second central axis.

### Claim 15

A method for manufacturing a semiconductor device, comprising:
providing a carrier;
defining a plurality of die regions over the carrier along a first direction and a second direction to arrange the plurality of die regions in a plurality of rows and a plurality of columns, wherein each of the die regions has a first side parallel to the first direction and a second side parallel to the second direction,
identifying a row when a shortest distance between an edge of the carrier and the second side of a die region disposed at an end of the row is larger than a half of a length of the first side;
shifting the row along the first direction in a predetermined distance;
disposing an additional die region at an end of the shifted row; and
forming a die in each of the plurality of die regions and the additional die region, wherein the die regions are separated from each other by a plurality of first continuous lines extending along the first direction and a plurality of second continuous lines extending along the second direction before the identifying of the row, and the shifting of the row breaks the plurality of second continuous lines to form a plurality of discontinuous lines along the second direction.

### Claim 16 (depends on 15)

The method of claim 15, wherein the plurality of die regions and the additional die region have similar dimension.

### Claim 17 (depends on 15)

The method of claim 15, a shortest distance between the edge of the carrier and a corner of the additional die region is substantially equal to or smaller than a half of the length of the first side of the die region.

### Claim 18 (depends on 15)

The method of claim 15, wherein the plurality of first continuous lines and the plurality of discontinuous lines form a plurality of scribing lines.

### Claim 19 (depends on 15)

The method of claim 15, wherein at least one of the plurality of first continuous lines overlaps a first central axis of the carrier, at least one of the plurality of discontinuous lines overlaps a second central axis of the carrier, and the plurality of dies are symmetrically arranged on the carrier about the first central axis and the second central axis.

### Claim 20 (depends on 15)

The method of claim 15, wherein the first direction is substantially orthogonal to the second direction.