# US 10,770,323 B2 · Stackable substrate carriers > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,770,323 B2 - Document ID: US10770323B2 - Status: Granted - Kind: B2 - Application number: 13/028,180 - Filed: 2011-02-15 - Published: 2011-08-18 - Granted: 2020-09-08 - Earliest claimed: 2010-02-18 - Assignees: Brooks Automation, Inc. - Applicants: Lutz Rebstock - Inventors: Lutz Rebstock - Web page: https://patentgrep.com/patent/US10770323B2 ## CPC - H10P 72/15: {Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls} - H10P 72/13: {Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract In an embodiment, the present invention discloses a stackable substrate carrier for scalably storing, transporting or processing multiple substrates. The present substrate carriers can be stacked side-by-side by an attaching mechanism, forming an integrated carrier with double, triple or multiple capacity. The attaching mechanism comprises a locking mechanism to secure the substrate carriers together, engaged by mating two substrate carriers, together with an additional rotating or translating action of the two substrate carriers. Alternatively, the locking mechanism can be engaged by pressing two substrate carriers against each other, using friction to keep the carriers together. Other locking mechanism can also be used, such as hooks or latches. ## Claims ### Claim 1 A side-by-side stackable carrier for a plurality of substrates, wherein the side-by-side stackable carrier is configured for use in a semiconductor fabrication facility, the side-by-side stackable carrier comprising: two side structures comprising slot marks for holding substrates; two end structures securing to the side structures, at least one of the end structures comprising a bidirectional attaching mechanism including mating features configured to mate with an end structure of another side-by-side stackable carrier such that the bidirectional attaching mechanism engages sequentially in a first direction and in a subsequent second direction arranged at an angle relative to the first direction, wherein the sequential engagement in the second direction subsequent to the engagement in the first direction locks engagement between the mating features, wherein the bidirectional attaching mechanisms of two mated end structures are configured to be mated by themselves without an additional component. ### Claim 2 (depends on 1) A carrier as in claim 1 wherein the bidirectional attaching mechanisms are mating/mated symmetrically to enable mating of two carriers having identical end structures. ### Claim 3 (depends on 2) A carrier as in claim 2 wherein the two carriers have the bidirectional attaching mechanism at a same end so that one carrier is rotated 180 degrees before mating with the other carrier. ### Claim 4 (depends on 1) A carrier as in claim 1 wherein the end structure opposite the end structure having the bidirectional attaching mechanism does not have any mating structure, so that only two carriers can be mated to each other. ### Claim 5 (depends on 1) A carrier as in claim 1 wherein the end structure opposite the end structure having the bidirectional attaching mechanism also has an attaching mechanism, so that more than two carriers can be mated to each other. ### Claim 6 (depends on 1) A carrier as in claim 1 wherein the bidirectional attaching mechanism comprises pins and matching holes. ### Claim 7 (depends on 1) A carrier as in claim 1 wherein the bidirectional attaching mechanism comprises a holding mechanism for slide locking with the end structure of another side-by-side stackable carrier. ### Claim 8 (depends on 7) A carrier as in claim 7 wherein the holding mechanism for slide locking comprises one of a rotation, a vertical slide, and a horizontal slide. ### Claim 9 (depends on 1) A carrier as in claim 1 wherein the bidirectional attaching mechanism comprises a locking mechanism to prevent disengaging. ### Claim 10 (depends on 1) A carrier as in claim 1 wherein the side structure comprises an L shape having one side partially covering a side of the carrier and one side partially covering a bottom of the carrier. ### Claim 11 (depends on 1) A carrier as in claim 1 wherein the side structures only cover the sides of the carrier, and the carrier further comprises a bottom structure for supporting the substrates at a bottom of the carrier. ### Claim 12 (depends on 11) A carrier as in claim 11 wherein the bottom structure comprises one or more rods having slot marks. ### Claim 13 (depends on 1) A carrier as in claim 1 wherein the side structures comprise one or more rods having slot marks. ### Claim 14 A side-stacked composite carrier comprising two or more side-by-side stackable carriers mated together, each side-by-side stackable carrier comprising: two side structures comprising slot marks for holding substrates; two end structures secured to the side structures, one of the end structures comprising an attaching mechanism to mate with another end structure, wherein at least two side-by-side stackable carriers comprises side structures having different numbers of slot marks, each slot mark having a predetermined size common for each slot mark of the different number of slot marks, the different numbers of slot marks each defining different capacities of each corresponding at least two side-by-side stackable carriers, for holding different numbers of substrates so that the respective capacity of one of the at least two side-by-side stackable carriers corresponds to a substrate batch size within a semiconductor fabrication process and another respective capacity of another of the at least two side-by-side stackable carriers includes another different capacity corresponding to a different substrate batch size within the semiconductor fabrication process that is common to both the substrate batch size and the different substrate batch size. ### Claim 15 (depends on 14) A carrier as in claim 14 wherein the side-by-side stackable carriers have identical end structures. ### Claim 16 A side-by-side stackable carrier is configured for use in a semiconductor fabrication facility, the side-by-side stackable carrier comprising: two side structures comprising slot marks for holding substrates; two end structures securing to the side structures, at least one of the end structures comprising a bidirectional attaching mechanism including mating features configured to mate with an end structure of another side-by-side stackable carrier such that the bidirectional attaching mechanism engages sequentially in a first direction and in a subsequent second direction arranged at an angle relative to the first direction, wherein the sequential engagement in the second direction subsequent to the engagement in the first direction locks engagement between the mating features, wherein the bidirectional attaching mechanism comprises a protruding portion and a recess portion, wherein the protruding portion is configured for slide locking with the recess portion after inserting the protruding portion into the recess portion. ### Claim 17 (depends on 16) A carrier as in claim 16 wherein the slide locking comprises one of a rotation, a vertical slide, and a horizontal slide. ### Claim 18 (depends on 16) A carrier as in claim 16 wherein the side structure comprises an L shape having one side partially covering a side of the carrier and one side partially covering a bottom of the carrier. ### Claim 19 (depends on 16) A carrier as in claim 16 further comprising a bottom structure for supporting the substrates at a bottom of the carrier, wherein the bottom structure comprises one or more rods having slot marks. ### Claim 20 (depends on 16) A carrier as in claim 16 wherein the side structures comprise one or more rods having slot marks.