# US 10,770,301 B2 · Planarization processing device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,770,301 B2 - Document ID: US10770301B2 - Status: Granted - Kind: B2 - Application number: 15/751,699 - Filed: 2017-03-10 - Published: 2018-09-27 - Granted: 2020-09-08 - Earliest claimed: 2016-03-11 - Assignees: Toho Engineering Kabushiki Kaisha - Applicants: Toho Engineering Co., Ltd. - Inventors: Tatsutoshi Suzuki; Eisuke Suzuki; Daisuke Suzuki - Web page: https://patentgrep.com/patent/US10770301B2 ## CPC - H10P 52/402: {of semiconductor materials} - B24B 1/00: Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes - B24B 1/04: subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency (involving oscillating or vibrating containers B24B31/06; superfinishing surfaces on work, e.g. by means of abrading blocks reciprocating with high frequency, B24B35/00) - B24B 37/07: characterised by the movement of the work or lapping tool - B24B 37/34: Accessories - B24B 41/007: {Weight compensation; Temperature compensation; Vibration damping} - H10P 50/00: Etching of wafers, substrates or parts of devices - H10P 95/04: {Planarisation of conductive or resistive materials} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ## Abstract A planarization processing device for polishing a substrate, e.g., a semiconductor wafer, includes two planarization processing sections (SP1, SP2) that each include a holder (62) for holding a workpiece (W), a drive motor (71) that rotates the holder (62), a support plate (4) holds a pad (5), a linear guide (3) that guides reciprocal movement of the support plate (4) in a direction parallel to the surface of the pad (5), and a drive cylinder (72) that advances the holder (62) or the support plate (4) in a direction that intersects the surface of the workpiece W or the pad (5) to cause the opposing surfaces of the workpiece and the pad (5) to be at least proximal to each other. A primary driver (PD) causes the support plates (4) of the planarization processing sections (SP1, SP2) to reciprocate along the same straight line in opposite phases. ## Claims ### Claim 1 A planarization processing system comprising: a first planarization processing unit that includes: a first holding means that holds one of a workpiece and a catalyst body having a catalyst layer at least on a surface thereof, and a second holding means that holds the other of the workpiece and the catalyst body and brings the surface thereof into contact with or proximal to a surface of the one of the workpiece and the catalyst body; a first guide, along which the second holding means is movable in a direction parallel to the other surface of the workpiece or the catalyst body at least by an amount that makes possible planarization based on a catalytic reaction; a primary driver that moves the second holding means along the first guide to planarize the workpiece; and a counterweight operably connected to the primary driver and movable by the primary driver in a manner that counteracts reaction forces produced by the movement of the second holding means in such a way that vibrations caused by the movement of the second holding means are attenuated. ### Claim 2 (depends on 1) The planarization processing system according to claim 1, wherein: the first planarization processing unit further includes: a first drive means that rotates the first holding means about a rotational axis that intersects the surface of the one of the workpiece and the catalyst body. ### Claim 3 (depends on 2) The planarization processing system according to claim 2, wherein: the first planarization processing unit further includes: a second drive means that advances the first holding means or the second holding means in the direction that intersects the surface of the workpiece or the catalyst body and causes the surface of the workpiece and the surface of the catalyst body to be in contact or in proximity with each other. ### Claim 4 (depends on 3) The planarization processing system according to claim 3, wherein two or more of the second holding means and the counterweight are arranged at intervals in a circumferential direction around a shaft body of the primary driver, and the primary driver causes the second holding means and the counterweight to simultaneously reciprocate inward and outward. ### Claim 5 (depends on 4) The planarization processing system according to claim 4, wherein the primary driver is configured to move the second holding means and the counterweight in a single plane in opposite phases in opposite directions. ### Claim 6 (depends on 5) The planarization processing system according to claim 5, wherein the primary driver reciprocally is configured to move the second holding means and the counterweight along a single straight line in opposite phases in opposite directions. ### Claim 7 (depends on 6) The planarization processing system according to claim 6, wherein the counterweight comprises a second planarization processing unit configured to perform a planarization processing function. ### Claim 8 (depends on 1) The planarization processing system according to claim 1, wherein the primary driver includes a drive motor and a pair of shaft sections that are provided at symmetric positions spaced from each other by the same amount in a radial direction from an axis of an output shaft of the drive motor and that are configured to rotationally move in accordance with rotation of the output shaft, and the second holding means and the counterweight are respectively caused to reciprocate in synchrony with the pair of shaft sections. ### Claim 9 (depends on 8) The planarization processing system according to claim 8, wherein: the second planarization unit comprises: a first holder that holds one of a second workpiece and a second catalyst body having a catalyst layer at least on a surface thereof, and a second holder that holds the other of the second workpiece and the second catalyst body and brings the surface thereof into contact with or proximal to a surface of the one of the second workpiece and the second catalyst body, and the planarization processing system further comprises: a second guide, along which the second holder is movable in the direction parallel to the other surface of the second workpiece or the second catalyst body at least by an amount that makes possible planarization based on a catalytic reaction. ### Claim 10 (depends on 9) The planarization processing system according to claim 9, wherein the first and second planarization units have the same weight. ### Claim 11 (depends on 10) The planarization processing system according to claim 10, wherein the first guide and the second guide each comprise: a pair of rails; and sliders that are linearly reciprocally movable along the rails, the second holding means being attached the sliders of the first guide and the second holder being attached to the sliders of the second guide. ### Claim 12 (depends on 11) The planarization processing system according to claim 11, wherein: the catalyst body is in the form of a pad provided on an inner bottom surface of a container adapted to store a liquid or a gas, the second holding means includes a support plate and the container is placed on the support plate. ### Claim 13 (depends on 1) The planarization processing system according to claim 1, wherein the first guide comprises: rails; and a pair of sliders that are linearly reciprocally movable along the rails, the second holding means being attached to the sliders. ### Claim 14 (depends on 1) The planarization processing system according to claim 1, wherein two or more of the second holding means and the counterweight are arranged at intervals in a circumferential direction around a shaft body of the primary driver, and the primary driver causes the two or more of the second holding means and the counterweight to simultaneously reciprocate inward and outward. ### Claim 15 (depends on 1) The planarization processing system according to claim 1, wherein the primary driver is configured to move the second holding means and the counterweight in a single plane in opposite phases in opposite directions. ### Claim 16 (depends on 1) The planarization processing system according to claim 1, wherein the primary driver is configured to reciprocally move the second holding means and the counterweight along a single straight line in opposite phases in opposite directions. ### Claim 17 (depends on 1) The planarization processing system according to claim 1, wherein the counterweight comprises a second planarization processing unit configured to planarize a second workpiece. ### Claim 18 A wafer planarizing system comprising: a first planarization processing unit that includes: a first holder configured to hold one of a wafer and a pad having a catalyst layer, and a second holder configured to hold the other of the wafer and the pad, a first guide configured to support non-rotational movement of the second holder in a direction parallel to contacting surface of the wafer and pad at least by an amount that makes possible planarization based on a catalytic reaction; a counterweight having at least substantially the same weight as the first planarization processing unit; and a primary driver configured to move the second holder and the counterweight such that reaction forces caused by movement of the second holder are at least substantially cancelled by opposite reaction forces caused by movement of the counterweight. ### Claim 19 (depends on 18) The wafer planarizing system according to claim 18, wherein the primary driver is configured to linearly reciprocally move the second holder and the counterweight along a single straight line in opposite phases in opposite directions. ### Claim 20 (depends on 19) The wafer planarizing system according to claim 19, wherein the counterweight is a second planarization processing unit that includes: a first holder configured to hold one of a second wafer and a second pad having a catalyst layer, and a second holder configured to hold the other of the second wafer and the second pad, and wherein a second guide is configured to support non-rotational movement of the second holder of the second planarization processing unit in a direction parallel to contacting surface of the second wafer and second pad at least by an amount that makes possible planarization based on a catalytic reaction. ### Claim 21 (depends on 18) The wafer planarizing system according to claim 18, wherein the primary driver comprises a driver motor and a drive shaft configured to be rotated by the drive motor, the drive shaft having a first shaft section and a second shaft section spaced from each other by a same amount in a radial direction from an axis of the drive shaft, wherein the second holder is connected to and moveable by the first shaft section, and wherein the counterweight is connected to and movable by the second shaft section out of phase relative to the second holder.