# US 10,770,298 B2 · Automatic inspection device and method of laser processing equipment > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,770,298 B2 - Document ID: US10770298B2 - Status: Granted - Kind: B2 - Application number: 15/757,500 - Filed: 2016-08-17 - Published: 2018-08-30 - Granted: 2020-09-08 - Earliest claimed: 2015-10-19 - Assignees: Eo Technics Co., Ltd. - Applicants: Eo Technics Co., Ltd. - Inventors: Hak Yong Lee; Sang Young Park; Nack Hoon Kim; Ho Chul Choi - Web page: https://patentgrep.com/patent/US10770298B2 ## CPC - H10P 34/42: with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) - B23K 26/0006: {taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence)} - B23K 26/032: {using optical means} - B23K 26/0622: by shaping pulses - B23K 26/0624: {using ultrashort pulses, i.e. pulses of 1 ns or less} - B23K 26/064: by means of optical elements, e.g. lenses, mirrors or prisms - B23K 26/082: Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head - B23K 26/362: Laser etching - B23K 26/40: taking account of the properties of the material involved - B23K 26/53: for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks - B23K 31/125: {Weld quality monitoring} - H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects} - H10P 74/235: {comprising optical enhancement of defects or not-directly-visible states} - H10P 74/27: {Structural arrangements therefor} - B23K 2101/40: Semiconductor devices - B23K 2103/50: {Inorganic materials other than metals or composite materials} - B23K 2103/56: {being semiconducting} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM ## Abstract Provided is an automatic inspection device and method for inspecting processing quality of laser processing equipment that forms a modified area by irradiating a laser beam into an object to be processed. The automatic inspection device includes: an image film coated on a bottom surface of the object to be processed; an image sensing unit configured to detect a damage image of the object to be processed formed on the image film through irradiation of the laser beam; and an image processing unit configured to process the damage image detected by the image sensing unit. ## Claims ### Claim 1 An automatic inspection method for inspecting processing quality of laser processing equipment that forms a modified area by irradiating a laser beam into an object to be processed, the automatic inspection method comprising: preparing the object to be processed on which an image film is coated; performing a processing operation by irradiating the laser beam into the object to be processed by using the laser processing equipment; detecting a damage image of the object to be processed formed on the image film through irradiation of the laser beam; and processing the damage image of the object to be processed. ### Claim 2 (depends on 1) The automatic inspection method of claim 1, wherein the image film is coated on a bottom surface of the object to be processed, and the laser beam is incident from a top surface of the object to be processed to form the modified area in the object to be processed. ### Claim 3 (depends on 1) The automatic inspection method of claim 1, wherein the image film comprises a material reactive with the laser beam. ### Claim 4 (depends on 3) The automatic inspection method of claim 3, wherein the damage image of the object to be processed is formed when the laser beam is splashed around the modified area and reacts with the image film. ### Claim 5 (depends on 1) The automatic inspection method of claim 1, wherein the damage image of the object to be processed formed on the image film is detected by an image sensing unit. ### Claim 6 (depends on 5) The automatic inspection method of claim 5, wherein the image sensing unit is configured to detect the damage image formed on the image film by using a sensing beam transmitted through the object to be processed. ### Claim 7 (depends on 5) The automatic inspection method of claim 5, wherein the image sensing unit comprises a camera used to align the laser processing equipment and the object to be processed. ### Claim 8 (depends on 5) The automatic inspection method of claim 5, wherein the damage image of the object to be processed is processed by an image processing unit. ### Claim 9 An automatic inspection method for inspecting processing quality of laser processing equipment that forms a modified area by irradiating a laser beam into an object to be processed, the automatic inspection method comprising: preparing the object to be processed on which an image film is coated; performing a processing operation by irradiating the laser beam into the object to be processed by using the laser processing equipment; detecting a damage image of the object to be processed formed on the image film through irradiation of the laser beam; and processing the damage image of the object to be processed, wherein the damage image of the object to be processed is processed by an image processing unit, and wherein the processing of the damage image of the object to be processed comprises: converting the damage image of the object to be processed detected by the image sensing unit into a binary image; removing a processing line image from the binary image; and extracting position information of damage points indicating points at which the object to be processed is damaged from the binary image from which the processing line image is removed. ### Claim 10 (depends on 9) The automatic inspection method of claim 9, wherein the extracting of the position information of the damage points comprises: setting a center line on the binary image; and measuring distances between the center line and the damage points and storing the measured distances as data. ### Claim 11 (depends on 10) The semiconductor processing method of claim 10, further comprising determining the processing quality of the laser processing equipment based on the data. ### Claim 12 A semiconductor processing method for laser processing equipment, the method comprising: preparing the object to be processed on which an image film is coated; performing a processing operation by irradiating the laser beam into one side of the object to be processed to form a modified area therein by using the laser processing equipment; detecting an image of damage to an opposing side surface of the object to be processed, the image formed on the image film by the irradiation of the laser beam; and processing the image of damage to the object to be processed. ### Claim 13 (depends on 12) The semiconductor processing method of claim 12, wherein the image film is coated on a bottom surface of the object to be processed, and the laser beam is incident from a top surface of the object to be processed to form the modified area in the object to be processed. ### Claim 14 (depends on 12) The semiconductor processing method of claim 12, wherein the image film comprises a material reactive with the laser beam. ### Claim 15 (depends on 14) The automatic inspection method of claim 14, wherein the image of damage to the object to be processed is formed when the laser beam is splashed around the modified area and reacts with the image film. ### Claim 16 (depends on 12) The semiconductor processing method of claim 12, wherein the image of damage to the object to be processed formed on the image film is detected by an image sensing unit. ### Claim 17 (depends on 16) The semiconductor processing method of claim 16, further comprising transmitting a sensing beam through the object to be processed, wherein the image sensing unit is configured to detect the damage image formed on the image film by using the sensing beam transmitted through the object to be processed. ### Claim 18 (depends on 16) The semiconductor processing method of claim 16, wherein the processing the image of damage of the object to be processed is processed by an image processing unit, further comprising: converting the damage image of the object to be processed detected by the image sensing unit into a binary image; removing a processing line image from the binary image; and extracting position information of damage points indicating points at which the object to be processed is damaged from the binary image from which the processing line image is removed. ### Claim 19 (depends on 18) The semiconductor processing method of claim 18, wherein the extracting of the position information of the damage points comprises: setting a center line on the binary image; and measuring distances between the center line and the damage points and storing the measured distances as data. ### Claim 20 (depends on 19) The semiconductor processing method of claim 19, further comprising determining the processing quality of the laser processing equipment based on the data.