# US 10,770,237 B2 · Multilayer electronic component

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- Number: US 10,770,237 B2
- Document ID: US10770237B2
- Status: Granted
- Kind: B2
- Application number: 15/954,140
- Filed: 2018-04-16
- Published: 2019-06-27
- Granted: 2020-09-08
- Earliest claimed: 2017-12-21
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Soo Hwan Son; Jae Yeol Choi; Young Ghyu Ahn
- Web page: https://patentgrep.com/patent/US10770237B2

## CPC

- H01G 4/385: {Single unit multiple capacitors, e.g. dual capacitor in one coil}
- H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor
- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- H01G 4/1227: {based on alkaline earth titanates}
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)

## Abstract

A multilayer electronic component includes: a laminate having a plurality of multilayer capacitors are disposed to be adjacent to each other, each of the multilayer capacitors including a body including dielectric layers and first and second internal electrodes alternately exposed through two end surfaces of the body facing each other in a length direction with each of the dielectric layers interposed therebetween, and first and second external electrodes disposed on the two end surfaces of the body in the length direction, respectively; and first and second terminals disposed on the laminate to cover a plurality of first and second external electrodes, respectively.

## Claims

### Claim 1

A multilayer electronic component comprising:
a laminate having a plurality of multilayer capacitors disposed to be adjacent to each other, each of the plurality of multilayer capacitors including a body including dielectric layers and first and second internal electrodes alternately exposed through two end surfaces of the body facing each other in a length direction with each of the dielectric layers interposed therebetween in a thickness direction, and first and second external electrodes disposed on the two end surfaces of the body in the length direction, respectively; and
first and second terminals disposed on the laminate to cover a plurality of first and second external electrodes, respectively,
wherein the first and second terminals respectively include first and second connection portions disposed on two end surfaces of the laminate in the length direction, and first and second band portions extending from circumferential edges of the first and second connection portions to cover at least a portion of top and bottom surfaces of the laminate in the thickness direction,
wherein circumferential edges of the first and second external electrodes are arranged within circumferential edges of the two end surfaces of the body in the thickness direction, respectively, and
wherein a surface of a multilayer capacitor of the plurality of multilayer capacitors directly contacts a surface of an adjacent multilayer capacitor of the plurality of multilayer capacitors.

### Claim 2 (depends on 1)

The multilayer electronic component of claim 1, wherein the laminate includes the plurality of multilayer capacitors arranged in parallel in a horizontal direction.

### Claim 3 (depends on 1)

The multilayer electronic component of claim 1, wherein the laminate includes the plurality of multilayer capacitors stacked in the thickness direction.

### Claim 4 (depends on 3)

The multilayer electronic component of claim 3, wherein a first multilayer capacitor disposed on a lowermost layer of the laminate has a lower capacitance than a second multilayer capacitor disposed on an upper side of the laminate.

### Claim 5 (depends on 3)

The multilayer electronic component of claim 3, wherein a first body of a first multilayer capacitor disposed on a lowermost layer of the laminate is formed of a material having a dielectric constant smaller than that of a second body of a second multilayer capacitor disposed on an upper side of the laminate.

### Claim 6 (depends on 3)

The multilayer electronic component of claim 3, wherein a first body of a first multilayer capacitor disposed on a lowermost layer of the laminate is configured so that the number of stacked internal electrodes in the first body is smaller than that of a second body of a second multilayer capacitor disposed on an upper side of the laminate.

### Claim 7 (depends on 3)

The multilayer electronic component of claim 3, wherein 30×t≤C1≤100×t in which t is a thickness of each of the dielectric layers, and C1 is the sum of thicknesses of two adjacent cover regions of two adjacent multilayer capacitors of the laminate, wherein each of the two adjacent multilayer capacitors includes two cover regions respectively disposed on upper and lower sides thereof.

### Claim 8 (depends on 1)

The multilayer electronic component of claim 1, wherein each of the first and second band portions covers a portion of front and rear surfaces of the laminate in a width direction.

### Claim 9 (depends on 1)

The multilayer electronic component of claim 1, wherein the laminate includes the plurality of multilayer capacitors arranged in parallel in a horizontal direction and stacked in a vertical direction at the same time.

### Claim 10 (depends on 9)

The multilayer electronic component of claim 9, wherein a first multilayer capacitor disposed on a lowermost layer of the laminate has a lower capacitance than a second multilayer capacitor disposed on an upper side of the laminate.

### Claim 11 (depends on 9)

The multilayer electronic component of claim 9, wherein a first body of a first multilayer capacitor disposed on a lowermost layer of the laminate is formed of a material having a dielectric constant smaller than that of a second body of a second multilayer capacitor disposed on an upper side of the laminate.

### Claim 12 (depends on 9)

The multilayer electronic component of claim 9, wherein a first body of a first multilayer capacitor disposed on a lowermost layer of the laminate is configured so that the number of stacked internal electrodes in the first body is smaller than that of a second body of a second multilayer capacitor disposed on an upper side of the laminate.

### Claim 13 (depends on 9)

The multilayer electronic component of claim 9, wherein 30×t≤C1≤100×t in which t is a thickness of each of the dielectric layers, and C1 is the sum of thicknesses of two adjacent cover regions of two adjacent multilayer capacitors of the laminate, wherein each of the two adjacent multilayer capacitors includes two cover regions respectively disposed on upper and lower sides thereof.

### Claim 14 (depends on 1)

The multilayer electronic component of claim 1, wherein the bodies of the multilayer capacitor and the adjacent multilayer capacitor of the plurality of multilayer capacitors are discrete.