# US 10,770,236 B2 · Multilayer ceramic electronic component array > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,770,236 B2 - Document ID: US10770236B2 - Status: Granted - Kind: B2 - Application number: 16/201,607 - Filed: 2018-11-27 - Published: 2020-04-16 - Granted: 2020-09-08 - Earliest claimed: 2018-10-10 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Ki Young Kim; Beom Joon Cho; Sang Soo Park; Woo Chul Shin - Web page: https://patentgrep.com/patent/US10770236B2 ## CPC - H01G 4/38: Multiple capacitors, i.e. structural combinations of fixed capacitors - H01G 4/1209: {characterised by the ceramic dielectric material (H01G4/1272, H01G4/1281 take precedence)} - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/248: the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) - H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)} - H01G 4/1227: {based on alkaline earth titanates} - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract A multilayer ceramic electronic component array includes: a plurality of multilayer ceramic electronic components; a first terminal structure electrically connected to first external electrodes of each of the plurality of multilayer ceramic electronic components; a second terminal structure electrically connected to second external electrodes of each of the plurality of multilayer ceramic electronic components; a first conductive bonding member bonding the first external electrodes of each of the plurality of multilayer ceramic electronic components and the first terminal structure; a second conductive bonding member bonding the second external electrodes of each of the plurality of multilayer ceramic electronic components and the second terminal structure; and a ceramic bonding member contacting first surfaces of each of the ceramic bodies of each of the plurality of multilayer ceramic electronic components and disposed to extend to second surfaces of each of the ceramic bodies. ## Claims ### Claim 1 A multilayer ceramic electronic component array comprising: a plurality of multilayer ceramic electronic components each including a ceramic body including a dielectric layer and first and second internal electrodes stacked with the dielectric layer interposed therebetween, the first and second internal electrodes being alternately exposed to first and second outer surfaces, respectively, and first and second external electrodes disposed on the first and second outer surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively; a first terminal structure electrically connected to first external electrodes of the plurality of multilayer ceramic electronic components; a second terminal structure electrically connected to second external electrodes of the plurality of multilayer ceramic electronic components; a first conductive bonding member bonding the first external electrodes of the plurality of multilayer ceramic electronic components and the first terminal structure; a second conductive bonding member bonding the second external electrodes of the plurality of multilayer ceramic electronic components and the second terminal structure; and a first ceramic bonding member contacting first surfaces of ceramic bodies of the plurality of multilayer ceramic electronic components and extending onto second surfaces of the ceramic bodies. ### Claim 2 (depends on 1) The multilayer ceramic electronic component array of claim 1, wherein the first external electrodes of the plurality of multilayer ceramic electronic components contact with each other, and the second external electrodes of the plurality of multilayer ceramic electronic components contact with each other. ### Claim 3 (depends on 2) The multilayer ceramic electronic component array of claim 2, wherein the plurality of multilayer ceramic electronic components are stacked in a thickness direction, and a direction perpendicular to the second surfaces of the ceramic bodies is a width direction. ### Claim 4 (depends on 3) The multilayer ceramic electronic component array of claim 3, wherein the first ceramic bonding member includes a first extended region disposed to be biased, in a length direction, to one end surface of the second surfaces of each of the ceramic bodies and a second extended region disposed to be biased in another end surface thereof. ### Claim 5 (depends on 3) The multilayer ceramic electronic component array of claim 3, wherein the first ceramic bonding member includes an extended region disposed at a center of the second surfaces of the ceramic bodies in a length direction. ### Claim 6 (depends on 5) The multilayer ceramic electronic component array of claim 5, wherein when an area of the first ceramic bonding member contacting the first surfaces of the ceramic bodies is defined as A and an area of the first ceramic bonding member contacting the second surfaces of the ceramic bodies is defined as B, A/B is 1.05 or less. ### Claim 7 (depends on 6) The multilayer ceramic electronic component array of claim 6, wherein at least one portion of the first terminal structure is bent toward the second terminal structure, and at least one portion of the second terminal structure is bent toward the first terminal structure. ### Claim 8 (depends on 7) The multilayer ceramic electronic component array of claim 7, wherein the first conductive bonding member includes a first portion contacting a surface of the first terminal structure in the length direction and a surface of the first external electrode, in the length direction, of each of the plurality of multilayer ceramic electronic components, and the second conductive bonding member includes a first portion contacting a surface of the second terminal structure in a length direction and a surface of the second external electrode, in the length direction, of each of the plurality of multilayer ceramic electronic components. ### Claim 9 (depends on 8) The multilayer ceramic electronic component array of claim 8, wherein the first conductive bonding member further includes a second portion disposed between the at least one portion of the first terminal structure bent toward the second terminal structure and the first external electrode of an uppermost multilayer ceramic electronic component in the thickness direction, and the second conductive bonding member further includes a second portion disposed between the at least one portion of the second terminal structure bent toward the first terminal structure and the second external electrode of the uppermost multilayer ceramic electronic component in the thickness direction. ### Claim 10 (depends on 7) The multilayer ceramic electronic component array of claim 7, wherein portions of the first and second terminal structures are separated from the plurality of multilayer ceramic electronic components. ### Claim 11 (depends on 1) The multilayer ceramic electronic component array of claim 1, wherein the plurality of multilayer ceramic electronic components are arranged in “n” numbers in a thickness direction and arranged in “m” numbers in a width direction which is a direction perpendicular to the second surfaces of the ceramic bodies, such that the number of multilayer ceramic electronic components is n times m, and the multilayer ceramic electronic component array further includes a second ceramic bonding member which contacts third surfaces of the ceramic bodies of the multilayer ceramic electronic components arranged in the width direction among the plurality of multilayer ceramic electronic components and extends to fourth surfaces of the ceramic bodies. ### Claim 12 (depends on 11) The multilayer ceramic electronic component array of claim 11, wherein the second ceramic bonding member extends onto the fourth surfaces of the ceramic bodies.