# US 10,770,206 B1 · System and method for fabricating a strain sensing device directly on a structure

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,770,206 B1
- Document ID: US10770206B1
- Status: Granted
- Kind: B1
- Application number: 16/377,302
- Filed: 2019-04-08
- Granted: 2020-09-08
- Earliest claimed: 2019-04-08
- Applicants: Government of the United States as represented by the Secretary of the Air Force
- Inventors: Roberto S. Aga; Emily M. Heckman
- Web page: https://patentgrep.com/patent/US10770206B1

## CPC

- H01C 17/065: by thick film techniques, e.g. serigraphy
- G01L 1/18: using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
- G01L 1/2287: {constructional details of the strain gauges (adjustable resistors H01C10/00)}
- H01C 10/10: adjustable by mechanical pressure or force
- H01C: RESISTORS
- G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G)

## Abstract

Various deficiencies in the prior art are addressed by systems, methods, architectures, mechanisms and/or apparatus configured for fabricating a strain sensing device directly on a structure by printing a material on the structure, the material exhibiting a piezo-resistive effect, and sintering a strain sensing pattern from the material such that the strain sensing pattern becomes electrically conductive.

## Claims

### Claim 1

A method for fabricating a strain sensing device directly on a structure, the method comprising:
printing a material on the structure, the material exhibiting a piezo-resistive effect;
sintering a strain sensing pattern from the material such that the strain sensing pattern becomes electrically conductive; and
attaching a pin connector to the electrically conductive strain sensing pattern.

### Claim 2 (depends on 1)

The method of claim 1, further comprising printing an insulating layer on the structure.

### Claim 3 (depends on 1)

The method of claim 1, further comprising drying the printed material on the structure.

### Claim 4 (depends on 1)

The method of claim 1, wherein the structure is a functional structure comprising one of a support beam and a wing of a vehicle.

### Claim 5 (depends on 1)

The method of claim 1, wherein the structure is a curved structure.

### Claim 6 (depends on 5)

The method of claim 5, further comprising mapping the curvature of the structure, wherein the printing and sintering steps are configured to conform to a map of the curvature of the structure.

### Claim 7 (depends on 1)

The method of claim 1, wherein the material comprises one of graphene, silver, and copper.

### Claim 8 (depends on 1)

The method of claim 1, wherein printing the material on the structure utilizes additive manufacturing.

### Claim 9 (depends on 1)

The method of claim 1, wherein sintering comprises one of thermal and laser sintering.

### Claim 10 (depends on 1)

A strain sensing device manufactured directly on a structure by the method recited in claim 1.

### Claim 11 (depends on 10)

The strain sensing device of claim 10, further comprising an insulating layer formed on the structure.

### Claim 12 (depends on 10)

The strain sensing device of claim 10, further comprising a pin connector connected to the electrically conductive strain sensing pattern.

### Claim 13 (depends on 10)

The strain sensing device of claim 10, wherein the structure is a functional structure comprising one of a support beam and a wing of a vehicle.

### Claim 14 (depends on 10)

The strain sensing device of claim 10, wherein the material comprises one of graphene, silver, and copper.

### Claim 15 (depends on 10)

The strain sensing device of claim 10, wherein sintering comprises one of thermal and laser sintering.

### Claim 16

A method for fabricating a strain sensing device directly on a structure, the method comprising:
printing a first material on the structure, the first material exhibiting a piezo-resistive effect;
sintering a first strain sensing pattern from the first material such that the first strain sensing pattern becomes electrically conductive;
printing an insulating layer on the first material;
printing a second material on the insulating layer, the second material exhibiting a piezo-resistive effect; and
sintering a second strain sensing pattern from the second material such that the second strain sensing pattern become electrically conductive.

### Claim 17 (depends on 16)

The method of claim 16, further comprising printing an insulating layer between the structure and first material.

### Claim 18 (depends on 16)

The method of claim 16, further comprising drying the printed first and second materials.

### Claim 19 (depends on 16)

The method of claim 16, further comprising attaching a pin connector to the electrically conductive first and second strain sensing patterns.

### Claim 20 (depends on 16)

The method of claim 16, wherein the first and second materials each comprise one of graphene, silver, and copper.

### Claim 21 (depends on 16)

The method of claim 16, wherein sintering comprises one of thermal and laser sintering.

### Claim 22 (depends on 16)

The method of claim 16, wherein the first and second materials are the same.

### Claim 23 (depends on 16)

The method of claim 16, wherein the first and second strain sensing patterns are the same.