# US 10,770,204 B2 · Electrical device with soldered joint

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- Number: US 10,770,204 B2
- Document ID: US10770204B2
- Status: Granted
- Kind: B2
- Application number: 16/611,294
- Filed: 2018-07-12
- Published: 2020-02-27
- Granted: 2020-09-08
- Earliest claimed: 2017-07-20
- Assignees: TDK Electronics Co., Ltd.
- Applicants: TDK Electronics AG
- Inventors: Gerald Kloiber; Heinz Strallhofer
- Web page: https://patentgrep.com/patent/US10770204B2

## CPC

- H01C 1/144: the terminals or tapping points being welded or soldered
- H01C 1/1413: {Terminals or electrodes formed on resistive elements having negative temperature coefficient}
- H01C 17/281: {by thick film techniques}
- H01R 4/023: {between cables or wires and terminals}
- H01R 4/625: {Soldered or welded connections}
- H01C: RESISTORS
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

## Abstract

An electrical device with a soldered joint is disclosed. In an embodiment, an electrical device includes at least one soldered joint having a first wire soldered at one end to the device, wherein the first wire bears with a bearing surface on the device, and wherein the first wire has at least one bend in a region of the bearing surface of the first wire on the device.

## Claims

### Claim 1

An electrical device comprising:
at least one soldered joint comprising a first wire soldered at one end to the device,
wherein the first wire bears with a bearing surface on the device,
wherein the first wire has at least one bend in a region of the bearing surface of the first wire on the device, and
wherein the bearing surface of the first wire has a rounded end in plan view.

### Claim 2 (depends on 1)

The device according to claim 1, wherein the first wire has a further bend in a region of a flattened portion which is directed towards a contact surface.

### Claim 3 (depends on 1)

The device according to claim 1, wherein the first wire has a flattened portion in the region of the bearing surface.

### Claim 4 (depends on 1)

The device according to claim 1, wherein the device has at least one contact surface for the soldered joint which is coated with an electrically conductive metal.

### Claim 5 (depends on 4)

The device according to claim 4, wherein the bearing surface of the first wire is shorter than the contact surface.

### Claim 6 (depends on 1)

The device according to claim 1, wherein the first wire extends after the bend with a gap relative to a contact surface when viewed from the bearing surface.

### Claim 7 (depends on 6)

The device according to claim 6, wherein the soldered joint comprises a solder, a greater part of which is arranged in a region in which the first wire extends with the gap relative to the contact surface.

### Claim 8 (depends on 1)

The device according to claim 1, wherein the bend is arranged in the first wire at an end of a flattened portion where it develops into a region of a round cross-sectional shape.

### Claim 9 (depends on 8)

The device according to claim 8, further comprising a first wire insulation of a synthetic polymer material, which begins only in the region of round cross-sectional shape.

### Claim 10 (depends on 1)

The device according to claim 1, wherein the device comprises an NTC ceramic.

### Claim 11 (depends on 1)

The device according to claim 1, further comprising a polymer covering, which envelops the device, the soldered joint and the first wire to as far as behind a last bend.

### Claim 12 (depends on 1)

The device according to claim 1, further comprising a second contact surface, to which a second wire identical in form to the first wire is soldered.

### Claim 13

An electrical device comprising:
at least one soldered joint comprising a wire soldered at one end to the device,
wherein the wire bears with a bearing surface on the device,
wherein the wire has at least one bend in a region of the bearing surface of the wire on the device,
wherein the wire has a flattened portion in the region of the bearing surface, and
wherein the bend is arranged in the wire at an end of the flattened portion where it develops into a region of a round cross-sectional shape.