# US 10,770,099 B2 · Stress-free tape head module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,770,099 B2 - Document ID: US10770099B2 - Status: Granted - Kind: B2 - Application number: 16/670,958 - Filed: 2019-10-31 - Published: 2020-02-27 - Granted: 2020-09-08 - Earliest claimed: 2018-03-26 - Assignees: International Business Machines Corporation - Applicants: International Business Machines Corporation - Inventors: Robert G. Biskeborn - Web page: https://patentgrep.com/patent/US10770099B2 ## CPC - G11B 5/00821: {using stationary heads} - G11B 5/3173: {Batch fabrication, i.e. producing a plurality of head structures in one batch} - G11B: INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER (recording measured values in a way that does not require playback through a transducer G01D9/00; recording or playback apparatus using mechanically marked tape, e.g. punched paper tape, or using unit records, e.g. punched or magnetically marked cards G06K; transferring data from one type of record carrier to another G06K1/18; circuits for coupling output of reproducer to radio receiver H04B1/20; gramophone pick-ups or like acoustic electromechanical transducers or circuits therefor H04R) ## Abstract A method according to one embodiment includes attaching a die to a beam, where the die includes an array of transducers in a transducer region of the die, a first region extending from the transducer region to a first end of the die and a second region extending from the transducer region to a second end of the die. The transducer region of the die is attached to the beam, and the first region and the second region are not attached to the beam. ## Claims ### Claim 1 A method, comprising: attaching a die to a beam, wherein the die comprises an array of transducers in a transducer region of the die, a first region extending from the transducer region to a first end of the die and a second region extending from the transducer region to a second end of the die, wherein the transducer region of the die is attached to the beam, wherein the first region and the second region are not attached to the beam. ### Claim 2 (depends on 1) A method as recited in claim 1, comprising before attaching the die to the beam, applying thermal annealing treatment to the beam. ### Claim 3 (depends on 1) A method as recited in claim 1, wherein the beam is a U-beam. ### Claim 4 (depends on 1) A method as recited in claim 1, wherein the die is fixedly attached to the beam, wherein an adhesive fixedly attaches the die to the beam. ### Claim 5 (depends on 4) A method as recited in claim 4, wherein the adhesive is selected from the group consisting of: cyanoacrylate, epoxy resin, and two-part epoxy. ### Claim 6 (depends on 4) A method as recited in claim 4, wherein the adhesive is solvent-resistant. ### Claim 7 (depends on 4) A method as recited in claim 4, wherein fixedly attaching the die to the beam comprises: applying the adhesive to a target area under the first region of the die; aligning the die to the beam; attaching the die to the beam wherein the adhesive is between the die and the beam; and curing the adhesive therebetween. ### Claim 8 (depends on 1) A method as recited in claim 1, wherein the second region of the die is flexibly attached to the beam. ### Claim 9 (depends on 8) A method as recited in claim 8, wherein a second adhesive flexibly attaches the second region to the beam. ### Claim 10 (depends on 9) A method as recited in claim 9, wherein the second adhesive is a sacrificial adhesive. ### Claim 11 (depends on 9) A method as recited in claim 9, comprising, the second adhesive is removed after curing the adhesive between the die and the beam. ### Claim 12 (depends on 9) A method as recited in claim 9, wherein the second adhesive is a flexible adhesive. ### Claim 13 (depends on 1) A method as recited in claim 1, comprising, before attaching the die to the beam, forming at least one channel in the beam, wherein the at least one channel is positioned on a die facing side of the beam and positioned adjacent to the transducer region of the die. ### Claim 14 (depends on 13) A method as recited in claim 13, wherein the at least one channel is an adhesive overflow reservoir. ### Claim 15 (depends on 13) A method as recited in claim 13, comprising, forming two channels in the beam, wherein each channel is positioned on the die facing side of the beam, positioned adjacent to the transducer region of the die, and positioned on opposite sides of the transducer region of the die. ### Claim 16 (depends on 13) A method as recited in claim 13, wherein an acetone-resistant adhesive fixedly attaches the transducer region of the die to the beam. ### Claim 17 (depends on 13) A method as recited in claim 13, wherein the first region and the second region of the die are not fixedly attached the beam. ### Claim 18 (depends on 13) A method as recited in claim 13, wherein a width of a portion of the beam fixedly attached to the die is at least a width of the transducer region of the die. ### Claim 19 (depends on 13) A method as recited in claim 13, wherein the transducer region of the die is positioned at about a center portion of the beam. ### Claim 20 (depends on 13) A method as recited in claim 13, wherein at least the first region is flexibly attached to the beam.