# US 10,769,508 B2 · Radio frequency yarn module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,769,508 B2 - Document ID: US10769508B2 - Status: Granted - Kind: B2 - Application number: 16/386,536 - Filed: 2019-04-17 - Published: 2020-05-28 - Granted: 2020-09-08 - Earliest claimed: 2018-11-23 - Assignees: Taiwan Textile Research Institute - Applicants: Taiwan Textile Research Institute - Inventors: Jie-Shen Tsai; Chien-Lung Shen - Web page: https://patentgrep.com/patent/US10769508B2 ## CPC - G06K 19/025: {the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs (methods for testing the genuineness of valuable papers, e.g. banknotes or passports G07D7/00; constructional features of booklets and the like B42D)} - G06K 19/027: {the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items (markings attached to laundry items in general D06F93/00)} - G06K 19/041: {Constructional details (G06K19/06 takes precedence)} - G06K 19/0723: {the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs} - G06K 19/07749: {the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card} - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS ## Abstract A radio frequency yarn module includes a first flexible substrate, a radio frequency assembly, and a first packaging adhesive. The first flexible substrate is strip shaped and has a thickness ranging from 40 μm to 60 μm. The radio frequency assembly is disposed on the first flexible substrate and includes a first conductive layer, a second conductive layer, and a radio frequency chip. Each of the first and the second conductive layers is disposed on the first flexible substrate and has a thickness ranging from 3 μm to 10 μm. Extending paths of the first and the second conductive layers are respectively same as extending paths of a first and a second portions of the first flexible substrate. The radio frequency chip is disposed on the first conductive layer and the second conductive layer. The first packaging adhesive covers the radio frequency assembly. ## Claims ### Claim 1 A radio frequency yarn module, comprising: a first flexible substrate that is strip shaped and has a thickness ranging from 40 μm to 60 μm; a radio frequency assembly disposed on the first flexible substrate and comprising: a first conductive layer disposed on the first flexible substrate and having a thickness ranging from 3 μm to 10 μm, wherein an extending path of the first conductive layer is the same as an extending path of a first portion of the first flexible substrate; a second conductive layer disposed on the first flexible substrate and having a thickness ranging from 3 μm to 10 μm, wherein an extending path of the second conductive layer is the same as an extending path of a second portion of the first flexible substrate; and a radio frequency chip disposed on the first and the second conductive layers and having a first pin and a second pin, wherein the first pin is electrically connected to the first conductive layer, and the second pin is electrically connected to the second conductive layer; and a first packaging adhesive covering the radio frequency assembly, so as to make the radio frequency assembly be disposed between the first flexible substrate and the first packaging adhesive. ### Claim 2 (depends on 1) The radio frequency yarn module of claim 1, wherein the first packaging adhesive is a silica gel and has a thickness ranging from 200 μm to 900 μm, and the radio frequency assembly and the first flexible substrate are encapsulated by the first packaging adhesive. ### Claim 3 (depends on 1) The radio frequency yarn module of claim 1, further comprising a plurality of outer yarns weaved to wrap an outer surface of the radio frequency yarn module. ### Claim 4 (depends on 3) The radio frequency yarn module of claim 3, further comprising a connection layer disposed between the first flexible substrate and the radio frequency assembly. ### Claim 5 (depends on 1) The radio frequency yarn module of claim 1, further comprising a second flexible substrate disposed on the first packaging adhesive and having a thickness ranging from 5 μm to 15 μm. ### Claim 6 (depends on 5) The radio frequency yarn module of claim 5, wherein the first packaging adhesive is an acrylic adhesive and has a thickness ranging from 120 μm to 270 μm. ### Claim 7 (depends on 1) The radio frequency yarn module of claim 1, further comprising a second packaging adhesive covering the first flexible substrate, wherein the first flexible is located between the first packaging adhesive and the second packaging adhesive, the first packaging adhesive has a thickness ranging from 50 μm to 100 μm, and the second packaging adhesive has a thickness ranging from 30 μm to 70 μm. ### Claim 8 (depends on 1) The radio frequency yarn module of claim 1, wherein the first packaging adhesive further covers the first flexible substrate. ### Claim 9 (depends on 1) The radio frequency yarn module of claim 1, further comprising an anisotropic conductive film (ACF) disposed between the first conductive layer and the radio frequency chip and between the second conductive layer and the radio frequency chip, so as to fix the first pin and second pin on the first conductive layer and the second conductive layer respectively. ### Claim 10 (depends on 1) The radio frequency yarn module of claim 1, wherein the first flexible substrate has a pair of short sides and a pair of long sides, and each of the short sides of the first flexible substrate has a length ranging from 1 mm to 2.5 mm.