# US 10,768,751 B2 · Electronic device including optical image sensor having metallization layers and related methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,768,751 B2 - Document ID: US10768751B2 - Status: Granted - Kind: B2 - Application number: 15/987,543 - Filed: 2018-05-23 - Published: 2018-12-13 - Granted: 2020-09-08 - Earliest claimed: 2017-06-13 - Assignees: Apple Inc. - Applicants: Apple Inc. - Inventors: Mohammad Yeke Yazdandoost; Giovanni Gozzini - Web page: https://patentgrep.com/patent/US10768751B2 ## CPC - G06F 3/042: by opto-electronic means - G06V 40/1318: {using electro-optical elements or layers, e.g. electroluminescent sensing} - G06V 40/1365: {Matching; Classification} - G06F 2203/04103: Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - G06V: IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING ## Abstract An electronic device may include an optical image sensor that includes optical image sensing circuitry and metallization layers above the optical image sensing circuitry. Each layer may have at least one light transmissive collimation opening therein aligned with the optical image sensing circuitry. The electronic device may also include a light source layer above the optical image sensor and a transparent cover layer above the light source layer defining a finger placement surface configured to receive a finger adjacent thereto. ## Claims ### Claim 1 An electronic device comprising: an optical image sensor comprising optical image sensing circuitry, and a collimation layer comprising a plurality of metallization layers above the optical image sensing circuitry, each layer having at least one light transmissive collimation opening therein aligned with the optical image sensing circuitry, and a plurality of inter-level dielectric layers respectively carrying each of the plurality of metallization layers; a light source layer adjacent the optical image sensor; and a transparent cover layer above the light source layer defining a finger placement surface configured to receive a finger adjacent thereto. ### Claim 2 (depends on 1) The electronic device of claim 1 wherein the plurality of light transmissive collimation openings has a cylindrical shape. ### Claim 3 (depends on 1) The electronic device of claim 1 wherein the plurality of light transmissive collimation openings has a frusto-conical shape. ### Claim 4 (depends on 1) The electronic device of claim 1 wherein the optical image sensor further comprises a passivation layer above the plurality of metallization layers. ### Claim 5 (depends on 1) The electronic device of claim 1 further comprising an optically transparent adhesive layer between the transparent cover layer and the light source layer. ### Claim 6 (depends on 1) The electronic device of claim 1 wherein the optical image sensing circuitry comprises an array of photodiodes and readout circuitry coupled thereto. ### Claim 7 (depends on 1) The electronic device of claim 1 wherein the light source layer comprises a plurality of spaced apart light emitting diodes. ### Claim 8 (depends on 1) The electronic device of claim 1 wherein the light source layer comprises a display layer comprising a plurality of spaced apart display pixels. ### Claim 9 (depends on 1) The electronic device of claim 1 further comprising an optically transparent adhesive layer between the light source layer and the optical image sensor. ### Claim 10 An electronic device comprising: an optical image sensor comprising optical image sensing circuitry comprising an array of photodiodes and a readout circuitry coupled thereto, and a collimation layer comprising a plurality of metallization layers above the optical image sensing circuitry, each layer having at least one light transmissive collimation opening therein aligned with the optical image sensing circuitry, the plurality of light transmissive collimation openings having a cylindrical shape, and a plurality of inter-level dielectric layers respectively carrying each of the plurality of metallization layers; a light source layer adjacent the optical image sensor; and a transparent cover layer above the light source layer defining a finger placement surface configured to receive a finger adjacent thereto. ### Claim 11 (depends on 10) The electronic device of claim 10 further comprising an optically transparent adhesive layer between the transparent cover layer and the light source layer. ### Claim 12 (depends on 10) The electronic device of claim 10 wherein the optical image sensor further comprises a passivation layer above the plurality of metallization layers. ### Claim 13 (depends on 10) The electronic device of claim 10 further comprising an optically transparent adhesive layer between the light source layer and the optical image sensor. ### Claim 14 A method for making an electronic device comprising: forming an optical image sensor comprising optical image sensing circuitry, and a collimation layer, the collimation layer comprising a plurality of metallization layers above the optical image sensing circuitry, each metallization layer formed to have at least one light transmissive collimation opening therein aligned with the optical image sensing circuitry, and a plurality of inter-level dielectric layers, each inter-level dielectric layer formed to carry a respective one of the plurality of metallization layers; positioning a light source layer adjacent the optical image sensor; and positioning a transparent cover layer above the light source layer to define a finger placement surface configured to receive a finger adjacent thereto. ### Claim 15 (depends on 14) The method of claim 14 wherein the plurality of light transmissive collimation openings are formed to have a frusto-conical shape. ### Claim 16 (depends on 14) The method of claim 14 wherein forming the optical image sensor further comprises forming a passivation layer above the plurality of metallization layers. ### Claim 17 (depends on 14) The method of claim 14 wherein the plurality of light transmissive collimation openings are formed to have a cylindrical shape.