# US 10,768,534 B2 · Photolithography apparatus and method and method for handling wafer

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- Number: US 10,768,534 B2
- Document ID: US10768534B2
- Status: Granted
- Kind: B2
- Application number: 16/232,952
- Filed: 2018-12-26
- Published: 2020-02-20
- Granted: 2020-09-08
- Earliest claimed: 2018-08-14
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Co., Ltd.
- Inventors: Po-Ming Shih; Chi-Hung Liao
- Web page: https://patentgrep.com/patent/US10768534B2

## CPC

- G03F 7/707: {Chucks, e.g. chucking or un-chucking operations or structural details}
- H10P 72/7614: {characterised by a plurality of individual support members, e.g. support posts or protrusions}
- G03F 7/70741: {Handling masks outside exposure position, e.g. reticle libraries}
- G03F 7/7095: {Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient}
- H10P 72/3302: {Mechanical parts of transfer devices}
- H10P 72/7602: {the wafers being placed on a robot blade or gripped by a gripper for conveyance}
- H10P 72/7616: {characterised by a coating, a hardness or a material}
- H10P 76/00: Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A method for adhering a reticle onto a top surface of a chuck is provided in accordance with some embodiments of the present disclosure. The method includes contacting a plurality of fibers on the top surface of the chuck with the reticle. The reticle is slid relative to the top surface of the chuck along a first direction to increase a contact area between the fibers and the reticle, such that the reticle is adhered to the fibers.

## Claims

### Claim 1

A method, comprising:
contacting a plurality of fibers on a top surface of a chuck with a reticle; and
sliding the reticle relative to the top surface of the chuck along a first direction to increase a contact area between the fibers and the reticle, such that the reticle is adhered to the fibers.

### Claim 2 (depends on 1)

The method of claim 1, wherein a height of the fibers after sliding the reticle is in a range from about 0.5 μm to about 0.8 μm.

### Claim 3 (depends on 1)

The method of claim 1, wherein a height of the fibers before sliding the reticle is in a range from about 1 μm to about 1.5 μm.

### Claim 4 (depends on 1)

The method of claim 1, wherein a width of the fibers is in a range from about 0.2 μm to about 0.5 μm.

### Claim 5 (depends on 1)

The method of claim 1, wherein sliding the reticle is performed such that the fibers are inclined toward the first direction that is parallel to the top surface of the chuck.

### Claim 6 (depends on 1)

The method of claim 1, further comprising:
sliding the reticle relative to the top surface of the chuck along a second direction that is opposite the first direction to decrease a contact area between the fibers and the reticle.

### Claim 7 (depends on 6)

The method of claim 6, further comprising:
detaching the reticle from the fibers after sliding the reticle relative to the top surface of the chuck along the second direction.

### Claim 8 (depends on 1)

The method of claim 1, further comprising:
performing a photolithography process using the reticle adhered to the fibers.

### Claim 9

A method, comprising:
contacting a plurality of fibers on a top surface of a wafer holder with a wafer; and
sliding the wafer holder relative to the wafer along a first direction to incline the fibers relative to the top surface of the wafer holder, such that the wafer is adhered to the fibers.

### Claim 10 (depends on 9)

The method of claim 9, wherein sliding the wafer holder is performed such that a contact area between the fibers and the wafer increases.

### Claim 11 (depends on 9)

The method of claim 9, wherein sliding the wafer holder is performed such that a height of the fibers decreases.

### Claim 12 (depends on 9)

The method of claim 9, wherein sliding the wafer holder is performed such that the fibers are inclined toward a second direction that is opposite the first direction, wherein the first direction and the second direction are parallel to the top surface of the wafer holder.

### Claim 13 (depends on 9)

The method of claim 9, further comprising:
sliding the wafer holder relative to the wafer along a second direction that is opposite the first direction to decrease a contact area between the fibers and the wafer.

### Claim 14 (depends on 13)

The method of claim 13, wherein the fibers are inclined toward the second direction while sliding the wafer holder relative to the wafer along the second direction.

### Claim 15 (depends on 9)

The method of claim 9, further comprising:
detaching the wafer holder from the wafer after sliding the wafer holder relative to the wafer along the second direction.

### Claim 16

An apparatus, comprising:
a workpiece holding device; and
a plurality of bendable fibers on a top surface of the workpiece holding device,
wherein each of the bendable fibers extends away from the top surface of the workpiece holding device and is distant from one to the other.

### Claim 17 (depends on 16)

The apparatus of claim 16, wherein a width of the bendable fibers is in a range from about 0.2 μm to about 0.5 μm.

### Claim 18 (depends on 16)

The apparatus of claim 16, wherein a height of the bendable fibers is in a range from about 1 μm to about 1.5 μm.

### Claim 19 (depends on 16)

The apparatus of claim 16, wherein each of the bendable fibers tapers towards its top.

### Claim 20 (depends on 16)

The apparatus of claim 16, further comprising:
a vacuum source, wherein the workpiece holding device has a vacuum hole therein, the vacuum source is in communication with the vacuum hole of the workpiece holding device, and the vacuum hole of the workpiece holding device is surrounded by the bendable fibers.