# US 10,768,522 B2 · Original plate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,768,522 B2 - Document ID: US10768522B2 - Status: Granted - Kind: B2 - Application number: 16/285,197 - Filed: 2019-02-25 - Published: 2020-03-05 - Granted: 2020-09-08 - Earliest claimed: 2018-08-30 - Assignees: Toshiba Memory Corporation - Applicants: Toshiba Memory Corporation - Inventors: Yumi Tanaka - Web page: https://patentgrep.com/patent/US10768522B2 ## CPC - G03F 1/42: Alignment or registration features, e.g. alignment marks on the mask substrates - C23F 1/16: Acidic compositions (C23F1/42 takes precedence) - G03F 1/80: Etching - G03F 7/0002: {Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping} - G03F 9/7042: {Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting (non-exposure lithographic processes per se G03F7/0002)} - H10P 76/20: of masks comprising organic materials - C23F 1/02: Local etching - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - C23F: NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE (working metal by laser beams B23K26/00; desurfacing by applying flames B23K7/00; working of metal by electro-erosion B23H; producing decorative effects by removing surface material, e.g. by engraving, by etching, B44C1/22; electrolytic etching or polishing C25F); INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract An original plate includes a substrate, a pattern region in which a fine pattern is disposed on the substrate, a mark region in which a mark, including an unevenness used for alignment with a transfer receiving body on the substrate, is disposed, a first film disposed in a concave portion of the mark region and having high contrast with respect to the substrate, and a second film covering the mark region and having contrast with respect to the substrate lower than that of the first film. ## Claims ### Claim 1 An original plate comprising: a substrate; a pattern region in which a first pattern is disposed on the substrate, the first pattern includes a first bottom surface, a first side surface and a first top surface; a mark region in which a second pattern is disposed on the substrate, the second pattern includes a second bottom surface, a second side surface and a second top surface; a first film provided on the second bottom surface of the second pattern and having high contrast with respect to the substrate; and a second film provided on the first film and the second side surface of the second pattern and having a contrast with respect to the substrate lower than that of the first film, wherein the second film contacts the second side surface. ### Claim 2 (depends on 1) The original plate according to claim 1, wherein the second film has at least one of the following properties: acid resistance, alkali resistance, or oxidation resistance. ### Claim 3 (depends on 1) The original plate according to claim 1, wherein the second film has at least one of the following properties: acid resistance, alkali resistance, or oxidation resistance. ### Claim 4 (depends on 1) The original plate according to claim 1, wherein the first film comprises at least one of the materials Ti, Ta, W, Cr, Cu, SiC, or SiF4, and the second film comprises at least one of the materials SiO2, Ta2O5, Al2O3, TiO2, ZrO2, O3, YAG, HfO2, or CaF2. ### Claim 5 (depends on 1) The original plate according to claim 1, wherein the mark region is provided within an outer peripheral portion of the pattern region. ### Claim 6 (depends on 1) The original plate according to claim 1, wherein the first film includes a metal. ### Claim 7 (depends on 1) The original plate according to claim 1, wherein the second film is transparent to light. ### Claim 8 (depends on 7) The original plate according to claim 7, wherein the second film is an oxide. ### Claim 9 (depends on 1) The original plate according to claim 1, wherein the original plate is included in an imprint device. ### Claim 10 (depends on 9) The original plate according to claim 9, further comprises: an alignment sensor configured to detect the position of the mark. ### Claim 11 (depends on 1) The original plate according to claim 1, wherein the second film is provided on the second top surface. ### Claim 12 (depends on 1) The original plate according to claim 1, wherein the second film is provided on the first bottom surface, the first side surface and the first top surface. ### Claim 13 An original plate comprising: a substrate; a pattern region in which a first pattern is disposed on the substrate, the first pattern includes a first bottom surface, a first side surface and a first top surface; a mark region in which a second pattern is disposed on the substrate, the second pattern includes a second bottom surface, a second side surface and a second top surface; a first film provided on the second bottom surface of the second pattern, the first film comprising at least one of the materials Ti, Ta, W, Cr, Cu, SiC, or SiF4; and a second film provided on the first film and the second side surface of the second pattern the second film comprising at least one of the materials SiO2, Ta2O5, Al2O3, TiO2, ZrO2, Y2O3, YAG, HfO2, or CaF2.