# US 10,768,448 B2 · Apparatuses and methods for blue-cut lenses

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- Number: US 10,768,448 B2
- Document ID: US10768448B2
- Status: Granted
- Kind: B2
- Application number: 16/335,206
- Filed: 2017-09-20
- Published: 2019-11-14
- Granted: 2020-09-08
- Earliest claimed: 2016-09-20
- Assignees: Essilor International
- Applicants: Essilor International
- Inventors: Haifeng Shan; Hao Wen Chiu; Aref Jallouli
- Web page: https://patentgrep.com/patent/US10768448B2

## CPC

- G02B 5/223: {containing organic substances, e.g. dyes, inks or pigments}
- G02C 7/104: {having spectral characteristics for purposes other than sun-protection}
- B29D 11/00634: {Production of filters}
- C08K 5/0041: {Optical brightening agents, organic pigments}
- G02C 2202/10: Optical elements and systems for visual disorders other than refractive errors, low vision
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02C: SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURES AS SPECTACLES; CONTACT LENSES (trial frames for testing the eyes A61B3/04; goggles or eyeshields not having the same features as spectacles A61F9/00)
- B29D: PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE (making granules B29B9/00; making preforms B29B11/00)
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)

## Abstract

A blue-cut wafer can be coupled to a lens, such that the blue-cut wafer can be configured to reduce by absorption at least a portion of light having a first wavelength range from 400 nanometers to 500 nanometers, preferably from 400 nanometers to 460 nanometers. The blue-cut wafer can permit light having a second wavelength range, the second wavelength range being greater than the first wavelength range, and homogenize a color appearance and a blue-cut performance level of the blue-cut wafer based on the blue-cut wafer having a maximum thickness and a minimum thickness within twenty percent of a nominal thickness of the blue-cut wafer.

## Claims

### Claim 1

A blue-cut wafer, comprising:
one or more of blue blocking dyes blended with a thermoplastic resin injection molded into the blue-cut wafer; or
a thermoplastic blue-cut film thermoformed into the blue-cut wafer;
wherein:
the blue-cut wafer is configured to reduce by absorption at least a portion of light having a first wavelength range from 400 nanometers to 500 nanometers;
the blue-cut wafer has a maximum thickness and a minimum thickness within twenty percent of a nominal thickness of the blue-cut wafer; and
a color appearance and a blue-cut performance level of the blue-cut wafer are homogenized in such a manner as ΔE≤1, where ΔE is a color difference between a wafer center and a wafer edge calculated using color-difference formula CIE76.

### Claim 2 (depends on 1)

The blue-cut wafer of claim 1, wherein the blue-cut wafer includes a selection of a difference between an edge thickness and a center thickness of the blue-cut wafer based on a selected range of thickness of the blue-cut wafer.

### Claim 3 (depends on 2)

The blue-cut wafer of claim 2, wherein the blue-cut wafer is configured to permit light having a second wavelength range, the second wavelength range including wavelengths outside the first wavelength range.

### Claim 4 (depends on 1)

The blue-cut wafer of claim 1, wherein the blue-cut wafer includes one or more additional layers providing one or more of polarization, near-infrared cut, additional light filters, and color balancing.

### Claim 5 (depends on 1)

A method of manufacturing a transparent optical article comprising the blue-cut wafer of claim 1, comprising:
blending blue blocking dyes with a thermoplastic resin injection molded into a blue-cut wafer or thermoforming a blue-cut film into the blue-cut wafer,
calculating a thickness variation range of the blue-cut wafer;
calculating a maximum edge thickness and minimum edge thickness of the blue-cut wafer; and
integrating the blue-cut wafer onto a lens via one or more of front-side lamination, direct injection, in-molding lamination, or bi-injection.

### Claim 6 (depends on 5)

The method of claim 5, further comprising:
selecting a difference between an edge thickness and a center thickness of the blue-cut wafer based on the thickness variation range of the blue-cut wafer.

### Claim 7 (depends on 6)

The method of claim 6, further comprising:
selecting a blue-cut wafer thickness less than 1.5 millimeters.

### Claim 8 (depends on 6)

The method of claim 6, further comprising:
selecting a blue-cut wafer thickness less than 1.3 millimeters.

### Claim 9 (depends on 6)

The method of claim 6, further comprising:
selecting a blue-cut wafer thickness less than 1.1 millimeters.

### Claim 10 (depends on 5)

The method of claim 5, wherein the homogenized color appearance and blue-cut performance level of the blue-cut wafer is based on the blue-cut wafer having a maximum thickness and a minimum thickness within twenty percent of a nominal thickness of the blue-cut wafer.

### Claim 11 (depends on 5)

The method of claim 5, further comprising:
permitting, via the blue-cut wafer, light having a second wavelength range outside the first wavelength range.