# US 10,768,358 B2 · Printed film with mounted light emitting diodes encapsulated in light guide > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,768,358 B2 - Document ID: US10768358B2 - Status: Granted - Kind: B2 - Application number: 15/679,548 - Filed: 2017-08-17 - Published: 2019-02-21 - Granted: 2020-09-08 - Earliest claimed: 2017-08-17 - Assignees: Dura Operating, LLC - Applicants: Dura Operating, LLC - Inventors: Ron G. Gipson - Web page: https://patentgrep.com/patent/US10768358B2 ## CPC - G02B 6/0065: {Manufacturing aspects; Material aspects} - B29C 45/14639: {for obtaining an insulating effect, e.g. for electrical components} - B29C 45/1671: {with an insert} - G02B 6/0043: {provided on the surface of the light guide} - H04W 52/027: {by controlling a display operation or backlight unit} - H05K 1/189: characterised by the use of flexible or folded printed circuits - B29C 45/14065: {Positioning or centering articles in the mould} - B29C 45/14655: {connected to or mounted on a carrier, e.g. lead frame} - B29C 45/14754: {being in movable or releasable engagement with the coating, e.g. bearing assemblies} - B29C 2045/14131: {using positioning or centering means forming part of the insert} - B29C 2045/1477: {Removable inserts, e.g. the insert being peeled off after moulding} - B29K 2995/0025: Opaque - B29K 2995/0026: Transparent - B29L 2011/0075: {Light guides, optical cables} - H03K 2217/960785: with illumination - H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)} - H05K 2201/0108: Transparent - H05K 2201/10106: Light emitting diode [LED] - H05K 2203/1316: Moulded encapsulation of mounted components - Y02D 30/70: in wireless communication networks - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - H04W: WIRELESS COMMUNICATION NETWORKS (broadcast communication H04H; communication systems using wireless links for non-selective communication, e.g. wireless extensions H04M1/72) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES - H03K: PULSE TECHNIQUE (measuring pulse characteristics G01R; modulating sinusoidal oscillations with pulses H03C; transmission of digital information H04L; discriminator circuits detecting phase difference between two signals by counting or integrating cycles of oscillation H03D3/04; automatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses where the type of generator is irrelevant or unspecified H03L; coding, decoding or code conversion, in general H03M) - Y02D: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE ## Abstract A printed film with mounted light emitting diodes encapsulated in a light guide includes a printed film assembly. The printed film assembly includes multiple light emitting diodes. A light guide is injection molded onto a first side of the body covering the light emitting diodes. A light transmissive polymeric material coating layer is applied by injection molding to a second side of the body opposite to the first side. An overmolded component has the printed film assembly embedded therein, with the coating layer exposed for visibility of light from the light emitting diodes when at least one of the light emitting diodes is energized. ## Claims ### Claim 1 A printed film with mounted light emitting diodes encapsulated in a light guide, comprising: a printed film assembly, including: a body having multiple light emitting diodes; a light guide injection molded onto a first side of the body covering the light emitting diodes; a light transmissive polymeric material coating layer applied by injection molding to a second side of the body opposite to the first side; and an overmolded component having the printed film assembly embedded therein, with the coating layer exposed for visibility of light from the light emitting diodes when at least one of the light emitting diodes is energized, wherein the body includes a first end tab extending integrally from the body at a first end of the body, and an oppositely directed second end tab extending integrally from the body at a second end of the body and each of the first end tab and the second end tab are connected to the body by a frangible joint. ### Claim 2 (depends on 1) The printed film with mounted light emitting diodes encapsulated in a light guide of claim 1, wherein each of the first end tab and the second end tab include an aperture. ### Claim 3 (depends on 1) The printed film with mounted light emitting diodes encapsulated in a light guide of claim 1, further including multiple electrical traces of a silver ink printed onto the body and connected to the light emitting diodes. ### Claim 4 (depends on 3) The printed film with mounted light emitting diodes encapsulated in a light guide of claim 3, wherein the body includes multiple light transmissive window frames connected to the electrical traces. ### Claim 5 (depends on 4) The printed film with mounted light emitting diodes encapsulated in a light guide of claim 4, wherein each of the light transmissive window frames includes a set of light transmissive number pairs electrically connected to its associated light transmissive window frame and to the electrical traces. ### Claim 6 (depends on 1) The printed film with mounted light emitting diodes encapsulated in a light guide of claim 1, wherein the light guide is overmolded onto the body in a first region and is omitted in a second region containing a terminal allowing electrical connections to be made to the terminal. ### Claim 7 (depends on 1) The printed film with mounted light emitting diodes encapsulated in a light guide of claim 1, wherein the light guide defines a PMMA material and the overmolded component defines an acrylonitrile butadiene styrene material. ### Claim 8 (depends on 7) The printed film with mounted light emitting diodes encapsulated in a light guide of claim 7, wherein the overmolded component is substantially non-light-transmissive. ### Claim 9 A printed film with mounted light emitting diodes encapsulated in a light guide, comprising: a printed film assembly, including: a body having electrical traces connected to multiple light emitting diodes, and oppositely directed first and second end tabs extending integrally from the body; a light guide injection molded onto a first side of the body covering the light emitting diodes, the light guide having multiple pins integrally connected to the light guide and extending in a direction away from the body; a light transmissive polymeric material coating layer applied by injection molding to a second side of the body opposite to the first side; a substantially non-light-transmissive overmolded component having the printed film assembly embedded therein after removal of the first and second end tabs; and a set of light transmissive number pairs positioned proximate to each of the light emitting diodes, with the coating layer exposed for visibility of the number pairs when at least one of the light emitting diodes is energized, and having at least one of the multiple pins extending at least partially into the overmolded component. ### Claim 10 (depends on 9) The printed film with mounted light emitting diodes encapsulated in a light guide of claim 9, wherein the multiple pins of the light guide define first pins having a first length and second pins defining a second length longer than the first length. ### Claim 11 (depends on 9) The printed film with mounted light emitting diodes encapsulated in a light guide of claim 9, wherein the body includes multiple light transmissive window frames with one of the light transmissive number pairs positioned within each of the window frames. ### Claim 12 (depends on 9) The printed film with mounted light emitting diodes encapsulated in a light guide of claim 9, wherein the second pins extend outwardly of the overmolded component in an as-molded condition. ### Claim 13 (depends on 9) The printed film with mounted light emitting diodes encapsulated in a light guide of claim 9, wherein: the light guide is embedded in the substantially non-light-transmissive overmolded component; and a surface of the coating layer allowing light transmission from the light emitting diodes forms a substantially smooth interface with a surface of the overmolded component. ### Claim 14 (depends on 9) The printed film with mounted light emitting diodes encapsulated in a light guide of claim 9, wherein the electrical traces define a silver ink printed onto the body. ### Claim 15 A method for encapsulating light emitting diodes with a printed film in a light guide, comprising the steps of: connecting multiple light emitting diodes to multiple electrical traces on a body; injection molding a light guide onto a first side of the body covering the light emitting diodes to create a printed film assembly; integrally connecting multiple pins to the light guide during the injection molding step each extending in a direction away from the body; applying a light transmissive polymeric material coating layer by injection molding to a second side of the body opposite to the first side; connecting a set of light transmissive number pairs to the multiple electrical traces on a body; and positioning the multiple light emitting diodes on the body each proximate to one of the number pairs. ### Claim 16 (depends on 15) The method for encapsulating light emitting diodes with a printed film in a light guide of claim 15, further including: positioning the printed film assembly into a mold having the multiple pins contacting an internal surface of the mold such that the multiple pins create a cavity between the printed film assembly and the internal surface; and injecting a substantially non-light-transmissive material into the mold to embed the printed film assembly into the non-light-transmissive material, leaving the coating layer exposed for visibility of the number pairs when at least one of the light emitting diodes is energized, including injecting a portion of the light-transmissive material into the cavity between the printed film assembly and the internal surface.