# US 10,768,069 B2 · Pressure measuring device for protection of pressure sensor from thermomechanical stress

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- Number: US 10,768,069 B2
- Document ID: US10768069B2
- Status: Granted
- Kind: B2
- Application number: 15/537,900
- Filed: 2015-11-18
- Published: 2017-12-07
- Granted: 2020-09-08
- Earliest claimed: 2014-12-22
- Assignees: Endress+Hauser SE+Co.KG
- Applicants: Endress + Hauser GmbH + Co. KG
- Inventors: Daniel Sixtensson; Andreas Guth; Rene Ziermann; Dennis Muller
- Web page: https://patentgrep.com/patent/US10768069B2

## CPC

- G01L 19/146: {using flexible element between the transducer and the support}
- G01L 19/04: Means for compensating for effects of changes of temperature {, i.e. other than electric compensation}
- G01L 19/145: {with stress relieving means}
- G01L 19/147: {Details about the mounting of the sensor to support or covering means}
- G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G)

## Abstract

A pressure measuring device comprises a carrier, a base which is connected to the carrier, and a pressure sensor which is mounted on the base, wherein a bottom base area of the pressure sensor is greater than a top base area of the base, the pressure sensor being protected against thermomechanical stresses by an end of the base, which is facing away from the pressure sensor, the end being adhesively bonded into a recess in the support by an adhesive bond.

## Claims

### Claim 1

Pressure measuring device, having:
a carrier made of a metal; a base connected to said carrier;
a centering device for centering said base;
a pressure sensor mounted on said base wherein a bottom base surface of said pressure sensor is larger than a top base surface of said base, wherein the pressure sensor is mounted onto the top base surface of said base, wherein:
a recess is provided in said carrier;
said recess has a floor surface;
an end, oriented away from said pressure sensor, of said base is glued into said recess in said carrier by means of an adhesive bond;
a bottom base surface of said base is placed on said floor surface of said recess;
said centering device is formed by an inner side surface of said recess, said inner side surface of said recess tapering towards said floor surface of said recess, such that a base area of said recess at said floor surface corresponds to a base area of said bottom base surface of said base; and
said adhesive bond between said carrier and said base extends over an external jacket surface of the end of said base running in said recess, the end of said base is placed on the floor surface of said recess.

### Claim 2 (depends on 1)

The pressure measuring device, according to claim 1, wherein:
said carrier is made of stainless steel.

### Claim 3 (depends on 1)

The pressure measuring device according to claim 1, wherein:
said base has an overall length of from 3 mm to 7.5 mm; and
said end of said base running in said recess has a length greater than or equal to 2.5 mm; and
said end of the base protruding from said recess and bearing said pressure sensor has a length on the order of 0.5 mm.

### Claim 4 (depends on 1)

The pressure measuring device according to claim 1, wherein:
said adhesive bond between said carrier and said base extends over an end surface of said base oriented towards the floor surface of said recess.

### Claim 5 (depends on 4)

The pressure measuring device according to claim 4, wherein:
said base has an overall length on the order of 0.5 to 3 mm.

### Claim 6 (depends on 1)

The pressure measuring device according to claim 1, wherein:
said adhesive bond between said carrier and said base extends over the external circumferential surface of said end of said base running in said recess and an end surface of said base oriented towards the floor surface of said recess.

### Claim 7 (depends on 1)

The pressure measuring device according to claim 1, wherein:
said base is made of stainless steel, Invar, or Kovar, of silicon carbide, or of a ceramic of aluminum oxide, silicon nitride, or aluminum nitride, or of borosilicate glass.

### Claim 8 (depends on 1)

The pressure measuring device according to claim 1, wherein:
said adhesive bond between said base and said carrier comprises an adhesive bond upon epoxy resin, a thermoplastic adhesive, or a silicon rubber.

### Claim 9 (depends on 1)

The pressure measuring device according to claim 1, wherein:
the pressure measuring device is a differential pressure measuring device or an absolute or relative pressure measuring device for measuring pressures greater than or equal to 4 MPa (40 bar); and
said base is made of a stainless steel, Invar, Kovar, or ceramic, aluminum oxide, silicon nitride, silicon carbide, or aluminum nitride having a modulus of elasticity greater than or equal to 200,000 MPa.

### Claim 10 (depends on 1)

The pressure measuring device according to claim 1, wherein:
said base is made of a material that has a coefficient of thermal expansion matched to the coefficient of thermal expansion of said pressure sensor.

### Claim 11 (depends on 1)

The pressure measuring device according to claim 1, wherein:
said base has a length in the range of 0.5 mm to 7.5 mm, an outer diameter in the range of 0.5 mm to 7 mm, and is bar-shaped, or has an inner diameter in the range of 0.25 mm to 4 mm.
