# US 10,768,064 B2 · MEMS pressure gauge sensor and manufacturing method

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- Number: US 10,768,064 B2
- Document ID: US10768064B2
- Status: Granted
- Kind: B2
- Application number: 15/753,131
- Filed: 2016-07-08
- Published: 2018-09-27
- Granted: 2020-09-08
- Earliest claimed: 2015-08-17
- Assignees: Chinese Academy of Sciences Institute of Geology and Geophysics
- Applicants: Institute of Geology and Geophysics, Chinese Academy of Sciences
- Inventors: Kevin Chau; Man Wong
- Web page: https://patentgrep.com/patent/US10768064B2

## CPC

- G01L 9/0052: {of piezoresistive elements (circuits therefor G01L9/06)}
- B81B 3/0072: {For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers}
- B81B 7/0061: {suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound}
- B81C 1/00142: {Bridges (deformable micromirrors G02B26/0841)}
- B81C 1/0015: {Cantilevers (switches using MEMS H01H1/0036; electrostatic relays using micromechanics H01H59/0009; microelectro-mechanical resonators H03H9/02244)}
- B81C 1/00158: {Diaphragms, membranes (manufacture process for semi-permeable inorganic membranes B01D67/0039)}
- B81C 3/001: {Bonding of two components}
- G01B 7/16: for measuring the deformation in a solid, e.g. by resistance strain gauge
- G01L 9/0054: {integral with a semiconducting diaphragm}
- G01L 9/04: of resistance-strain gauges
- B81B 2201/0264: Pressure sensors
- B81B 2203/0109: Bridges
- B81B 2203/0118: Cantilevers
- B81C 2203/0109: Bonding an individual cap on the substrate
- G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G)
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)
- G01B: MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS

## Abstract

The present invention relates to a MEMS pressure sensor die and its fabrication process. The pressure sensor comprises a chamber inside which a MEMS pressure sensor die is provided. The pressure sensor die comprises a handle, a device layer and a cap all connected together. A silicon oxide layer is formed between the handle and the device layer. Another silicon oxide layer is formed between the device layer and the cap. Recesses are respectively formed on the handle and the cap and face each other. The handle recess and the cap recess are connected to form a cavity. The device layer, which spans the cavity, further comprises a bridge on which a plurality of piezoresistive sensing elements are formed. The present pressure sensor is more immune to temperature effects. It is especially suitable for operating in a high temperature, high pressure environment and is capable of delivering accurate and reliable pressure measurements at low cost.

## Claims

### Claim 1

A pressure sensor comprising:
a chamber;
a MEMS pressure sensor die provided within said chamber, said pressure sensor die including a handle, a device layer and a cap all connected together;
a first silicon oxide layer formed between said handle and said device layer;
a second silicon oxide layer formed between said device layer and said cap;
a handle recess formed on said handle;
a cap recess formed on said cap, said handle recess and said cap recess are connected to form a cavity;
said device layer, which is provided within said cavity, further includes a bridge having a first plurality of piezoresistive sensing elements formed on said bridge, and a cantilever having a second plurality of piezoresistive sensing elements formed on said cantilever, each of said piezoresistive sensing elements having a silicon oxide insulating layer formed on a top, a bottom and along sides thereof.

### Claim 2 (depends on 1)

The pressure sensor according to claim 1, wherein said bridge includes two ends that are connected to opposite sides of said cavity.

### Claim 3 (depends on 1)

The pressure sensor according to claim 1, wherein said device layer includes at least one said bridge and one pair of said cantilevers, said cantilevers are parallel to said bridge, two piezoresistive sensing elements formed on said bridge, and one piezoresistive sensing element formed on each said cantilever.

### Claim 4 (depends on 3)

The pressure sensor according to claim 3, wherein said piezoresistive sensing elements are electrically connected in a Wheatstone bridge configuration.

### Claim 5 (depends on 1)

The pressure sensor according to claim 1, wherein said device layer includes at least two said bridges mutually perpendicular to each other, with two piezoresistive sensing elements formed on each said bridge.

### Claim 6 (depends on 5)

The pressure sensor according to claim 5, wherein said piezoresistive sensing elements are electrically connected in a Wheatstone bridge configuration.

### Claim 7 (depends on 1)

The pressure sensor according to claim 1, wherein metal contacts are provided at end point terminals of said piezoresistive sensing element.

### Claim 8 (depends on 1)

The pressure sensor according to claim 1, wherein said pressure sensor die uses a silicon-on-insulator construction;
said silicon-on-insulator construction includes a top silicon layer, a bottom silicon layer, and a buried silicon oxide layer, with a cavity formed in said bottom silicon layer;
wherein said handle is formed in said bottom silicon layer, said device layer is formed in said top silicon layer, and said buried silicon oxide layer is formed between said top silicon layer and said bottom silicon layer.

### Claim 9 (depends on 8)

The pressure sensor according to claim 8, wherein said device layer is formed on a {100} crystallographic plane of p-type silicon, said piezoresistive sensing element is oriented along a <110> crystallographic direction.

### Claim 10 (depends on 8)

The pressure sensor according to claim 8, wherein said device layer is formed on a {100} crystallographic plane of n-type silicon, said piezoresistive sensing element is oriented along a <100> crystallographic direction.

### Claim 11 (depends on 8)

The pressure sensor according to claim 8, wherein said device layer is formed on a 11101 crystallographic plane of p-type silicon, said piezoresistive sensing element is oriented along a <110> or <111> crystallographic direction.

### Claim 12 (depends on 8)

The pressure sensor according to claim 8, wherein said device layer is formed on a 11101 crystallographic plane of n-type silicon, said piezoresistive sensing element is oriented along a <100> crystallographic direction.

### Claim 13 (depends on 8)

The pressure sensor according to claim 8, wherein said device layer is formed on a 11111 crystallographic plane of p-type silicon.

### Claim 14 (depends on 1)

The pressure sensor according to claim 1, wherein said chamber is an enclosure within a metal housing, said chamber is filled with an electrically insulating fluid, and said pressure sensor die is immersed in said electrically insulating fluid.

### Claim 15 (depends on 14)

The pressure sensor according to claim 14, further comprising a metal diaphragm that seals said electrically insulating fluid and said pressure sensor die in said chamber.

### Claim 16 (depends on 15)

The pressure sensor according to claim 15, wherein external pressure to be measured is transmitted from said metal diaphragm to said pressure sensor die.

### Claim 17

A MEMS pressure sensor die fabrication process comprising the following sequential steps:
grow or deposit a silicon oxide layer on a top surface and a bottom surface of a silicon-on-insulator wafer which was prefabricated with buried cavities in a bottom silicon layer;
using photolithography and ion implantation, form highly conductive regions, which are highly doped, on said top silicon layer;
using photolithography and etching, etch trenches through said top silicon layer reaching said buried silicon oxide layer to form piezoresistive sensing elements;
grow or deposit a layer of silicon oxide to fill said trenches;
using photolithography and etching, etch contact holes through said silicon oxide layer on top of said highly conductive regions reaching said top silicon layer;
using metal deposition, photolithography and etching, form metal interconnection patterns from said contact holes to peripheral bond pads;
using photolithography and etching, etch trenches through said top silicon layer and said buried silicon oxide layer punching into said buried cavities in said bottom silicon layer, thus forming said freely suspended bridges and cantilevers;
bond a cap silicon wafer which was prefabricated with recesses to said silicon-on-insulator wafer; and
using wafer dicing, cut the bonded silicon wafer into individual MEMS pressure sensor dice.

### Claim 18 (depends on 17)

The MEMS pressure sensor die fabrication process according to claim 17, wherein the fabrication process for said recesses in said cap silicon wafer includes photolithography and etching.

### Claim 19 (depends on 17)

The MEMS pressure sensor die fabrication process according to claim 17, wherein said etching method includes one kind or a combination of dry and wet etching methods, said dry etching method is selected from one or more of the following methods: deep reactive ion etching, reactive ion etching, or gaseous xenon difluoride etching for silicon; or reactive ion etching, plasma etching, or hydrofluoric acid vapor etching for silicon oxide.

### Claim 20 (depends on 17)

The MEMS pressure sensor die fabrication process according to claim 17, wherein said wet etching method for silicon includes one kind or a combination of the following etchants: potassium hydroxide, tetramethylammonium hydroxide, or ethylenediamine pyrocatechol.

### Claim 21 (depends on 17)

The MEMS pressure sensor die fabrication process according to claim 17, wherein said wet etching method for silicon oxide includes one kind or a combination of the following etchants: hydrofluoric acid or buffered hydrofluoric acid.