# US 10,767,817 B2 · LED light bulb and LED filament thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,767,817 B2 - Document ID: US10767817B2 - Status: Granted - Kind: B2 - Application number: 16/701,170 - Filed: 2019-12-03 - Published: 2020-04-02 - Granted: 2020-09-08 - Earliest claimed: 2015-08-17 - Applicants: Jiaxing Super Lighting Electric Appliance Co., Ltd - Inventors: Tao Jiang; Liqin Li - Web page: https://patentgrep.com/patent/US10767817B2 ## CPC - F21K 9/232: specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb - F21K 9/64: using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 90/00: Package configurations - F21K 9/238: Arrangement or mounting of circuit elements integrated in the light source - F21K 9/90: Methods of manufacture - F21V 3/02: characterised by the shape - F21V 3/061: {the material being glass} - F21V 3/062: {the material being plastics} - F21V 19/003: {Fastening of light source holders, e.g. of circuit boards or substrates holding light sources} - F21Y 2103/33: annular - F21Y 2103/37: U-shaped - F21Y 2107/00: Light sources with three-dimensionally disposed light-generating elements - F21Y 2115/10: Light-emitting diodes [LED] - H10H 20/8511: {characterised by their material, e.g. binder} - H10W 72/534: {being rectangular} - H10W 90/753: {between laterally-adjacent chips} - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED ## Abstract An LED light bulb, comprising: a bulb shell with a lower part and an upper part opposite to the lower part; a bulb base connected with the bulb shell; a heat dissipating element connected with the lower part of the bulb shell and the bulb base, wherein the height of the heat dissipating element is L1 and the maximum height from the heat dissipating element to the upper part of the bulb shell is L2, and the ratio of L1 to L2 is from 1/30 to 1/3; and an LED filament with a plurality of LED chips electrically connected to each other disposed in the bulb shell, two conductive supports, disposed in the bulb shell, a driving circuit, electrically connected with the two conductive supports and the bulb base, a stem disposed in the bulb shell, the LED filament is connected with the stem through the conductive supports. ## Claims ### Claim 1 An LED light bulb, comprising: a bulb shell with a lower part and an upper part opposite to the lower part; a bulb base connected with the bulb shell; a heat dissipating element connected with the lower part of the bulb shell and the bulb base, wherein the height of the heat dissipating element is L1 and the maximum height from the heat dissipating element to the upper part of the bulb shell is L2, the ratio of L1 to L2 is from 1/30 to 1/3; a stem disposed in the bulb shell and coated with a thin film of graphene; and a single flexible LED filament disposed in the bulb shell, the flexible LED filament comprising: a plurality of LED chips electrically connected to each other, the aspect ratio of the LED chips is 2:1 to 10:1; at least two conductive electrodes respectively disposed corresponding to the plurality of LED chips, the conductive electrodes being electrically connected with the plurality of LED chips; a light conversion coating comprising a top layer and a base layer, the top layer of the light conversion coating is disposed on at least two sides of each of the plurality of LED chips and the conductive electrodes; two conductive supports, disposed in the bulb shell and electrically connected with the conductive electrodes; and a driving circuit, electrically connected with the two conductive supports and the bulb base; wherein the flexible LED filament further comprising a plurality of conductive wires electrically and correspondingly connected among the plurality of LED chips and the conductive electrodes, at least one of the plurality of conductive wires being of M shape. ### Claim 2 (depends on 1) The LED light bulb of claim 1, wherein the material of the heat dissipating element is selected from the group consisting of metal, ceramic, and plastic with a good thermal conductivity effect. ### Claim 3 (depends on 2) The LED light bulb of claim 2, wherein the heat dissipating element and the stem is integrally formed in one piece. ### Claim 4 (depends on 1) The LED light bulb of claim 1, wherein the cross-sectional outline of the flexible LED filament is rectangular, triangle, circle, ellipse or square. ### Claim 5 (depends on 3) The LED light bulb of claim 3, wherein the flexible LED filament further comprising a plurality of circuit films for electrically connected adjacent LED chips. ### Claim 6 (depends on 5) The LED light bulb of claim 5, wherein each of the circuit film comprises a thin film and a conductive circuit disposed on the thin film. ### Claim 7 (depends on 6) The LED light bulb of claim 6, wherein the conductive circuits are substantially parallel lines electrically connected with pads of adjacent LED chips. ### Claim 8 (depends on 6) The LED light bulb of claim 6, wherein the conductive circuits are crossover lines electrically connected with pads of adjacent LED chips. ### Claim 9 (depends on 8) The LED light bulb of claim 8, wherein the material of the conductive film is indium tin oxide (ITO), nano-silver plasma, metal grids, or nano-tubes. ### Claim 10 An LED light bulb, comprising: a bulb shell with a lower part and a upper part opposite to the lower part; a bulb base connected with the bulb shell; a heat dissipating element connected with the lower part of the bulb shell and the bulb base, wherein the height of the heat dissipating element is L1 and the maximum height from the heat dissipating element to the upper part of the bulb shell is L2, the ratio of L1 to L2 is from 1/30 to 1/3; a stem disposed in the bulb shell; and coated with a thin film of graphene; and a single flexible LED filament disposed in the bulb shell, the LED filament comprising: a plurality of LED chips electrically connected to each other, the aspect ratio of the LED chips is 2:1 to 10:1; at least two conductive electrodes respectively disposed corresponding to the plurality of LED chips, the conductive electrodes being electrically connected with the plurality of LED chips; a light conversion coating comprising a top layer and a base layer, the top layer of the light conversion coating is disposed on at least two sides of each of the plurality of LED chips and the conductive electrodes; a plurality of supporting arms, nonconductively connected with and supporting the flexible LED filament, each of the supporting arms comprises a first end and a second end, the first end of each is nonconductively connected with the stand while the second end is nonconductively connected with the flexible LED filament, the second end of each of supporting arms has a clamping portion, the flexible LED filament is bent into a wavy shape, and the clamping portions clamp a wave crest and a wave trough of the wavy shape; two conductive supports, disposed in the bulb shell and electrically connected with the conductive electrodes; and a driving circuit, electrically connected with the two conductive supports and the bulb base. ### Claim 11 (depends on 10) The LED light bulb of claim 10, wherein the arc formed by the LED filament is 270 degrees. ### Claim 12 (depends on 11) The LED light bulb of claim 11, wherein the Shore D Hardness of the base layer is at least 60 HD, the hardness of the base layer is higher than the hardness of the top layer. ### Claim 13 (depends on 12) The LED light bulb of claim 12, wherein the material of the heat dissipating element is selected from the group consisting of metal, ceramic, and plastic with a good thermal conductivity effect. ### Claim 14 (depends on 13) The LED light bulb of claim 13, wherein the heat dissipating element and the stem is integrally formed in one piece. ### Claim 15 (depends on 14) The LED light bulb of claim 14, wherein the cross-sectional outline of the flexible LED filament is rectangular, triangle, circle, ellipse or square. ### Claim 16 (depends on 15) The LED light bulb of claim 15, wherein the flexible LED filament further comprising a plurality of circuit films for electrically connected adjacent LED chips. ### Claim 17 (depends on 16) The LED light bulb of claim 16, wherein each of the circuit film comprises a thin film and a conductive circuit disposed on the thin film. ### Claim 18 (depends on 17) The LED light bulb of claim 17, wherein the conductive circuits are crossover lines electrically connected with pads of adjacent LED chips. ### Claim 19 (depends on 18) The LED light bulb of claim 18, wherein the material of the conductive film is indium tin oxide (ITO), nano-silver plasma, metal grids, or nano-tubes.