# US 10,767,641 B2 · Micropump with electrostatic actuation > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,767,641 B2 - Document ID: US10767641B2 - Status: Granted - Kind: B2 - Application number: 15/740,665 - Filed: 2016-07-01 - Published: 2018-07-05 - Granted: 2020-09-08 - Earliest claimed: 2015-07-02 - Assignees: Politecnico Di Milano - Applicants: Politecnico Di Milano - Inventors: Alberto Corigliano; Raffaele Ardito; Emanuele Bertarelli; Marco Ferrera - Web page: https://patentgrep.com/patent/US10767641B2 ## CPC - F04B 43/043: {Micropumps} - F04B 43/025: {two or more plate-like pumping members in parallel} - F04B 45/047: Pumps having electric drive - F04B 49/06: Control using electricity (regulating by means of floats actuating electric switches F04B49/04) - F04B 53/1072: {the valve being an elastic body, the length thereof changing in the opening direction} - F04B: POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS (machines for liquids, or pumps, of rotary-piston or oscillating-piston type F04C; non-positive-displacement pumps F04D; pumping of fluid by direct contact of another fluid or by using inertia of fluid to be pumped F04F) ## Abstract A micropump includes: a pumping chamber, between a first semiconductor substrate and a second semiconductor substrate bonded to each other; an inlet valve, having an inlet shutter element between an inlet passage and the pumping chamber; an outlet valve, having an outlet shutter element between the pumping chamber and an outlet passage; a first recess for housing the inlet shutter element when the inlet valve is in the open configuration, the first recess and the pumping chamber being fluidly coupled; a second recess for housing the outlet shutter element when the outlet valve is in the open configuration, the second recess and the pumping chamber being fluidly decoupled. ## Claims ### Claim 1 A micropump comprising: a first semiconductor substrate, including a first carrier layer made of monocrystalline silicon and a first structural layer made of polycrystalline silicon, the first carrier layer and the first structural layer being mechanically connected to each other and electrically isolated from one another by a first dielectric layer; a second semiconductor substrate including a second carrier layer made of monocrystalline silicon and a second structural layer made of polycrystalline silicon, the second carrier layer and the second structural layer being mechanically connected to each other and electrically isolated from one another by a second silicon oxide dielectric layer, the first semiconductor substrate and the second semiconductor substrate being bonded to each other; a pumping chamber, between the first semiconductor substrate and the second semiconductor substrate; an inlet valve, having an inlet shutter element between an inlet passage and the pumping chamber, the inlet shutter element being connected to one of the first structural layer of the first semiconductor substrate and the second structural layer of the second semiconductor substrate by elastic suspension elements made of semiconductor material, extending in a transverse direction with respect to a direction of movement of the inlet shutter element; an outlet valve, having an outlet shutter element between the pumping chamber and an outlet passage; a first recess fluidly coupled to the pumping chamber and configured to house the inlet shutter element when the inlet valve is in an open configuration, the first recess being defined by a first interruption in one of the first dielectric layer and the second dielectric layer and delimited by the corresponding first carrier layer or second carrier layer; a second recess fluidly decoupled from the pumping chamber and configured to house the outlet shutter element when the outlet valve is in an open configuration, the second recess being defined by a second interruption in one of the first dielectric layer and the second dielectric layer and delimited by the corresponding first carrier layer or second carrier layer; and fluid passages defined between the elastic suspension elements, the first recess being fluidly coupled to the pumping chamber through the fluid passages; wherein the outlet shutter element is connected to the first semiconductor substrate by an elastic valve membrane and the second recess is fluidly decoupled from the pumping chamber by the valve membrane. ### Claim 2 (depends on 1) A micropump according to claim 1, wherein the inlet passage is obtained in one of the first semiconductor substrate or the second semiconductor substrate and the inlet shutter element is connected to the other one of the first semiconductor substrate or the second semiconductor substrate; and the outlet passage is obtained in one of the first semiconductor substrate or the second semiconductor substrate and the outlet shutter element is connected to the other one of the first semiconductor substrate or the second semiconductor substrate. ### Claim 3 (depends on 1) A micropump according to claim 1, wherein the inlet passage and the outlet passage are made either both in the first semiconductor substrate or both in the second semiconductor substrate. ### Claim 4 (depends on 1) A micropump according to claim 1, wherein the inlet passage and the outlet passage extend perpendicularly to the pumping chamber. ### Claim 5 (depends on 1) A micropump according to claim 1, wherein the inlet valve and the outlet valve are of the orthoplanar type. ### Claim 6 (depends on 1) A micropump according to claim 1, wherein the inlet valve and the outlet valve are preloaded so as to remain closed when a pressure difference between the pumping chamber and the inlet passage is lower than a first pressure threshold and when the pressure difference between the outlet passage and the pumping chamber is lower than a second pressure threshold which is higher than the first pressure threshold, respectively. ### Claim 7 (depends on 1) A micropump according to claim 1, comprising: a first pumping membrane made of semiconductor material and delimiting the pumping chamber on a first side; a first electrode structure, capacitively coupled to the first pumping membrane and configured to apply a first electrostatic force to the first pumping membrane in the presence of a first actuating voltage between the first electrode structure and the first pumping membrane; and a control unit, configured to apply the first actuating voltage in the form of a periodic wave at a controlled frequency. ### Claim 8 (depends on 7) A micropump according to claim 7, comprising a third recess, delimited on one side by the first pumping membrane and fluidly decoupled from the pumping chamber, the first electrode structure being arranged on a wall of the third recess opposite to the first pumping membrane and configured to retract the first pumping membrane within the third recess. ### Claim 9 (depends on 7) A micropump according to claim 7, wherein the first electrode structure comprises a plurality of first electrodes and the control unit is configured to apply a respective first actuating voltage to each first electrode. ### Claim 10 (depends on 7) A micropump according to claim 7, comprising: a second pumping membrane made of semiconductor material and delimiting the pumping chamber on a second side opposite to the first side; and a second electrode structure, capacitively coupled to the second pumping membrane and configured to apply a second electrostatic force to the second pumping membrane in response to a second actuating voltage between the second electrode structure and the second pumping membrane; the control unit being configured to supply the second actuating voltage in the form of a periodic wave with a controlled frequency equal to the frequency of the first actuating voltage. ### Claim 11 (depends on 10) A micropump according to claim 10, comprising a fourth recess, delimited on one side by the second pumping membrane and fluidly decoupled from the pumping chamber, the second electrode structure being arranged on a wall of the fourth recess opposite to the second pumping membrane and configured to retract the second pumping membrane within the fourth recess. ### Claim 12 (depends on 10) A micropump according to claim 10, wherein the second electrode structure comprises a plurality of second electrodes and the control unit is configured to apply a respective second actuating voltage to each second electrode. ### Claim 13 (depends on 1) A micropump according to claim 1, comprising an auxiliary electrode structure, arranged on a wall of the second recess opposite to the outlet shutter element, capacitively coupled to the outlet shutter element and configured to apply an auxiliary electrostatic force to the outlet shutter element in the presence of an auxiliary actuating voltage between the auxiliary electrode structure and the outlet shutter element.