# US 10,767,085 B2 · Semiconductor-bonding resin composition, semiconductor-bonding sheet, and semiconductor device using semiconductor-bonding sheet

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- Number: US 10,767,085 B2
- Document ID: US10767085B2
- Status: Granted
- Kind: B2
- Application number: 16/406,124
- Filed: 2019-05-08
- Published: 2019-08-29
- Granted: 2020-09-08
- Earliest claimed: 2016-11-10
- Assignees: KYOCERA Corporation
- Applicants: KYOCERA Corporation
- Inventors: Masakazu Fujiwara; Hiroshi Fukukawa
- Web page: https://patentgrep.com/patent/US10767085B2

## CPC

- C09J 7/10: without carriers
- C09J 9/02: Electrically-conducting adhesives
- C09J 7/38: Pressure-sensitive adhesives [PSA]
- C09J 11/04: inorganic
- C09J 179/04: Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- H01B 1/22: the conductive material comprising metals or alloys
- H10W 72/071: {Connecting or disconnecting}
- C08K 3/041: {Carbon nanotubes}
- C08K 9/02: Ingredients treated with inorganic substances
- C08K 2003/0806: {Silver}
- C08K 2201/001: Conductive additives
- C08K 2201/005: Additives being defined by their particle size in general
- C08K 2201/011: Nanostructured additives
- C09J 2203/326: for bonding electronic components such as wafers, chips or semiconductors
- C09J 2301/314: the adhesive layer and/or the carrier being conductive
- C09J 2301/408: additives as essential feature of the adhesive layer
- C09J 2400/16: Metal
- C09J 2479/00: Presence of polyamine or polyimide
- C09J 2479/08: polyimide
- H10W 72/074: {of anisotropic conductive adhesives}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics}
- H10W 72/354: {comprising polymers}
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)

## Abstract

There is provided a semiconductor-bonding resin composition having excellent thermally conductive property and electrically conductive property and suitable for joining a power semiconductor element and an element support member. There are provided: a semiconductor-bonding resin composition containing (A) a bismaleimide resin including an aliphatic hydrocarbon group on a main chain, (B) a curing agent, (C) a filler containing electrically conductive particles having a specific gravity of 1.1 to 5.0, and (D) silver microparticles having an average particle size of 10 to 300 nm; a semiconductor-bonding sheet obtained using the semiconductor-bonding resin composition; and a semiconductor device including a semiconductor joined by the semiconductor-bonding sheet.

## Claims

### Claim 1

A semiconductor-bonding sheet being a sheet-shaped molded body made of a semiconductor-bonding resin composition, the semiconductor-bonding resin composition containing:
(A) a bismaleimide resin having an aliphatic hydrocarbon group on a main chain;
(B) a curing agent;
(C) a filler containing electrically conductive particles having a specific gravity of 1.1 to 5.0; and
(D) silver microparticles having an average particle size of 10 to 300 nm.

### Claim 2 (depends on 1)

The semiconductor-bonding sheet according to claim 1, wherein the component (A) contains a bismaleimide compound (A1) expressed by the following general formula (1),
where n represents an integer of 1 to 10.

### Claim 3 (depends on 1)

The semiconductor-bonding sheet according to claim 1, wherein the component (A) contains a bismaleimide compound (A2) expressed by the following general formula (2),
where, Q represents a bivalent straight-chained, branch-chained, or cyclic aliphatic hydrocarbon group with 6 or more carbons, P represents a bivalent atom or organic group selected from O, CO, COO, CH2, C(CH3)2, C(CF3)2, S, S2, SO, and SO2 or an organic group containing at least one or more of the atoms or organic groups, and m represents an integer of 1 to 10.

### Claim 4 (depends on 3)

The semiconductor-bonding sheet according to claim 3, wherein the component (A1) and the component (A2) are contained at a ratio of the component (A1) to the component (A2) ranging from 5/95 to 30/70 on a mass basis.

### Claim 5 (depends on 1)

The semiconductor-bonding sheet according to claim 1, wherein the component (C) is silver-coated particles at a silver content percentage of 10 to 60 mass %.

### Claim 6 (depends on 1)

The semiconductor-bonding sheet according to claim 1, wherein the component (C) is silver-coated silica particles.

### Claim 7 (depends on 1)

The semiconductor-bonding sheet according to claim 1, wherein:
a content of the component (B) is 0.1 to 10 parts by mass per 100 parts by mass of the resin being the component (A); and
a total of contents of the component (C) and the component (D) is 40 to 80 mass % of the whole resin composition and a mass ratio of the component (C) and the component (D) is 10:90 to 90:10.

### Claim 8 (depends on 1)

The semiconductor-bonding sheet according to claim 1, further containing (E) a flux component.

### Claim 9 (depends on 1)

The semiconductor-bonding sheet according to claim 1, further containing (F) nanocarbons.

### Claim 10 (depends on 1)

A semiconductor device comprising a semiconductor element joined on a support member via the semiconductor-bonding sheet according to claim 1.