# US 10,767,046 B2 · Polyamide resin molded body > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,767,046 B2 - Document ID: US10767046B2 - Status: Granted - Kind: B2 - Application number: 16/313,331 - Filed: 2017-07-03 - Published: 2019-06-06 - Granted: 2020-09-08 - Earliest claimed: 2016-07-04 - Assignees: Asahi Kasei Kabushiki Kaisha - Applicants: Asahi Kasei Kabushiki Kaisha - Inventors: Tetsuo Kurihara; Hiroshi Oyamada; Yasuo Kawaji - Web page: https://patentgrep.com/patent/US10767046B2 ## CPC - C08L 77/02: Polyamides derived from omega-amino carboxylic acids or from lactams thereof (C08L77/10 takes precedence) - C08L 27/12: containing fluorine atoms - C08L 27/18: Homopolymers or copolymers or tetrafluoroethene - C08L 77/00: Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain (of polyhydrazides C08L79/06; of polyamideimides or polyamide acids C08L79/08); Compositions of derivatives of such polymers - C08L 77/06: Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) - C10M 169/041: {the additives being macromolecular compounds only} - C10M 2201/081: containing halogen - C10M 2213/062: Polytetrafluoroethylene [PTFE] - C10M 2217/0443: used as base material - C10N 2020/06: Particles of special shape or size - C10N 2030/02: Pour-point; Viscosity index - C10N 2030/06: Oiliness; Film-strength; Anti-wear; Resistance to extreme pressure - C10N 2050/025: {in the form of films or sheets} - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C10M: LUBRICATING COMPOSITIONS (well drilling compositions C09K8/02); USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION (mould release, i.e. separating, agents for metals B22C3/00, for plastics or substances in a plastic state, in general B29C33/56, for glass C03B40/02; textile lubricating compositions D06M11/00, D06M13/00, D06M15/00; immersion oils for microscopy G02B21/33) - C10N: INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS ## Abstract A polyamide resin molded body is formed by a resin composition having a (B) fluorine series resin within a range from 1 to 15 parts by mass with respect to 100 parts by mass of a (A) polyamide resin. In the resin composition, the number average particle diameter of the fluorine series resin dispersed in the polyamide resin is 0.8 μm or less. The resin composition includes particles of the (B) fluorine series resin having particle diameters of 0.8 μm or greater. The percentage of particles having particle diameters of 0.8 μm or greater which are secondary particles while maintaining the form of primary particles is 60% or greater, and/or the degree of crystallinity of the dispersed (B) fluorine series resin is 42 J/g or greater. ## Claims ### Claim 1 A polyamide resin molded body formed by a resin composition comprising: a (A) polyamide resin; and a (B) fluorine series resin being particles dispersed in the (A) polyamide resin; wherein the content of the (B) fluorine series resin being from 1 to 15 parts by mass with respect to 100 parts by mass of the (A) polyamide resin; the number average particle diameter of the (B) fluorine series resin particles being 0.8 μm or less and at least one of (i) and (ii) is satisfied: (i) particles having particle diameters of 0.8 μm or greater of the dispersed fluorine resin particles (B) being one or more selected from the group consisting of primary particles, secondary particles aggregated and maintained in the form of primary particles, and secondary particles aggregated and not maintained in the form of primary particles, and numerically consisting of no less than 60% of secondary particles aggregated and maintained in the form of primary particles, (ii) the degree of crystallinity of the dispersed (B) fluorine series resin being 42 J/g or greater. ### Claim 2 (depends on 1) The polyamide resin molded body as defined in claim 1, wherein: the distances between adjacent particles of the (B) fluorine series resin particles are 3 μm or less. ### Claim 3 (depends on 1) The polyamide resin molded body as defined in claim 1, wherein: the (B) fluorine series resin is polytetrafluoroethylene. ### Claim 4 (depends on 1) The polyamide resin molded body as defined in claim 1, wherein: the (B) fluorine series resin particles have a number average primary particle diameter within a range from 0.1 to 0.8 μm. ### Claim 5 (depends on 1) The polyamide resin molded body as defined in claim 1, wherein: the number of particles having particle diameters of 1.0 μm or less is 70% or greater. ### Claim 6 (depends on 1) The polyamide resin molded body as defined in claim 1, wherein: the (A) polyamide resin is a polyamide resin having a polyamide selected from a group consisting of polyamide 66, polyamide 6, polyamide 610, and polyamide 612 as its principal component. ### Claim 7 (depends on 1) The polyamide resin molded body as defined in claim 1, wherein: the relative viscosity in sulfuric acid of the (A) polyamide resin is within a range from 3.2 to 4.5. ### Claim 8 (depends on 2) The polyamide resin molded body as defined in claim 2, wherein: the (B) fluorine series resin is polytetrafluoroethylene. ### Claim 9 (depends on 2) The polyamide resin molded body as defined in claim 2, wherein: the (B) fluorine series resin particles have a number average primary particle diameter within a range from 0.1 to 0.8 μm before being dispersed in the (A) polyamide resin. ### Claim 10 (depends on 2) The polyamide resin molded body as defined in claim 2, wherein: the number of particles having particle diameters of 1.0 μm or less is 70% or greater. ### Claim 11 (depends on 2) The polyamide resin molded body as defined in claim 2, wherein: the (A) polyamide resin is a polyamide resin having a polyamide selected from a group consisting of polyamide 66, polyamide 6, polyamide 610, and polyamide 612 as its principal component. ### Claim 12 (depends on 2) The polyamide resin molded body as defined in claim 2, wherein: the relative viscosity in sulfuric acid of the (A) polyamide resin is within a range from 3.2 to 4.5. ### Claim 13 (depends on 3) The polyamide resin molded body as defined in claim 3, wherein: the (B) fluorine series resin particles have a number average primary particle diameter within a range from 0.1 to 0.8 μm before being dispersed in the (A) polyamide resin. ### Claim 14 (depends on 3) The polyamide resin molded body as defined in claim 3, wherein: the number of particles having particle diameters of 1.0 μm or less is 70% or greater. ### Claim 15 (depends on 3) The polyamide resin molded body as defined in claim 3, wherein: the (A) polyamide resin is a polyamide resin having a polyamide selected from a group consisting of polyamide 66, polyamide 6, polyamide 610, and polyamide 612 as its principal component. ### Claim 16 (depends on 3) The polyamide resin molded body as defined in claim 3, wherein: the relative viscosity in sulfuric acid of the (A) polyamide resin is within a range from 3.2 to 4.5. ### Claim 17 (depends on 4) The polyamide resin molded body as defined in claim 4, wherein: the (B) fluorine series resin particles have a number average primary particle diameter within a range from 0.1 to 0.8 μm before being dispersed in the (A) polyamide resin. ### Claim 18 (depends on 4) The polyamide resin molded body as defined in claim 4, wherein: the number of particles having particle diameters of 1.0 μm or less is 70% or greater. ### Claim 19 (depends on 4) The polyamide resin molded body as defined in claim 4, wherein: the (A) polyamide resin is a polyamide resin having a polyamide selected from a group consisting of polyamide 66, polyamide 6, polyamide 610, and polyamide 612 as its principal component. ### Claim 20 (depends on 4) The polyamide resin molded body as defined in claim 4, wherein: the relative viscosity in sulfuric acid of the (A) polyamide resin is within a range from 3.2 to 4.5.