# US 10,766,679 B2 · Thermoformable multilayer films and blister packs produced therefrom

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,766,679 B2
- Document ID: US10766679B2
- Status: Granted
- Kind: B2
- Application number: 14/745,090
- Filed: 2015-06-19
- Published: 2015-10-08
- Granted: 2020-09-08
- Earliest claimed: 2009-09-01
- Assignees: Philip Morris USA Inc.
- Applicants: Philip Morris USA Inc.
- Inventors: Stephen J. Bellamah; Ed Carmines; Rangaraj S. Sundar
- Web page: https://patentgrep.com/patent/US10766679B2

## CPC

- B65D 65/40: Applications of laminates for particular packaging purposes {(B65D1/0215, B65D1/28, B65D3/22, B65D5/0281, B65D5/563, B65D9/30, B65D29/02, B65D31/02, B65D75/26, B65D77/2024, B65D81/1275, B65D81/3811, B65D81/3823, B65D81/3834, B65D81/3846, B65D81/3858, B65D81/3874, B65D81/3886, B65D81/3897 take precedence; laminates per se or laminated packages characterised by the composition or)}
- B05D 7/56: {Three layers or more}
- B29C 48/21: the layers being joined at their surfaces
- B32B 3/28: characterised by a layer comprising a deformed thin sheet {, i.e. the layer having its entire thickness deformed out of the plane}, e.g. corrugated, crumpled (B32B29/08 takes precedence)
- B32B 7/05: the layers not being connected over the whole surface, e.g. discontinuous connection or patterned connection (using interposed adhesives or bonding materials applied in spaced arrangements B32B7/14)
- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- B32B 15/08: of synthetic resin
- B32B 15/20: comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)}
- B32B 27/08: of synthetic resin
- B32B 27/10: of paper or cardboard
- B32B 27/302: {comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers}
- B32B 27/304: {comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF}
- B32B 27/32: comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)}
- B32B 27/322: {comprising halogenated polyolefins, e.g. PTFE}
- B32B 27/325: {comprising polycycloolefins}
- B32B 27/34: comprising polyamides
- B32B 27/36: comprising polyesters
- B32B 27/40: comprising polyurethanes
- B65D 75/327: {and forming several compartments}
- B65D 75/367: {and forming several compartments}
- C23C 18/1633: {Process of electroless plating}
- C25D 7/0614: {Strips or foils}
- A61J 1/035: {Blister-type containers (blisters in general B65D75/36)}
- B29K 2023/12: {PP, i.e. polypropylene}
- B29K 2023/38: {Polymers of cycloalkenes, e.g. norbornene or cyclopentene}
- B29K 2027/06: PVC, i.e. polyvinylchloride
- B29K 2067/003: {PET, i.e. poylethylene terephthalate}
- B29L 2031/7164: {Blister packages}
- B32B 2255/10: on synthetic resin layer or on natural or synthetic rubber layer
- B32B 2255/205: Metallic coating
- B32B 2270/00: Resin or rubber layer containing a blend of at least two different polymers
- B32B 2307/306: Resistant to heat
- B32B 2307/518: bi-axially
- B32B 2307/714: Inert, i.e. inert to chemical degradation, corrosion
- B32B 2307/72: Density
- B32B 2307/7246: Water vapor barrier
- B32B 2307/75: Printability
- B32B 2435/02: for containers
- B32B 2439/40: Closed containers
- B32B 2439/80: Medical packaging
- Y10T 156/10: Methods of surface bonding and/or assembly therefor
- Y10T 428/263: Coating layer not in excess of 5 mils thick or equivalent
- Y10T 428/264: Up to 3 mils
- Y10T 428/265: 1 mil or less
- Y10T 428/3154: Of fluorinated addition polymer from unsaturated monomers
- B65D: CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02)
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- A61J: CONTAINERS SPECIALLY ADAPTED FOR MEDICAL OR PHARMACEUTICAL PURPOSES; DEVICES OR METHODS SPECIALLY ADAPTED FOR BRINGING PHARMACEUTICAL PRODUCTS INTO PARTICULAR PHYSICAL OR ADMINISTERING FORMS; DEVICES FOR ADMINISTERING FOOD OR MEDICINES ORALLY; BABY COMFORTERS; DEVICES FOR RECEIVING SPITTLE
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A multi-layer film structure for use in forming blister packaging. The multi-layer structure includes a first polymeric layer having a first surface and a second surface, the first polymeric layer comprising a metalized polyethylene teraphthalate, a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer disposed adjacent the second surface of the first polymeric layer, the second polymeric layer comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer disposed adjacent the second surface of the second polymeric layer, the third polymeric layer comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure and a packaging structure are also provided.

## Claims

### Claim 1

A method of making a multi-layer film structure, the method comprising:
forming a first polymeric layer having a first surface and a second surface, the first polymeric layer including a metalized polyethylene teraphthalate;
forming a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer positioned adjacent the second surface of the first polymeric layer, the second polymeric layer including a cyclic olefin;
forming a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer positioned adjacent the second surface of the third polymeric layer, the third polymeric layer including polypropylene or polyvinyl chloride;
forming a lid-stock film arranged between a flat film and the multi-layer film structure, the lid-stock film configured to provide support;
thermoforming the multi-layer film structure to define a plurality of domed receptacle portions; and
covering a plurality of cavities defined by the plurality of domed receptacle portions with the flat film, a flat surface of the flat film extending over each of the plurality of cavities, and the flat film including a metallic foil.

### Claim 2 (depends on 1)

The method of claim 1,
wherein the step of forming the first polymeric layer comprises extruding the first polymeric layer to form the first polymeric layer,
the step of forming the second polymeric layer comprises extruding the second polymeric layer to form the second polymeric layer, and
the step of forming the third polymeric layer comprises extruding the third polymeric layer to form the third polymeric layer.

### Claim 3 (depends on 1)

The method of claim 1, wherein the multi-layer film is coextruded.

### Claim 4 (depends on 1)

The method of claim 1, wherein the forming the first polymeric layer, the forming the second polymeric layer, and the forming the third polymeric layer form the multi-layer film structure having a laminated construction.

### Claim 5 (depends on 1)

The method of claim 1, further comprising:
positioning a first tie layer between the second surface of the first polymeric layer and the first surface of the second polymeric layer; and
positioning a second tie layer between the second surface of the second polymeric layer and the first surface of the third polymeric layer.

### Claim 6 (depends on 5)

The method of claim 5, wherein the first tie layer and the second tie layer each include an adhesive lacquer.

### Claim 7 (depends on 1)

The method of claim 1, wherein the cyclic olefin includes a cyclo-olefin copolymer.

### Claim 8 (depends on 7)

The method of claim 7, wherein the cyclo-olefin copolymer is a copolymer of norbornene and ethylene.

### Claim 9 (depends on 1)

The method of claim 1, further comprising: forming a metalized layer on the first polymeric layer.

### Claim 10 (depends on 9)

The method of claim 9, further comprising:
forming the metalized layer on the first polymeric layer by vacuum deposition, indirect metallization, electro-less plating, electrolytic plating, lacquer painting, or a sub-combination thereof, or a combination thereof.

### Claim 11

A thermoformed blister package comprising:
a multi-layer film structure, the multi-layer film structure including,
a first polymeric layer having a first surface and a second surface, the first polymeric layer including,
a metalized polyethylene terephthalate,
a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer adjacent the second surface of the first polymeric layer, the second polymeric layer including,
a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and
a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer adjacent the second surface of the second polymeric layer, the third polymeric layer including,
polypropylene or polyvinyl chloride,
wherein the multi-layer film structure is thermoformed to define a plurality of domed receptacle portions;
a flat film including a metallic foil, the flat film covering cavities defined by the plurality of domed receptacle portions, and a flat surface of the flat film extending over each of the cavities defined by the plurality of domed receptacle portions; and
a lid-stock film arranged between the flat film and the multi-layer film structure, the lid-stock film configured to provide support.

### Claim 12 (depends on 11)

The blister package of claim 11, wherein the domed receptacle portions contain compressed tobacco products in the form of tablets or the like.

### Claim 13 (depends on 11)

The blister package of claim 11, in which a metalized layer is formed on the first polymeric layer.

### Claim 14 (depends on 11)

The blister package of claim 11, in which a metalized layer is formed on the first polymeric layer by one of vacuum deposition, indirect metallization, electro-less plating, electrolytic plating, lacquer painting, or a sub-combination thereof, or a combination thereof.

### Claim 15 (depends on 11)

The blister package of claim 11, in which the metal of the metalized polyethylene terephthalate layer includes one of aluminum, copper, silver, gold, brass, bronze, or a sub-combination thereof, or a combination thereof.

### Claim 16 (depends on 11)

The blister package of claim 11, wherein the flat film is adjacent to a portion of the third polymeric layer.

### Claim 17 (depends on 11)

The blister package of claim 11, wherein the multi-layer film structure further comprises:
a tie layer between the second surface of the first polymeric layer and the first surface of the second polymeric layer.

### Claim 18 (depends on 17)

The blister package of claim 17, wherein the tie layer includes an adhesive lacquer.

### Claim 19 (depends on 11)

The blister package of claim 11, wherein the multi-layer film structure further comprises:
a tie layer between the second surface of the second polymeric layer and the first surface of the third polymeric layer.

### Claim 20 (depends on 19)

The blister package of claim 19, wherein the tie layer includes an adhesive lacquer.

### Claim 21 (depends on 11)

The blister package of claim 11, wherein the metallic foil is frangible.