# US 10,766,238 B2 · Method of manufacturing multilayer substrate

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- Number: US 10,766,238 B2
- Document ID: US10766238B2
- Status: Granted
- Kind: B2
- Application number: 16/152,824
- Filed: 2018-10-05
- Published: 2019-04-25
- Granted: 2020-09-08
- Earliest claimed: 2017-10-20
- Assignees: Denso Corporation
- Applicants: Denso Corporation
- Inventors: Yoshihito Takahashi; Daisuke Ito
- Web page: https://patentgrep.com/patent/US10766238B2

## CPC

- B32B 37/06: characterised by the heating method
- B32B 27/08: of synthetic resin
- B32B 27/38: comprising epoxy resins
- B32B 37/182: {one or more of the layers being plastic}
- H05K 3/462: {characterized by laminating only or mainly similar double-sided circuit boards}
- H05K 3/4644: {by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602)}
- B32B 2255/10: on synthetic resin layer or on natural or synthetic rubber layer
- B32B 2255/205: Metallic coating
- B32B 2260/021: Fibrous or filamentary layer
- B32B 2260/046: Synthetic resin
- B32B 2262/101: Glass fibres
- B32B 2457/08: PCBs, i.e. printed circuit boards
- H05K 3/4638: {Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits}
- H05K 2203/0195: Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
- H05K 2203/068: Features of the lamination press or of the lamination process, e.g. using special separator sheets
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A method of manufacturing a multilayer substrate includes preparing a plurality of substrates, stacking the substrates with bonding sheets interposed, and a first bonding process of bonding the substrates to each other by partially heating the stacked substrates by a heater and partially melting the bonding sheet. Each of the substrates is provided with a through-hole and a metal film covering an inner peripheral surface of the through-hole. In the first bonding process, the metal film is heated by the heater and heat is transferred from the heater to the bonding sheet via the metal film.

## Claims

### Claim 1

A method of manufacturing a multilayer substrate, the method comprising:
preparing a plurality of substrates;
stacking the substrates with bonding sheets interposed; and
a first bonding process of bonding the substrates to each other by partially heating the stacked substrates by a heater and partially melting the bonding sheets, wherein:
each of the substrates is provided with a through-hole and a metal film covering an inner peripheral surface of the through-hole; and
in the first bonding process, the metal film on an outermost substrate is heated by the heater and heat is transferred from the heater to the bonding sheet adjacent the outermost substrate via the metal film, wherein:
the heater has a heater head;
in the first bonding process, the heated heater head is brought into contact with a region including the through-hole of the outermost substrate,
the heater head is provided with a contact surface and a protruding portion protruding from the contact surface; and
in the first bonding process, when the heater head is brought into contact with the region including the through-hole, the contact surface comes into contact with the substrate or the metal film, and the protruding portion is disposed in the through-hole.

### Claim 2 (depends on 1)

The method according to claim 1, wherein:
the metal film extends to the outside of the through-hole on both sides of the substrate; and
in the first bonding process, the metal film on the outermost substrate is in contact with both the heater head and the bonding sheet adjacent the outermost substrate.

### Claim 3 (depends on 1)

The method according to claim 1, further comprising a second bonding process of bonding the substrates to each other by entirely pressing the stacked substrates with a pair of heating platens, and entirely melting the bonding sheets, after the first bonding process.

### Claim 4 (depends on 1)

The method according to claim 1, wherein:
each of the substrates and the bonding sheets is further provided with a positioning hole; and
when the substrates are stacked, the substrate and the bonding sheet are alternately stacked while a positioning pin is inserted into the positioning hole, and the first bonding process is performed in a state where the substrates and the bonding sheets are supported by the positioning pin.

### Claim 5 (depends on 1)

The method according to claim 1, wherein at least one of a number and an arrangement of the through-holes differs between at least two of the substrates.