# US 10,766,233 B2 · Laminate, method for producing substrate with patterned plated layer, method for producing metal layer-containing laminate, touch panel sensor, and touch panel > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,766,233 B2 - Document ID: US10766233B2 - Status: Granted - Kind: B2 - Application number: 16/132,503 - Filed: 2018-09-17 - Published: 2019-01-17 - Granted: 2020-09-08 - Earliest claimed: 2016-03-23 - Assignees: FUJIFILM Corporation - Applicants: FUJIFILM Corporation - Inventors: Naoki Tsukamoto - Web page: https://patentgrep.com/patent/US10766233B2 ## CPC - B32B 27/28: comprising synthetic resins not wholly covered by any one of the sub-groups {B32B27/30 - B32B27/42} - B32B 7/06: permitting easy separation - B32B 7/12: using interposed adhesives or interposed materials with bonding properties - B32B 9/005: {comprising one layer of ceramic material, e.g. porcelain, ceramic tile (layered products with at least two ceramic layers composed mainly of ceramic B32B18/00)} - B32B 9/045: {of synthetic resin} - B32B 17/06: comprising glass as the main or only constituent of a layer, next to another layer of a specific {material} - B32B 23/08: of synthetic resin - B32B 27/00: Layered products comprising {a layer of} synthetic resin {(fibrous or filamentary layer made of a synthetic resin B32B5/02; particulate layer made of a synthetic resin B32B5/16; foamed layer made of a synthetic resin B32B5/18)} - B32B 27/08: of synthetic resin - B32B 27/18: characterised by the use of special additives - B32B 27/285: {comprising polyethers} - B32B 27/286: {comprising polysulphones; polysulfides} - B32B 27/304: {comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF} - B32B 27/308: {comprising acrylic (co)polymers} - B32B 27/32: comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)} - B32B 27/325: {comprising polycycloolefins} - B32B 27/34: comprising polyamides - B32B 27/36: comprising polyesters - B32B 27/365: {comprising polycarbonates} - B32B 27/40: comprising polyurethanes - C08J 5/18: Manufacture of films or sheets - C08J 7/0423: {with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder} - C08J 7/043: Improving the adhesiveness of the coatings per se, e.g. forming primers (adhesives in the form of films or foils characterised by the primer layers between the polymer carriers and the adhesives C09J7/50) - C08J 7/046: Forming abrasion-resistant coatings; Forming surface-hardening coatings - C08L 67/02: Polyesters derived from dicarboxylic acids and dihydroxy compounds (C08L67/06 takes precedence) - C08L 69/00: Compositions of polycarbonates; Compositions of derivatives of polycarbonates - G03F 7/027: Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence) - G03F 7/033: the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers - G03F 7/0388: {with ethylenic or acetylenic bands in the side chains of the photopolymer} - G03F 7/11: having cover layers or intermediate layers, e.g. subbing layers {(G03F7/091 - G03F7/093, B41N3/03 take precedence)} - B32B 2255/10: on synthetic resin layer or on natural or synthetic rubber layer - B32B 2255/205: Metallic coating - B32B 2255/26: Polymeric coating - B32B 2255/28: Multiple coating on one surface - B32B 2307/202: Conductive - B32B 2307/732: Dimensional properties - B32B 2307/748: Releasability - B32B 2457/08: PCBs, i.e. printed circuit boards - B32B 2457/14: Semiconductor wafers - B32B 2457/202: LCD, i.e. liquid crystal displays - B32B 2457/206: Organic displays, e.g. OLED - B32B 2457/208: Touch screens - C08J 2367/02: Polyesters derived from dicarboxylic acids and dihydroxy compounds; (C08J2367/06 takes precedence) - C08J 2433/14: of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - C08J: WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H (working, e.g. shaping, of plastics B29) - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) ## Abstract The present invention provides a laminate with which a metal layer-containing laminate with the occurrence of pattern thickening being suppressed can be obtained. Further, the present invention provides methods for producing a substrate with a patterned plated layer and a metal layer-containing laminate, as well as a touch panel sensor and a touch panel. The laminate of the present invention is a laminate including a substrate, a plated layer forming layer, and a temporary protective film in this order, in which the plated layer forming layer contains a polymerization initiator and Compound X or Composition Y, and an absorption edge λ0 on the long wavelength side of an ultraviolet-visible absorption spectrum of the temporary protective film, an absorption edge λ1 on the long wavelength side of an ultraviolet-visible absorption spectrum of the polymerization initiator, and an absorption edge λ2 on the long wavelength side of an ultraviolet-visible absorption spectrum of the substrate satisfy the relationship represented by Expression (Z). ## Claims ### Claim 1 A laminate comprising, in order: a substrate; a plated layer forming layer; and a temporary protective film, wherein the plated layer forming layer contains a polymerization initiator and Compound X or Composition Y shown below, and an absorption edge λ0 on the long wavelength side of an ultraviolet-visible absorption spectrum of the temporary protective film, an absorption edge λ1 on the long wavelength side of an ultraviolet-visible absorption spectrum of the polymerization initiator, an absorption edge λ2 on the long wavelength side of an ultraviolet-visible absorption spectrum of the substrate satisfy the relationship represented by Expression (Z), the substrate contains an ultraviolet absorber, λ0<λ1<λ2 Expression (Z): Compound X: a compound containing a functional group capable of interacting with a plating catalyst or a precursor thereof, and a polymerizable group, and Composition Y: a composition including a compound containing a functional group capable of interacting with a plating catalyst or a precursor thereof, and a compound containing a polymerizable group. ### Claim 2 (depends on 1) The laminate according to claim 1, wherein the substrate is a resin substrate containing a resin P1 and the resin P1 contains an aromatic group, and the temporary protective film is a film containing a resin P2 and the resin P2 does not contain an aromatic group. ### Claim 3 (depends on 2) The laminate according to claim 2, wherein the resin P1 contains at least one selected from the group consisting of polyethylene terephthalate and polycarbonate. ### Claim 4 (depends on 3) The laminate according to claim 3, wherein the resin P1 is polyethylene terephthalate. ### Claim 5 (depends on 1) A method for producing a substrate with a patterned plated layer, comprising: a step of irradiating the plated layer forming layer with light in a patternwise manner from the temporary protective film side in the laminate according to claim 1; a step of removing the temporary protective film on the plated layer forming layer; and a step of removing a region not irradiated with light in the plated layer forming layer to form a patterned plated layer on the substrate. ### Claim 6 (depends on 1) A method for producing a metal layer-containing laminate, comprising: a step of irradiating the plated layer forming layer with light in a patternwise manner from the temporary protective film side in the laminate according to claim 1; a step of removing the temporary protective film on the plated layer forming layer; a step of removing a region not irradiated with light in the plated layer forming layer to form a patterned plated layer on the substrate; and a step of applying a plating catalyst or a precursor thereof to the patterned plated layer and subjecting the patterned plated layer to which the plating catalyst or the precursor thereof is applied to a plating treatment to form a metal layer on the patterned plated layer. ### Claim 7 (depends on 6) A touch panel sensor comprising: a metal layer-containing laminate obtained by the production method according to claim 6. ### Claim 8 (depends on 6) A touch panel comprising: a metal layer-containing laminate obtained by the production method according to claim 6. ### Claim 9 (depends on 2) A method for producing a substrate with a patterned plated layer, comprising: a step of irradiating the plated layer forming layer with light in a patternwise manner from the temporary protective film side in the laminate according to claim 2; a step of removing the temporary protective film on the plated layer forming layer; and a step of removing a region not irradiated with light in the plated layer forming layer to form a patterned plated layer on the substrate. ### Claim 10 (depends on 3) A method for producing a substrate with a patterned plated layer, comprising: a step of irradiating the plated layer forming layer with light in a patternwise manner from the temporary protective film side in the laminate according to claim 3; a step of removing the temporary protective film on the plated layer forming layer; and a step of removing a region not irradiated with light in the plated layer forming layer to form a patterned plated layer on the substrate. ### Claim 11 (depends on 4) A method for producing a substrate with a patterned plated layer, comprising: a step of irradiating the plated layer forming layer with light in a patternwise manner from the temporary protective film side in the laminate according to claim 4; a step of removing the temporary protective film on the plated layer forming layer; and a step of removing a region not irradiated with light in the plated layer forming layer to form a patterned plated layer on the substrate. ### Claim 12 (depends on 2) A method for producing a metal layer-containing laminate, comprising: a step of irradiating the plated layer forming layer with light in a patternwise manner from the temporary protective film side in the laminate according to claim 2; a step of removing the temporary protective film on the plated layer forming layer; a step of removing a region not irradiated with light in the plated layer forming layer to form a patterned plated layer on the substrate; and a step of applying a plating catalyst or a precursor thereof to the patterned plated layer and subjecting the patterned plated layer to which the plating catalyst or the precursor thereof is applied to a plating treatment to form a metal layer on the patterned plated layer. ### Claim 13 (depends on 3) A method for producing a metal layer-containing laminate, comprising: a step of irradiating the plated layer forming layer with light in a patternwise manner from the temporary protective film side in the laminate according to claim 3; a step of removing the temporary protective film on the plated layer forming layer; a step of removing a region not irradiated with light in the plated layer forming layer to form a patterned plated layer on the substrate; and a step of applying a plating catalyst or a precursor thereof to the patterned plated layer and subjecting the patterned plated layer to which the plating catalyst or the precursor thereof is applied to a plating treatment to form a metal layer on the patterned plated layer. ### Claim 14 (depends on 4) A method for producing a metal layer-containing laminate, comprising: a step of irradiating the plated layer forming layer with light in a patternwise manner from the temporary protective film side in the laminate according to claim 4; a step of removing the temporary protective film on the plated layer forming layer; a step of removing a region not irradiated with light in the plated layer forming layer to form a patterned plated layer on the substrate; and a step of applying a plating catalyst or a precursor thereof to the patterned plated layer and subjecting the patterned plated layer to which the plating catalyst or the precursor thereof is applied to a plating treatment to form a metal layer on the patterned plated layer.