# US 10,766,103 B2 · Solder alloy, solder and method for producing same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,766,103 B2 - Document ID: US10766103B2 - Status: Granted - Kind: B2 - Application number: 16/266,563 - Filed: 2019-02-04 - Published: 2019-09-05 - Granted: 2020-09-08 - Earliest claimed: 2018-02-07 - Assignees: Shanghai Phichem Material Co., Ltd. - Applicants: Shanghai Phichem Material Co., Ltd. - Inventors: Yongchang Zhou - Web page: https://patentgrep.com/patent/US10766103B2 ## CPC - B23K 35/262: {Sn as the principal constituent} - B23K 35/0244: {Powders, particles or spheres; Preforms made therefrom} - C22C 13/00: Alloys based on tin - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - C22C: ALLOYS (treatment of alloys C21D, C22F) ## Abstract The present invention discloses a solder alloy, solder and a method for producing the same, and belongs to the field of solder. The solder alloy contains 0.9-4.1 wt % of silver, 0.3-1 wt % of copper, 0.02-0.085 wt % of rhodium, and the balance being tin, based on the total weight of the solder alloy being 100 wt %. After the solder formed by the solder alloy of the present invention is subjected to multiple reflows and tested by a ball shear test, the residual tin in the solder joint could reach at least 95%, which meets the ball shear standards required by AEC-Q100. ## Claims ### Claim 1 A solder alloy, comprising: 0.9-4.1 wt % of silver, 0.3-0.7 wt % of copper, 0.02-0.085 wt % of rhodium, and the balance of wt % being substantially tin, based on the total weight of the solder alloy being 100 wt %. ### Claim 2 (depends on 1) The solder alloy according to claim 1, wherein the content of the rhodium is 0.03-0.075 wt %. ### Claim 3 (depends on 1) The solder alloy according to claim 1, wherein the content of the copper is 0.4-0.6 wt %. ### Claim 4 (depends on 1) The solder alloy according to claim 1, further containing 0.04-0.06 wt % of nickel, based on the total weight of the solder alloy being 100 wt %. ### Claim 5 (depends on 4) The solder alloy according to claim 4, wherein the content of the nickel is 0.045-0.055 wt %. ### Claim 6 (depends on 1) The solder alloy according to claim 1, further containing 2-4 wt % of bismuth, based on the total weight of the solder alloy being 100 wt %. ### Claim 7 (depends on 6) The solder alloy according to claim 6, wherein the content of the bismuth is 2.9-3.1 wt %. ### Claim 8 (depends on 1) The solder alloy according to claim 1, containing 0.9-4.1 wt % of silver, 0.3-0.7 wt % of copper, 0.02-0.085 wt % of rhodium, 0.04-0.06 wt % of nickel, 2-4 wt % of bismuth, and the balance being tin, based on the total weight of the solder alloy being 100 wt %. ### Claim 9 (depends on 8) The solder alloy according to claim 8, containing 0.9-4.1 wt % of silver, 0.4-0.6 wt % of copper, 0.03-0.075 wt % of rhodium, 0.045-0.055 wt % of nickel, 2.9-3.1 wt % of bismuth, and the balance being tin, based on of the total weight of the solder alloy being 100 wt %. ### Claim 10 Solder being formed by a solder alloy comprising 0.9-4.1 wt % of silver, 0.3-0.7 wt % of copper, 0.02-0.085 wt % of rhodium, and the balance of wt % being substantially tin, based on the total weight of the solder alloy being 100 wt %. ### Claim 11 (depends on 10) The solder according to claim 10, wherein the solder alloy further contains 0.04-0.06 wt % of nickel based on the total weight of the solder alloy being 100 wt %. ### Claim 12 (depends on 10) The solder according to claim 10, wherein the solder alloy further contains 2-4 wt % of bismuth based on the total weight of the solder alloy being 100 wt %. ### Claim 13 (depends on 10) The solder according to claim 10, wherein the solder alloy contains 0.9-4.1 wt % of silver, 0.3-0.7 wt % of copper, 0.02-0.085 wt % of rhodium, 0.04-0.06 wt % of nickel, 2-4 wt % of bismuth, and the balance being tin, based on the total weight of the solder alloy being 100 wt %. ### Claim 14 (depends on 10) The solder according to claim 10, wherein the solder is a solder ball and the diameter of the solder ball is 0.05-1 mm. ### Claim 15 (depends on 1) A method for producing solder, comprising: mixing silver, copper, rhodium and tin according to the mass percentage of each component of the solder alloy of claim 1, and melting the mixture to obtain a melt; and molding the melt to obtain the solder. ### Claim 16 (depends on 15) The method according to claim 15, comprising the following steps when the solder alloy further contains 0.04-0.06 wt % of nickel, based on the total weight of the solder alloy being 100 wt %: mixing silver, copper, rhodium, tin and nickel, melting the mixture to obtain a melt; and molding the melt to obtain the solder. ### Claim 17 (depends on 15) The method according to claim 15, comprising the following steps when the solder alloy further contains 2-4 wt % of bismuth, based on the total weight of the solder alloy being 100 wt %: mixing silver, copper, rhodium, tin and bismuth, and melting the mixture to obtain a melt; and molding the melt to obtain the solder. ### Claim 18 (depends on 15) The method according to claim 15, comprising the following steps when the solder alloy contains 0.9-4.1 wt % of silver, 0.3-0.7 wt % of copper, 0.02-0.085 wt % of rhodium, 0.04-0.06 wt % of nickel, 2-4 wt % of bismuth, and the balance being tin, based on the total weight of the solder alloy being 100 wt %: mixing silver, copper, rhodium, tin, nickel and bismuth, and melting the mixture to obtain a melt; and molding the melt to obtain the solder.