# US 10,765,874 B2 · Systems and methods for manufacturing header subassembly

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- Number: US 10,765,874 B2
- Document ID: US10765874B2
- Status: Granted
- Kind: B2
- Application number: 15/956,544
- Filed: 2018-04-18
- Published: 2018-08-23
- Granted: 2020-09-08
- Earliest claimed: 2015-12-15
- Assignees: Pacesetter, Inc.
- Applicants: Pacesetter, Inc.
- Inventors: Dino Bortolin; Ofer Rosenzweig
- Web page: https://patentgrep.com/patent/US10765874B2

## CPC

- A61N 1/3752: {Details of casing-lead connections}
- A61N 1/0534: {Electrodes for deep brain stimulation}
- A61N 1/36067: {Movement disorders, e.g. tremor or Parkinson disease (stimulating motor muscle A61N1/36003)}
- A61N 1/362: Heart stimulators (heart defibrillators A61N1/39)
- A61N 1/37229: {Shape or location of the implanted or external antenna}
- B29C 43/18: incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles {(B29C43/206 takes precedence)}
- B29C 45/14819: {the inserts being completely encapsulated}
- B29C 65/18: using heated tools
- B29C 65/20: with direct contact, e.g. using "mirror"
- B29C 65/7814: {in the form of inter-cooperating positioning features (holding or clamping means cooperating with specially formed features of at least one of the parts to be joined B29C65/7844), e.g. tenons and mortises (tenon and mortise joints B29C66/126; tongue and groove joints B29C66/124)}
- B29C 66/1122: {Single lap to lap joints, i.e. overlap joints (B29C66/45, B29C66/472, B29C66/52272 take precedence)}
- B29C 66/54: {Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles}
- B29C 66/73921: {characterised by the materials of both parts being thermoplastics}
- B29C 66/73941: {characterised by the materials of both parts being thermosets}
- B29C 66/742: {to metals or their alloys}
- B29C 66/8322: {Joining or pressing tools reciprocating along one axis}
- B29C 66/9141: {by controlling or regulating the temperature}
- B29C 66/9241: {by controlling or regulating the pressure, the force or the mechanical power}
- B29C 43/52: Heating or cooling
- B29C 66/71: {characterised by the composition of the plastics material of the parts to be joined (welding bar compositions B29C65/125)}
- B29C 2043/189: {the parts being joined}
- B29K 2663/00: Use of EP, i.e. epoxy resins or derivatives thereof for preformed parts, e.g. for inserts
- B29K 2701/10: Thermosetting resins
- B29K 2701/12: Thermoplastic materials
- B29L 2031/3456: {Antennas, e.g. radomes}
- B29L 2031/3481: {Housings or casings incorporating or embedding electric or electronic elements}
- B29L 2031/753: {Medical equipment; Accessories therefor (bloodbags, medical bags B29L2031/7148; artificial eyes B29L2011/0008)}
- A61N: ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY (measurement of bioelectric currents A61B; surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body A61B18/00; anaesthetic apparatus in general A61M; incandescent lamps H01K; infrared radiators for heating H05B)
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES

## Abstract

The present disclosure provides systems and methods for assembling a subassembly for use in manufacturing an implantable device header. A method includes placing a first split web into a top platen, placing a second split web into a bottom platen, placing a conductor assembly and an antenna assembly in the bottom platen on top of the second split web, compressing the top and bottom platens together, heating the top and bottom platens until a predetermined temperature and a predetermined pressure are reached, such that first split web is fused to the second split web to form the subassembly, separating the top and bottom platens, and removing the formed subassembly.

## Claims

### Claim 1

A system for assembling a subassembly for use in manufacturing an implantable device header, the system comprising:
a first split web;
a second split web;
a conductor assembly;
an antenna assembly;
a top platen configured to receive the first split web; and
a bottom platen configured to receive the second split web, the conductor assembly, and the antenna assembly such that the second split web is positioned below the conductor assembly and the antenna assembly, wherein to form the subassembly, the top and bottom platens are configured to compress together and increase in temperature to fuse the first split web to the second split web.

### Claim 2 (depends on 1)

The system of claim 1, wherein the bottom platen comprises at least one positioning feature, and wherein at least one of the conductor assembly and the antenna assembly comprises at least one positioning aperture sized to engage the at least one positioning feature.

### Claim 3 (depends on 1)

The system of claim 1, wherein the first split web is formed in the top platen using a molding process.

### Claim 4 (depends on 1)

The system of claim 1, wherein the second split web is formed in the bottom platen using a molding process.

### Claim 5 (depends on 1)

The system of claim 1, wherein the second split web includes a partial web and a plurality of struts that extend from the web in a direction substantially perpendicular to the partial web.

### Claim 6 (depends on 1)

The system of claim 1, wherein the top and bottom platens are configured to compress together and increase in temperature such that at least a portion of the conductor assembly and the antenna assembly are encapsulated by the fused first and second split webs.