# US 10,765,372 B2 · Sealed package and method of forming same

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- Number: US 10,765,372 B2
- Document ID: US10765372B2
- Status: Granted
- Kind: B2
- Application number: 16/580,657
- Filed: 2019-09-24
- Published: 2020-01-16
- Granted: 2020-09-08
- Earliest claimed: 2015-12-21
- Assignees: Medtronic, Inc.
- Applicants: Medtronic, Inc.
- Inventors: David A. Ruben; Craig L. Schmidt
- Web page: https://patentgrep.com/patent/US10765372B2

## CPC

- A61B 5/686: {Permanently implanted devices, e.g. pacemakers, other stimulators, biochips (A61B5/6861 takes precedence)}
- A61B 5/0245: by using sensing means generating electric signals, {i.e. ECG signals}
- A61N 1/05: for implantation or insertion into the body, e.g. heart electrode (A61N1/06 takes precedence)
- A61N 1/372: Arrangements in connection with the implantation of stimulators
- A61N 1/3754: {Feedthroughs}
- H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)}
- H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs
- H05K 3/0017: {Etching of the substrate by chemical or physical means}
- H05K 3/32: electrically connecting electric components or wires to printed circuits
- H05K 3/4038: {Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence)}
- H05K 5/0247: {Electrical details of casings, e.g. terminals, passages for cables or wiring}
- H05K 5/03: Covers
- H05K 5/066: {sealed by fusion of the joining parts without bringing material; sealed by brazing}
- H05K 5/069: {Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft}
- A61N 1/37512: {Pacemakers}
- A61N 2001/37294: {Means for testing medical devices within the package prior to implantation}
- H05K 2201/09036: Recesses or grooves in insulating substrate
- A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D)
- A61N: ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY (measurement of bioelectric currents A61B; surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body A61B18/00; anaesthetic apparatus in general A61M; incandescent lamps H01K; infrared radiators for heating H05B)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.

## Claims

### Claim 1

A hermetically-sealed package, comprising:
a non-conductive substrate comprising a first major surface, a second major surface, and a cavity disposed in the first major surface, wherein the cavity comprises a recessed surface;
a cover layer disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a hermetically-sealed enclosure;
a feedthrough comprising:
a via between the recessed surface of the cavity and the second major surface of the substrate;
a conductive material disposed in the via; and
an external contact disposed over the via on the second major surface of the non-conductive substrate, wherein the external contact is electrically connected to the conductive material disposed in the via, and wherein the external contact is hermetically sealed to the second major surface of the non-conductive substrate by a laser bond surrounding the via, wherein the laser bond comprises a bond line; and
an electronic device disposed within the hermetically-sealed enclosure, wherein the electronic device comprises a device contact that is electrically connected to the conductive material disposed in the via such that the electronic device is electrically connected to the external contact.

### Claim 2 (depends on 1)

The package of claim 1, further comprising an internal contact disposed over the via on the recessed surface of the cavity of the non-conductive substrate, wherein the internal contact is electrically connected to the conductive material in the via, and further wherein the device contact is electrically connected to the internal contact.

### Claim 3 (depends on 1)

The package of claim 1, wherein the external contact is adapted to provide an electrical signal to tissue of a patient.

### Claim 4 (depends on 1)

The package of claim 1, wherein the cover layer is hermetically sealed to the first major surface of the non-conductive substrate by a laser bond.

### Claim 5 (depends on 1)

The package of claim 1, wherein the non-conductive substrate is substantially transmissive to light having a wavelength in a range of 200 nm to 30 μm.

### Claim 6 (depends on 1)

The package of claim 1, further comprising a conductor disposed on the second major surface of the non-conductive substrate and electrically connected to the external contact.

### Claim 7 (depends on 1)

The package of claim 1, wherein the cover layer comprises sapphire.

### Claim 8 (depends on 1)

The package of claim 1, further comprising a power source disposed in the cavity and electrically connected to the electronic device.

### Claim 9 (depends on 1)

An implantable medical device system that comprises a lead comprising a lead body and the hermetically-sealed package of claim 1 disposed in a distal portion of the lead body.

### Claim 10 (depends on 9)

The implantable medical device system of claim 9, wherein the external contact of the hermetically-sealed package is electrically connected to a conductor of the lead.

### Claim 11

A method of forming a hermetically-sealed package, comprising:
forming a cavity in a first major surface of a non-conductive substrate;
forming a via between a recessed surface of the cavity and a second major surface of the non-conductive substrate;
forming an external contact over the via on the second major surface of the non-conductive substrate;
disposing conductive material in the via such that the external contact is electrically connected to the conductive material in the via;
disposing an electronic device at least partially within the cavity such that a device contact of the electronic device is electrically connected to the conductive material in the via;
disposing a cover layer over the cavity; and
attaching the cover layer to the first major surface of the non-conductive substrate to form a hermetically-sealed enclosure, wherein the electronic device is disposed within the hermetically-sealed enclosure, and further wherein attaching the cover layer comprises laser bonding the cover layer to the first major surface of the non-conductive substrate by forming a bond line at an interface between the first major surface of the substrate and the cover layer such that the bond line surrounds the cavity.

### Claim 12 (depends on 11)

The method of claim 11, wherein forming the cavity comprises etching the first major surface of the non-conductive substrate.

### Claim 13 (depends on 11)

The method of claim 11, wherein forming the cavity comprises ablating the first major surface of the non-conductive substrate.

### Claim 14 (depends on 11)

The method of claim 11, wherein forming an external contact comprises:
disposing a conductive layer on the second major surface over the via; and
removing a portion of the conductive layer to form the external contact over the via.

### Claim 15 (depends on 11)

The method of claim 11, further comprising forming an internal contact on the recessed surface of the cavity over the via such that the internal contact is electrically connected to the conductive material in the via, wherein the device contact of the electronic device is electrically connected to the internal contact.

### Claim 16 (depends on 11)

The method of claim 11, further comprising disposing an insulative material within the hermetically-sealed enclosure.

### Claim 17 (depends on 11)

The method of claim 11, further comprising:
disposing a power source at least partially within the cavity of the non-conductive substrate prior to attaching the cover layer to the first major surface of the non-conductive substrate; and
electrically connecting the power source to the electronic device.

### Claim 18

A hermetically-sealed package, comprising:
a non-conductive substrate comprising a first major surface, a second major surface, and a cavity disposed in the first major surface, wherein the cavity comprises a recessed surface;
an internal contact disposed on the recessed surface of the cavity, wherein the internal contact is hermetically sealed to the recessed surface of the cavity by a laser bond line;
an electronic device comprising a device contact electrically connected to the internal contact; and
a cover layer disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a hermetically-sealed enclosure, wherein the electronic device is disposed within the hermetically-sealed enclosure.

### Claim 19 (depends on 18)

The package of claim 18, wherein the cover layer is hermetically sealed to the first major surface of the non-conductive substrate by a laser bond line.

### Claim 20 (depends on 19)

The package of claim 19, wherein the laser bond line surrounds the cavity of the non-conductive substrate.