# US 10,765,046 B2 · Electromagnetic interference shields for electronic packages and related methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,765,046 B2 - Document ID: US10765046B2 - Status: Granted - Kind: B2 - Application number: 16/290,448 - Filed: 2019-03-01 - Published: 2019-06-27 - Granted: 2020-09-01 - Earliest claimed: 2015-12-18 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Robert Sankman - Web page: https://patentgrep.com/patent/US10765046B2 ## CPC - H05K 9/0007: {Casings (standardised racks H05K9/0062)} - H05K 9/006: {specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier} - H05K 9/0086: {comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 42/284: {shielding resins} - H10W 72/0198: {batch processes} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Disclosed are EMI shielded packages, electronic device packages, and related methods. EMI shielded packages are formed by applying an insulating material to a first side of a substrate strip, separating the substrate strip into segments, adhering the insulating material of the segments to a solid conductor, applying a conductive paste around lateral sides of the segments, curing the conductive paste, and cutting through the conductive paste and the solid conductor to form the EMI packages. An electronic device package includes a substrate including electronic circuitry, an EMI shield, and an insulating material insulating the substrate from the EMI shield. The EMI shield includes a solid conductor adhered to the insulating material, and a cured conductive paste at least partially surrounding a lateral edge of the substrate. The cured conductive paste electrically connects the solid conductor to a conductive terminal in a lateral side of the substrate. ## Claims ### Claim 1 An electronic device package, comprising: a substrate comprising: electronic circuitry in or on at least a first side of the substrate; and at least one conductive terminal at a lateral edge of the substrate; an insulating material formed over the first side of the substrate and the electronic circuitry, the insulating material having a top surface; and an electromagnetic interference (EMI) shield comprising: a solid conductor adhered to the top surface of the insulating material opposite the first side of the substrate, the insulating material electrically insulating the electronic circuitry from the solid conductor; and a conductive material at least partially surrounding the lateral edge of the substrate and electrically connecting the conductive terminal to the solid conductor, the conductive material having a top surface co-planar with the top surface of the insulating material. ### Claim 2 (depends on 1) The electronic device package of claim 1, wherein the conductive material includes a cured conductive paste. ### Claim 3 (depends on 2) The electronic device package of claim 2, wherein the cured conductive paste includes a cured epoxy including conductive particles. ### Claim 4 (depends on 1) The electronic device package of claim 1, wherein the at least one conductive terminal extends completely around the lateral edge of the substrate. ### Claim 5 (depends on 1) The electronic device package of claim 1, wherein the at least one conductive terminal is electrically connected to ground. ### Claim 6 (depends on 1) The electronic device package of claim 1, wherein the solid conductor comprises a metal foil. ### Claim 7 (depends on 6) The electronic device package of claim 6, wherein the metal foil comprises at least one metal selected from the group consisting of a copper foil, an aluminum foil, a silver foil, and a gold foil. ### Claim 8 (depends on 1) The electronic device package of claim 1, wherein the insulating material includes an over mold including one of plastic or rubber. ### Claim 9 (depends on 1) The electronic device package of claim 1, wherein the insulating material includes an insulating epoxy. ### Claim 10 (depends on 1) The electronic device package of claim 1, wherein the insulating material includes silicon dioxide. ### Claim 11 (depends on 1) The electronic device package of claim 1, wherein the conductive material completely surrounds the lateral edge of the substrate. ### Claim 12 An electronic device package, comprising: a substrate including electronic circuitry on or in a first side of the substrate; a solid conductor configured to shield the first side of the substrate from electromagnetic interference (EMI); an insulating material between the substrate and the solid conductor, the insulating material having a top surface, and the solid conductor adhered to the top surface of the insulating material; and a conductive material at least partially surrounding a lateral edge of the substrate, the conductive material having a top surface co-planar with the top surface of the insulating material. ### Claim 13 (depends on 12) The electronic device package of claim 12, wherein the conductive material is in contact with the solid conductor. ### Claim 14 (depends on 12) The electronic device package of claim 12, further comprising a conductive terminal at the lateral edge of the substrate and electrically connected to the conductive material. ### Claim 15 (depends on 14) The electronic device package of claim 14, wherein the conductive terminal is configured to connect the conductive material to a ground terminal of the substrate. ### Claim 16 (depends on 14) The electronic device package of claim 14, wherein the conductive terminal is configured to electrically connect the solid conductor to a ground terminal of the substrate through the conductive material. ### Claim 17 (depends on 12) The electronic device package of claim 12, further comprising one or more conductive pads on or in a second side of the substrate, the second side of the substrate opposite the first side. ### Claim 18 (depends on 17) The electronic device package of claim 17, wherein the one or more conductive pads include one of pads, pins, or solder balls.