Immersion cooling enclosures with insulating liners

A computing facility, comprising:

• multiple immersion cooling enclosures individually having:
• a well formed in a substrate material, the well having a first surface at a first elevation, a second surface at a second elevation that is lower than the first elevation, and side surfaces extending between the first and second surfaces;
• a lid in contact with and fastened to the first surface of the well, the lid, the second surface of the well, and the side surfaces of the well enclosing an internal space configured to contain a dielectric coolant, the lid including a condenser in thermal communication with the internal space;
• and
• an insulating liner on the second surface and the side surfaces of the well, the insulating liner having a first side in contact with the dielectric coolant and a second side in contact with the substrate material at the second surface and the side surfaces of the well, wherein the insulating liner is non-permeable to the dielectric coolant, thereby preventing the dielectric coolant from passing through the insulating liner to the substrate material;
• one or more servers in the internal space of the individual immersion cooling enclosures, the one or more servers being submerged in the dielectric coolant in the respective immersion cooling enclosures;
• and
• a manifold operatively coupled to the condensers of the multiple immersion cooling enclosures, the manifold being coupled to a source of cooling fluid.

A method of forming immersion cooling enclosure for housing servers in a computing facility, the method comprising:

• forming a well in a substrate material, the well having a first surface at a first elevation, a second surface at a second elevation that is lower than the first elevation, and side surfaces extending between the first and second surfaces;
• placing an insulating liner on the second surface and the side surfaces of the well, the insulating liner having a first side and a second side opposite the first side and in contact with the substrate material at the second surface and the side surfaces of the well;
• positioning one or more servers in the well, the one or more servers being separated from the substrate material of the well by the insulating liner;
• sealing the one or more servers in the formed well with a lid in contact with the first surface of the well, the lid, the second surface of the well, and the side surfaces of the well enclosing an internal space;
• and
• filling the internal space formed by the lid, the second surface of the well, and the side surfaces of the well with a dielectric coolant such that the one or more servers are submerged in the dielectric coolant.