# US 10,765,018 B2 · Tamper-proof computer device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,765,018 B2 - Document ID: US10765018B2 - Status: Granted - Kind: B2 - Application number: 16/363,445 - Filed: 2019-03-25 - Published: 2019-10-03 - Granted: 2020-09-01 - Earliest claimed: 2018-03-28 - Assignees: Private Machines Inc. - Applicants: Private Machines Inc. - Inventors: Radu Sion - Web page: https://patentgrep.com/patent/US10765018B2 ## CPC - H05K 5/0208: {Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof} - G06F 1/1677: {for detecting open or closed state or particular intermediate positions assumed by movable parts of the enclosure, e.g. detection of display lid position with respect to main body in a laptop, detection of opening of the cover of battery compartment} - G06F 1/182: {with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]} - G06F 1/20: Cooling means - G06F 21/86: Secure or tamper-resistant housings - H05K 7/20163: {the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels} - H05K 13/04: Mounting of components {, e.g. of leadless components} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract Tamper-proof computer device (1) comprising a sealed enclosure (10), in turn comprising a hollow metal body (20) having an inside surface (22); a computer processor (30), arranged inside said enclosure (10); a tamper-detection sensor (40), which sensor (40) in turn comprises a tamper-detecting membrane (40) forming a sealed container in which the computer processor (30) is arranged, which membrane (40) is arranged on, and in direct thermal contact with, the said hollow metal body (20); and a metal heat sink structure (50) thermally connected to the computer processor (30), wherein the metal heat sink structure (50) is also arranged in direct thermal contact with a side of the membrane (40) not facing the said inside surface (22), so that the membrane (40) is sandwiched between the hollow metal body (20) and the metal heat sink structure (50) so that thermal connection is achieved between the metal heat sink structure (50) and the enclosure (10), via the membrane (40). The invention also relates to a method for manufacturing such a computer device. ## Claims ### Claim 1 Tamper-proof computer device comprising a sealed enclosure, in turn comprising a hollow metal body having an inside surface; a computer processor, arranged inside said enclosure; a tamper-detection sensor, which sensor in turn comprises a tamper-detecting membrane forming a sealed container in which the computer processor is arranged, which membrane is arranged on, and in direct thermal contact with, the said hollow metal body; and a metal heat sink structure thermally connected to the computer processor, wherein the metal heat sink structure is also arranged in direct thermal contact with a side of the membrane not facing the said inside surface, so that the membrane is sandwiched between the hollow metal body and the metal heat sink structure so that thermal connection is achieved between the metal heat sink structure and the enclosure, via the membrane. ### Claim 2 (depends on 1) Tamper-proof computer device according to claim 1, wherein the hollow metal body, the membrane and the metal heat sink structure are sandwiched together across an area covering at least 10%, preferably at least 25%, most preferably at least 50%, of the total area of said inside surface. ### Claim 3 (depends on 2) Tamper-proof computer device according to claim 2, wherein the metal heat sink structure comprises a metal plate the shape of which is complementary to at least a part of the said inside surface. ### Claim 4 (depends on 3) Tamper-proof computer device according to claim 3, wherein the metal plate substantially has a trough shape. ### Claim 5 (depends on 3) Tamper-proof computer device according to claim 3, wherein the metal heat sink structure comprises a metal protruding part, thermally connected to the metal plate, protruding out from an inside of the metal plate, and arranged to be thermally connected to the computer processor. ### Claim 6 (depends on 5) Tamper-proof computer device according to claim 5, wherein the metal heat sink structure is at least partly, preferably completely, made from copper. ### Claim 7 (depends on 1) Tamper-proof computer device according to claim 1, wherein the enclosure comprises two enclosure parts, arranged to be fastened together forming said hollow metal body, wherein the tamper-detection sensor comprises two tamper-detecting membrane parts, each corresponding to a respective one of said enclosure parts and each covering a respective inside surface of the enclosure part in question, and wherein the membrane parts are pressed between the enclosure parts when the enclosure parts are joined together, hence forming the said sealed container. ### Claim 8 (depends on 7) Tamper-proof computer device according to claim 7, wherein the tamper-detecting membrane is connected to tamper-protection circuitry at least partly arranged externally to the sealed enclosure. ### Claim 9 (depends on 8) Tamper-proof computer device according to claim 8, wherein the said tamper-protection circuitry is powered by a battery arranged externally to the sealed enclosure. ### Claim 10 (depends on 8) Tamper-proof computer device according to claim 8, wherein the tamper-protection circuitry is connected to internal tamper-protection circuitry arranged inside the membrane by a connecting means running through a joint between the said at least two joined-together enclosure parts. ### Claim 11 (depends on 7) Tamper-proof computer device according to claim 7, wherein the said tamper-detecting membrane parts are joined together using an adhesive providing an adhesive joint the strength of which is at least as strong as the membrane itself. ### Claim 12 (depends on 11) Tamper-proof computer device according to claim 11, wherein enclosure parts are also joined together using said adhesive. ### Claim 13 (depends on 11) Tamper-proof computer device according to claim 11, wherein the membrane is not fastened to the enclosure apart from along said joint, and in particular that the membrane runs freely between the metal heat sink structure and said hollow metal body, but is held in place by said sandwich arrangement. ### Claim 14 (depends on 7) Tamper-proof computer device according to claim 7, wherein the tamper-detecting membrane is pressed between the two enclosure parts between a respective cooperating flange of each enclosure part, forming a flanged pressing aggregate preferably extending uninterrupted along a complete or substantially complete closed periphery of the enclosure. ### Claim 15 (depends on 14) Tamper-proof computer device according to claim 14, wherein said flanged pressing aggregate is arranged with a hollow space, provided by a respective indentation of at least one of the respective flanges of said enclosure parts, which hollow space is arranged to receive and accommodate the tamper-detecting membrane. ### Claim 16 (depends on 15) Tamper-proof computer device according to claim 15, wherein the said flanged pressing aggregate is further arranged so that the said enclosure parts are directly attached one to the other, using an adhesive, along a contact line extending uninterrupted along a complete or substantially complete closed periphery of the enclosure, peripherally externally to a periphery of the membrane. ### Claim 17 (depends on 16) Tamper-proof computer device according to claim 16, wherein the said flanges each comprises a respective flat part, arranged to abut flatly against a corresponding flat part of an adjacent enclosure part flange, hence forming a direct attachment surface of said direct attachment. ### Claim 18 (depends on 1) Tamper-proof computer device according to claim 1, wherein the hollow metal body comprises a gas, such as air. ### Claim 19 (depends on 18) Tamper-proof computer device according to claim 18, wherein the computer device further comprises a fan, arranged inside the hollow metal body and arranged to provide gas convection inside the hollow metal body. ### Claim 20 (depends on 1) Tamper-proof computer device according to claim 1, wherein the outside of the sealed enclosure comprises surface-increasing structure elements, such as a rib pattern. ### Claim 21 (depends on 1) Tamper-proof computer device according to claim 1, wherein a heat-expanding adhesive is arranged between the membrane and the metal heat sink structure. ### Claim 22 (depends on 1) Method for manufacturing a tamper-proof computer device of the type according to claim 1, wherein the method comprises the steps a) providing a first and a second enclosure part, as well as a first and a second tamper-detecting membrane part; b) arranging the first membrane part so that it covers an inside surface of the first enclosure part, and arranging the second membrane part so that it covers an inside surface of the second enclosure part; c) bringing the first and second enclosure parts together, so that they together form a closed a hollow metal body having an inside surface which is covered by said first and second membrane parts, which hollow metal body encloses a computer processor, wherein the first and second membrane parts are pressed together between said first and second enclosure parts along a closed periphery along the hollow metal body; and d) permanently sealing the hollow metal body using an adhesive applied along an adhesive joint arranged along said closed periphery. ### Claim 23 (depends on 22) Method according to claim 22, wherein in step c) the hollow metal body also is arranged to enclose a metal heat sink structure thermally connected to the computer processor and in direct thermal contact with a side of at least one of the first and second membrane parts not facing the said inside surface, so that the membrane part in question is sandwiched between the hollow metal body and the metal heat sink structure so that thermal connection is achieved between the metal heat sink structure and the enclosure, via the membrane part in question. ### Claim 24 (depends on 23) Method according to claim 23, wherein in step c) a heat-expanding adhesive is arranged between the membrane and the metal heat sink structure. ### Claim 25 (depends on 22) Method according to claim 22, wherein the first and second membrane parts after step d) form a sealed container enclosing the computer processor. ### Claim 26 (depends on 25) Method according to claim 25, wherein the method further comprises that the sealed container is connected to tamper-protection circuitry at least partly arranged externally to the sealed enclosure. ### Claim 27 (depends on 22) Method according to claim 22, wherein the adhesive is a curing adhesive, and wherein step d) comprises a curing step curing the adhesive. ### Claim 28 (depends on 22) Method according to claim 22, wherein in step c) the first and second membrane parts are pressed between the first and second enclosure parts between a respective cooperating flange of each of said first and second enclosure part, forming a flanged pressing aggregate preferably extending uninterrupted along said closed periphery of the hollow metal body. ### Claim 29 (depends on 28) Method according to claim 28, wherein said flanged pressing aggregate is provided with a hollow space, by providing a respective indentation of at least one of the respective flanges of said first and second enclosure parts, which hollow space receives and accommodates the first and second membrane parts. ### Claim 30 (depends on 29) Method according to claim 29, wherein the said first and second enclosure parts are directly attached one to the other, using the adhesive, along a contact line extending uninterrupted along a complete or substantially complete closed periphery of the enclosure, peripherally externally to a periphery of the first and second membrane parts. ### Claim 31 (depends on 30) Method according to claim 30, wherein the said flanges each comprises a respective flat part, arranged to abut flatly against a corresponding flat part of an adjacent enclosure part flange, and wherein said direct attachment is formed between said corresponding flat parts. ### Claim 32 (depends on 1) Method for manufacturing a tamper-proof computer device of the type according to claim 1, wherein the method comprises the steps a) providing a first and a second enclosure part, as well as a first and a second tamper-detecting membrane part; b) arranging the first membrane part so that it covers an inside surface of the first enclosure part, and arranging the second membrane part so that it covers an inside surface of the second enclosure part; c) bringing the first and second enclosure parts together, so that they together form a closed a hollow metal body having an inside surface which is covered by said first and second membrane parts, and so that said first and second membrane parts together form a sealed container in which the computer processor is arranged; and d) permanently sealing the hollow metal body along said closed periphery, and wherein in step c) the hollow metal body also is arranged to enclose a metal heat sink structure thermally connected to the computer processor and in direct thermal contact with a side of at least one of the first and second membrane parts not facing the said inside surface, so that the membrane part in question is sandwiched between the hollow metal body and the metal heat sink structure so that thermal connection is achieved between the metal heat sink structure and the enclosure, via the membrane part in question.