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US 10,765,010 B2Granted
Electrolytic copper foil for printed circuit board with low transmission loss
AssigneeChang Chun Petrochemical Co., Ltd.
InventorsJian-Ming Huang, Yao-Sheng Lai, Jui-Chang Chou
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Abstract
Surface-treated copper foils that exhibit a material volume (Vm) in a range of 0.05 to 0.6 μm3/μm2 and a yellowness index (YI) in a range of 17 to 52 are reported. Where the surface-treated copper foil is treated on the deposited side and includes a treatment layer comprising a nodule layer. Such surface-treated copper foils can be used as a conductive material having low transmission loss, for example in circuit boards.
Claims15
A surface-treated copper foil comprising:
- an electrodeposited copper foil including a drum side and a deposited side, and
- a treatment layer disposed on the deposited side providing a surface-treated side,
- wherein the treatment layer comprises a nodule layer and wherein the surface-treated side exhibits a material volume (Vm) in a range of 0.05 to 0.6 μm3/μm2 and a yellowness index (YI) in a range of 17 to 52.
A laminate comprising,
- a resin layer, and
- a surface-treated copper foil comprising,
- an electrodeposited copper foil including a drum side and a deposited side,
- a treatment layer disposed on the deposited side providing a surface-treated side in contact with the resin layer, and wherein the treatment layer comprises a nodule layer,
- wherein the surface-treated side exhibits a material volume (Vm) in a range of 0.05 to 0.6 μm3/μm2, a yellowness index (YI) in a range of 17 to 52, a void volume (Vv) in a range of 0.10 to 0.85 μm3/μm2, and
- wherein the surface-treated copper foil exhibits a yield strength in a range of 8.5 kg/mm2 to 26 kg/mm2 based on extension under load method at 0.5% strain.
3 more elements
Dependencies are inferred from the claim text.