Electronic module
AssigneeImberatek, LLC
InventorsRisto Tuominen, Petteri Palm
Life of this patent
Estimating the term…
Abstract
The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.
Claims34
An electronic module, comprising:
- a first conductive-pattern layer having a first surface,
- a second conductive-pattern layer having a second surface,
- a flexible insulating-material layer between the first surface of the first conductive-pattern layer and the second surface of the second conductive-pattern layer,
- a component having contact zones between the first surface of the first conductive-pattern layer and the second surface of the second conductive-pattern layer, at least some of the contact zones being electrically connected to the first conductive-pattern layer by solderless and metallurgical connections, said connections each comprising at least one solid contact bump between the first conductive-pattern layer and the respective contact zone, and
- a filler around the component, the filler securing the component mechanically to a flexible sheet,
- wherein the component is located between the first surface of the first conductive-pattern layer and the second surface of the second conductive-pattern layer and wherein the component is separated from the second surface of the second conductive-pattern layer by the filler.
An electronic module, comprising:
- a first conductive-pattern layer having a first surface,
- a second conductive-pattern layer having a second surface,
- a flexible sheet between the first surface of the first conductive-pattern layer and the second surface of the second conductive-pattern layer,
- a component having contact zones between the first surface of the first conductive-pattern layer and the second surface of the second conductive-pattern layer, at least some of the contact zones being electrically connected to the first conductive-pattern layer by solderless and metallurgical connections, said connections each comprising at least one solid contact bump between the first conductive-pattern layer and the respective contact zone, and
- a filler around the component, the filler securing the component mechanically to the flexible sheet,
- wherein the component is separated from the second surface of the second conductive-pattern layer by the filler.
Dependencies are inferred from the claim text.