Embedding component with pre-connected pillar in component carrier

A method of manufacturing a component carrier, the method comprising:

• galvanically depositing at least part of at least one electrically conductive pillar on a component;
• providing an electrically insulating layer structure, wherein the electrically insulating layer structure is a non-uniform electrically insulating layer structure having at least one protrusion for accommodating the at least one electrically conductive pillar;
• and
• after providing the electrically insulating layer structure, mechanically pressing the at least one electrically conductive pillar and the electrically insulating layer structure into one another, so that the at least one electrically conductive pillar is inserted into the electrically insulating layer structure so deep that a free end of the at least one electrically conductive pillar protrudes beyond the electrically insulating layer structure and is thereby exposed, wherein the inserting by mechanically pressing comprises one of moving the at least one electrically conductive pillar into the stationary electrically insulating layer structure, and moving the electrically insulating layer structure into the stationary at least one electrically conductive pillar;
• the component comprises a semiconductor chip being electrically contacted by a plurality of electrically conductive pillars;
• forming an electrically conductive trace structure, embedding the trace structure in a patterned electrically insulating matrix, the patterned electrically insulating matrix comprising a recess which is filled by the protrusion, attaching the electrically insulating layer structure to the matrix with embedded trace structure, and the inserting by mechanically pressing, and optionally fixing, the at least one electrically conductive pillar of the component into the electrically insulating layer structure extending into the recess of the matrix;
• the component comprises the at least one electrically conductive pillar either on only one main surface thereof or on both opposing main surfaces thereof.