Circuit board and method for manufacturing the same
AssigneesAvary Holding (Shenzhen) Co., Limited., Qing Ding Precision Electronics (Huaian) Co., Ltd
InventorsYong-Chao Wei, Lin-Jie Gao, Han-Pei Huang
Life of this patent
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Abstract
A circuit board with anti-EMI proofing for each component on the board includes a first outer wiring layer, electronic components mounted on the first outer wiring layer, and at least one electromagnetic shielding unit. Each electromagnetic shielding unit has a shielding layer and conductive posts formed on the shielding layer, the shielding layer and conductive posts defining a receiving space to house and shield one electronic component. An adhesive layer formed on the first outer wiring layer bonds each electromagnetic shielding unit to the first outer wiring layer.
Claims9
A method for manufacturing a circuit board comprising:
- providing a circuit baseboard comprising a first outer wiring layer;
- mounting at least two electronic components mounted on the first outer wiring layer;
- providing at least two electromagnetic shielding units, each of the two electromagnetic shielding units comprising an electromagnetic shielding layer and at least two conductive posts formed on the electromagnetic shielding layer, the conductive posts and the electromagnetic shielding layer cooperatively defining a receiving space, wherein providing the at least two electromagnetic shielding units comprises:
- providing an electromagnetic shielding substrate comprising the electromagnetic shielding layer and a second protective layer formed on the electromagnetic shielding layer;
- forming a third dielectric layer on a surface of the electromagnetic shielding layer facing away from the second protective layer;
- defining at least two blind holes in the third dielectric layer;
- forming one of the conductive posts in each of the two blind holes;
- removing the third dielectric layer;
- and
- cutting the electromagnetic shielding substrate to form the electromagnetic shielding units:
- mounting each of the two electromagnetic shielding units on the first outer wiring layer, causing each of the electronic components to be received in the receiving space of a corresponding one of the two electromagnetic shielding units;
- forming an adhesive layer on the first outer wiring layer which connect each of the two electromagnetic shielding units to the first outer wiring layer, thereby forming an intermediate product;
- and
- cutting the intermediate product to form at least two circuit boards.
Dependencies are inferred from the claim text.