# US 10,764,990 B1 · Heat-dissipating module having an elastic mounting structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,764,990 B1 - Document ID: US10764990B1 - Status: Granted - Kind: B1 - Application number: 16/391,963 - Filed: 2019-04-23 - Granted: 2020-09-01 - Earliest claimed: 2019-04-23 - Assignees: Adlink Technology Inc. - Applicants: Adlink Technology Inc. - Inventors: Hua-Feng Chen - Web page: https://patentgrep.com/patent/US10764990B1 ## CPC - G06F 1/20: Cooling means - H05K 1/021: {Components thermally connected to metal substrates or heat-sinks by insert mounting} - H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings} - H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion} - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H05K 7/1407: {by turn-bolt or screw member} - G06F 1/203: {for portable computers, e.g. for laptops} - H05K 2201/041: Stacked PCBs, i.e. having neither an empty space nor mounted components in between - H05K 2201/10409: Screws - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A heat-dissipating module having an elastic mounting structure includes a carrier circuit board, a main circuit board, a heat dissipating module, and a plurality of elastic mounting components configured to mount mounting holes of the carrier circuit board and mounting grooves of the heat dissipating module in series, so as to fix the carrier circuit board, the main circuit board and the heat dissipating module. As a result, the plurality of elastic mounting components can provide stress buffer and good bonding effect for the thermally conductive device of the heat dissipating module bonded on an upper surface of the heat source device. ## Claims ### Claim 1 A heat-dissipating module having an elastic mounting structure, comprising: a carrier circuit board comprising a plurality of mounting holes; a main circuit board disposed on and electrically connected to the carrier circuit board, and comprising at least one heat source device; a heat dissipating module disposed on the main circuit board, and comprising at least one heat exchange device, a plurality of thermally conductive devices and a plurality of mounting grooves, wherein each of the plurality of thermally conductive devices has a surface bonded on a surface of the heat exchange device, and the other surface bonded on an upper surface of the heat source device of the main circuit board, and each of the plurality of mounting grooves includes a stop part disposed on a bottom thereof, and a through hole formed on a central part of the stop part; and a plurality of elastic mounting components configured to mount the plurality of mounting holes of the carrier circuit board and the through holes of the plurality of mounting grooves of the heat dissipating module in series, so as to fix the carrier circuit board, the main circuit board and the heat dissipating module, wherein each of the plurality of elastic mounting components has a polygonal head part, a rod, an elastic member, and an inner thread penetrating through central parts of the polygonal head part and the rod, wherein the inner thread is configured to screw with a structural screw, and the elastic member is disposed outside the rod, two ends of the elastic member are abutted between the polygonal head part and the stop part of the mounting groove, respectively, and the rod has a constraining member disposed on a part thereof exposed out of the through hole of each of the plurality of mounting grooves, and the plurality of elastic mounting components provide stress buffer and good bonding effect for the thermally conductive device of the heat dissipating module bonded on the upper surface of the heat source device. ### Claim 2 (depends on 1) The heat-dissipating module having an elastic mounting structure according to claim 1, further comprising a thermal paste coated between or a phase change material attached between the thermally conductive device of the heat dissipating module and the upper surface of the heat source device, for thermal conduction. ### Claim 3 (depends on 1) The heat-dissipating module having an elastic mounting structure according to claim 1, wherein the polygonal head part of each of the plurality of elastic mounting components is hexagonal, and each of the plurality of mounting grooves for accommodating one of the plurality of elastic mounting components is a hexagonal space, and outer edges of the hexagonal head part of each of the plurality of elastic mounting components are fixed in the mounting groove and below the upper edge of the mounting groove. ### Claim 4 (depends on 1) The heat-dissipating module having an elastic mounting structure according to claim 1, wherein the rod of each of the plurality of elastic mounting components has an outer thread formed on an end surface thereof. ### Claim 5 (depends on 1) The heat-dissipating module having an elastic mounting structure according to claim 1, wherein the constraining member is formed by a nut, an O-ring or an E-ring, and the constraining members constrain the plurality of elastic mounting components in the plurality of mounting grooves of the heat dissipating module, respectively. ### Claim 6 (depends on 1) The heat-dissipating module having an elastic mounting structure according to claim 1, wherein the elastic member is a spring. ### Claim 7 (depends on 1) The heat-dissipating module having an elastic mounting structure according to claim 1, wherein the heat exchange device is a vapor chamber or a heatsink. ### Claim 8 (depends on 1) The heat-dissipating module having an elastic mounting structure according to claim 1, wherein the thermally conductive device is a copper block. ### Claim 9 (depends on 1) The heat-dissipating module having an elastic mounting structure according to claim 1, wherein the inner thread formed on the end of the rod of the elastic mounting component is screwed with the structural screw. ### Claim 10 (depends on 1) The heat-dissipating module having an elastic mounting structure according to claim 1, wherein the heat source device is a central processing unit, or a chipset easy to heat.