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US 10,764,989 B1Granted
Thermal enhancement of exposed die-down package
AssigneeDialog Semiconductor (UK) Limited
InventorsTung Ching Lui, Baltazar Canete, Rajesh Aiyandra
Life of this patent
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Abstract
An integrated circuit package having excellent heat dissipation is described. An integrated circuit die is attached to a substrate and the substrate is mounted on a printed circuit board (PCB) wherein there is a gap between a surface of the die facing the PCB and the PCB. A thermal enhanced layer is formed within the gap wherein heat travels from the die through the thermal enhanced layer to the PCB.
Claims18
An integrated circuit package comprising:
- an integrated circuit die attached to a substrate;
- said substrate mounted on a printed circuit board (PCB) wherein there is a gap between a surface of said die facing said PCB and said PCB;
- and
- a thermal enhanced layer in said gap wherein heat travels from said die through said thermal enhanced layer to said PCB and from said die to said substrate through connectors from said substrate to said PCB and wherein no heat spreader device is present in said package.
1 more element
A method of fabricating an integrated circuit package comprising:
- providing an integrated circuit die attached to a substrate;
- mounting said substrate on a printed circuit board (PCB) wherein there is a gap between a surface of said die facing said PCB and said PCB;
- and
- forming a thermal enhanced layer within said gap wherein heat travels 1) from said die to said substrate through connectors to said PCB and 2) from said die through said thermal enhanced layer to said PCB wherein no heat spreader device is present in said package.
1 more element
Dependencies are inferred from the claim text.