Microphone and manufacturing method therefor

A microphone, comprising:

• a substrate structure, comprising:
• a substrate defining a through hole penetrating the substrate;
• a first insulating layer covering a first part of the substrate;
• a first electrode plate layer covering the through hole and a part of the first insulating layer;
• a second insulating layer, covering a part of a region of the first insulating layer which is not covered by the first electrode plate layer, wherein when seen from the top of the microphone, a border of the first electrode plate layer adjacent to a second part of the substrate not covered by the first insulating layer and a border of the second insulating layer adjacent to the second part of the substrate form an angle, and a degree θ of the angle is larger than or equal to 90° and is smaller than or equal to 180°;
• and
• a second electrode plate layer, located above the first electrode plate layer;
• and
• a supporting layer, covering the substrate structure.

A method for manufacturing a microphone, comprising:

• providing a substrate structure, the substrate structure comprising a substrate and a first insulating layer covering a part of the substrate;
• forming a first electrode plate layer, the first electrode plate layer covering a first part of the first insulating layer;
• and
• forming a second insulating layer, the second insulating layer covering a part of a region of the first insulating layer which is not covered by the first electrode plate layer and a part of the first electrode plate layer,
• wherein when seen from the top of the microphone, a border of the first electrode plate layer adjacent to a second part of the first insulating layer not covered by the first electrode plate layer or the second insulating layer and a border of the second insulating layer adjacent to the second part of the first insulating layer form an angle, and a degree θ of the angle is larger than or equal to 90° and is smaller than or equal to 180°.

A microphone, comprising:

• a substrate structure, comprising:
• a substrate defining a through hole penetrating the substrate;
• a first insulating layer covering a part of the substrate;
• a first electrode plate layer covering the through hole and a first part of the first insulating layer;
• a second insulating layer, covering a part of a region of the first insulating layer which is not covered by the first electrode plate layer, wherein when seen from the top of the microphone, a border of the first electrode plate layer adjacent to a second part of the first insulating layer not covered by the first electrode plate layer or the second insulating layer and a border of the second insulating layer adjacent to the second part of the first insulating layer form an angle, and a degree θ of the angle is larger than or equal to 90° and is smaller than or equal to 180°;
• and
• a second electrode plate layer located above the first electrode plate layer;
• and
• a supporting layer, covering the substrate structure.