Imaging apparatus, manufacturing apparatus, manufacturing method and electronic appliance

An imaging apparatus, comprising:

• a first circuit board;
• a lens configured to receive incident light;
• an imaging element on a first surface of the first circuit board and electrically coupled to the first circuit board via a wire, wherein the first circuit board is configured to receive the incident light on the first surface via the lens;
• a member on an outer circumference portion of the first surface of the first circuit board;
• an infrared cut filter between the imaging element and the lens;
• and
• a frame coupled to the member, wherein
• the frame comprises a first portion which extends in a first direction perpendicular to an optical axis of the lens,
• the first portion of the frame holds the infrared cut filter,
• the frame comprises a second portion which extends in a second direction opposite to the first direction,
• a first side of the second portion is in contact with a side of the member,
• the first side of the second portion faces the first circuit board,
• the side of the member is opposite to the first circuit board,
• the frame comprises a third portion which extends in a third direction along the optical axis of the lens, and
• the frame comprises a fourth portion which extends in a fourth direction opposite to the third direction.

An imaging system, comprising:

• a first circuit board;
• a lens configured to receive incident light;
• an imaging element on a first surface of the first circuit board and electrically coupled to the first circuit board via a wire, wherein
• the imaging element is configured to generate image data, and
• the first circuit board is configured to receive the incident light on the first surface via the lens;
• a member on an outer circumference portion of the first surface of the first circuit board;
• an infrared cut filter between the imaging element and the lens;
• a frame coupled to the member via an intermediate member;
• and
• a processor coupled to the imaging element, wherein
• the processor is configured to process the image data,
• the frame comprises a first portion which extends in a first direction perpendicular to an optical axis of the lens,
• the first portion of the frame holds the infrared cut filter,
• the frame comprises a second portion which extends in a second direction opposite to the first direction,
• a side of the second portion is in contact with a side of the member via the intermediate member,
• the side of the second portion faces the first circuit board, and
• the side of the member is opposite to the first circuit board.

An imaging apparatus, comprising:

• a first circuit board;
• a lens configured to receive incident light;
• an imaging element on a first surface of the first circuit board and electrically coupled to the first circuit board via a wire, wherein the first circuit board is configured to receive the incident light on the first surface via the lens;
• a member on an outer circumference portion of the first surface of the first circuit board;
• an infrared cut filter between the imaging element and the lens;
• a frame coupled to the member, wherein the frame comprises a first portion which extends in a first direction perpendicular to an optical axis of the lens, the first portion of the frame holds the infrared cut filter, the frame comprises a second portion which extends in a second direction opposite to the first direction, a first side of the second portion is in contact with a side of the member, the first side of the second portion faces the first circuit board, the side of the member is opposite to the first circuit board,
• the frame comprises a third portion which extends in a third direction along the optical axis of the lens, and
• the frame comprises a fourth portion which extends in a fourth direction opposite to the third direction;
• and
• at least one component on the outer circumference portion of the first circuit board, wherein the at least one component is in the member.