Protective covering for an electronic device

A method of manufacturing a protective case for an electronic device comprising:

• providing a first compostable biopolymer material that is substantially transparent;
• providing a second compostable biopolymer material that is softer then the first compostable biopolymer material and that is substantially opaque;
• injection molding the first compostable biopolymer material and forming the first compostable biopolymer material into a substantially rigid transparent planar back surface defined as a portion of the protective case, and further forming a terminal outer periphery edge around the rigid transparent planar back surface;
• over-molding all of the terminal outer periphery edge, of the rigid transparent back surface, with the second compostable biopolymer material;
• and forming the second compostable biopolymer material into a continuous side wall extending transversely from the terminal outer periphery edge of the rigid transparent planar back surface to form an outer bumper, which is further defined as a portion of the protective case and that is softer then the rigid transparent back surface, whereby the protective case for an electronic device is entirely manufactured from compostable biopolymer material.