# US 10,763,764 B2 · Stage and substrate processing apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,763,764 B2 - Document ID: US10763764B2 - Status: Granted - Kind: B2 - Application number: 15/815,447 - Filed: 2017-11-16 - Published: 2018-05-17 - Granted: 2020-09-01 - Earliest claimed: 2016-11-16 - Assignees: Tokyo Electron Limited - Applicants: Tokyo Electron Limited - Inventors: Tsutomu Hiroki - Web page: https://patentgrep.com/patent/US10763764B2 ## CPC - H02N 13/00: Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect - F28C 3/005: {one heat-exchange medium being a solid (F28C3/10 takes precedence)} - F28D 1/04: with tubular conduits {(F28D1/0246 takes precedence)} - H10P 72/0432: {mainly by conduction} - H10P 72/0434: {mainly by convection} - H10P 72/72: using electrostatic chucks - B05B 5/025: Discharge apparatus, e.g. electrostatic spray guns - B05C 11/00: Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00 (means for manipulating or holding work B05C13/00; enclosures for apparatus, booths B05C15/00; spray booths B05B16/00) - H10P 72/0421: {for drying etching} - H10P 72/722: {Details of electrostatic chucks} - H02N: ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR - F28C: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA COME INTO DIRECT CONTACT WITHOUT CHEMICAL INTERACTION (safety devices in general F16P; fluid heaters having heat generating means F24H; with an intermediate heat-transfer medium coming into direct contact with heat-exchange media F28D15/00 - F28D19/00; details of heat-exchange apparatus of general application F28F) - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B05B: SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES (spray-mixers with nozzles B01F25/72; processes for applying liquids or other fluent materials to surfaces by spraying B05D) - B05C: APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (spraying apparatus, atomising apparatus, nozzles B05B; plant for applying liquids or other fluent materials to objects by electrostatic spraying B05B5/08) ## Abstract A stage includes a heat exchanger, a plate provided on the heat exchanger and including a first main surface and a second main surface opposite to each other, the plate having a plurality of through-holes extending in a plate thickness direction, and an electrostatic chuck having a top surface on which a substrate is mounted and a bottom surface attached to the first main surface. The heat exchanger includes a plurality of first tubes having a plurality of opening ends facing a plurality of regions on the bottom surface which are exposed to the respective through-holes and a plurality of second tubes communicating with the through-holes. ## Claims ### Claim 1 A stage comprising: a heat exchanger; a plate provided on the heat exchanger and including a first main surface and a second main surface opposite to each other, the plate having a plurality of through-holes extending in a plate thickness direction; and an electrostatic chuck having a top surface on which a substrate is mounted and a bottom surface attached to the first main surface; wherein the heat exchanger includes: a plurality of first tubes having a plurality of opening ends facing a plurality of regions on the bottom surface which are exposed to the respective through-holes; and a plurality of second tubes communicating with the through-holes, wherein an area of the plate on the first main surface is greater than an area of the plate on a cross section, between the first main surface and the second main surface, which is in parallel with the first main surface. ### Claim 2 (depends on 1) The stage of claim 1, wherein the opening ends are positioned in the through-holes, respectively. ### Claim 3 (depends on 1) The stage of claim 1, wherein the plate is made of stainless steel. ### Claim 4 (depends on 1) The stage of claim 1, wherein the plate is made of a titanium-containing material. ### Claim 5 (depends on 1) The stage of claim 1, wherein the plate is made of aluminum. ### Claim 6 (depends on 1) The stage of claim 1, wherein the plate has a first region where the plurality of through-holes are formed and a second region extending from the first region to surround an outer periphery of the first region, the heat exchanger has a first region where the plurality of first tubes and the plurality of second tubes are formed and a second region extending from the first region to surround an outer periphery of the first region, and an O ring provided between the second region of the plate and the second region of the heat exchanger to seal a gap between the second region of the plate and the second region of the heat exchanger. ### Claim 7 (depends on 1) The stage of claim 1, wherein a wall surface among surfaces of the plate, which defines the respective through-holes, is partially curved at a region which includes a boundary between the first main surface and the wall surface such that the respective through-holes become gradually smaller toward openings of the respective through-holes which are formed at the first main surface from an intermediate portion between the openings of the respective through-holes which are formed at the first main surface and openings of the respective through-holes which are formed at the second main surface. ### Claim 8 A substrate processing apparatus comprising: a chamber main body having a chamber; and a stage comprising: a heat exchanger; a plate provided on the heat exchanger and including a first main surface and a second main surface opposite to each other, the plate having a plurality of through-holes extending in a plate thickness direction; and an electrostatic chuck having a top surface on which a substrate is mounted and a bottom surface attached to the first main surface; wherein the heat exchanger includes: a plurality of first tubes having a plurality of opening ends facing a plurality of regions on the bottom surface which are exposed to the respective through-holes; and a plurality of second tubes communicating with the through-holes, wherein the stage is provided in the chamber, and configured to discharge a heat transfer medium supplied from a medium temperature controller from the respective first tubes and return the heat transfer medium discharged from the respective first tubes to the medium temperature controller through the respective second tubes.