Emitter-on-sub-mount device

A lead-frame, comprising:

• a first portion;
• a second portion;
• and
• a respective set of interlocking structures associated with the first portion and the second portion,
• wherein an optical device is mechanically and electrically connected to the first portion,
• wherein the first portion and the second portion are electrically isolated from each other,
• wherein the first portion is associated with a first electrical pad,
• wherein the second portion is associated with a second electrical pad,
• wherein the lead-frame has a first coefficient of thermal expansion that matches a second coefficient of thermal expansion of the optical device.

A device, comprising:

• a housing;
• an optical component mechanically connected to the housing;
• a substrate mechanically connected to the housing;
• and
• an emitter-on-sub-mount device mechanically connected to the substrate and within the housing, comprising:
• a lead-frame comprising a first electrode and a second electrode, and
• a set of optical devices mechanically and electrically connected to the first electrode and electrically connected to the second electrode,
• wherein the lead-frame and the set of optical devices have matching coefficients of thermal expansion.