# US 10,763,638 B2 · Transistor outline housings for distributed feedback lasers > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,763,638 B2 - Document ID: US10763638B2 - Status: Granted - Kind: B2 - Application number: 16/119,571 - Filed: 2018-08-31 - Published: 2019-03-07 - Granted: 2020-09-01 - Earliest claimed: 2017-09-01 - Assignees: Schott AG - Applicants: Schott AG - Inventors: Rudolf Jungwirth; Amy Soon Li Ping; Artit Aowudomsuk; Ong Wai Li; Kenneth Tan; Karsten Droegemueller - Web page: https://patentgrep.com/patent/US10763638B2 ## CPC - H01S 5/02212: Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis - H01S 5/02325: Mechanically integrated components on mount members or optical micro-benches - H01S 5/02345: Wire-bonding - H01S 5/02415: {by using a thermo-electric cooler [TEC], e.g. Peltier element} - H01S 5/12: the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers (comprising a photonic bandgap structure H01S5/11; surface-emitting lasers H01S5/18) - H01S 5/0231: Stems - H01S 5/06226: {Modulation at ultra-high frequencies} - H10W 72/07552: {changes in structures or sizes} - H10W 72/521: {Structures or relative sizes of bond wires} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5473: {multiple bond wires connected to a common bond pad} - H10W 72/5522: {comprising gold [Au]} - H10W 72/884: {Die-attach connectors and bond wires} - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A transistor outline (TO) housing comprising a base part having a mounting area for a thermoelectric cooler, wherein the base part has at least two feedthroughs for connecting an optoelectronic component. A support extends from the upper surface of the base part, which support has at least two conductor traces arranged thereon, each of which is connected to a respective one of the feedthroughs for connecting the optoelectronic component. ## Claims ### Claim 1 A transistor outline housing for connecting to an optoelectronic component, comprising: a base part having an upper surface, the upper surface having a cooler mounting area; two feedthroughs configured to be connected to the optoelectronic component; a support that extends from the upper surface of the base part, wherein the support has two conductor traces arranged thereon, each of the two conductor traces being connected to a respective one of the two feedthroughs; and a ground conductor trace arranged on the support between the two conductor traces a trace sub-mount on a front side of the support, a thermoelectric cooler, the optoelectronic component, and a component sub-mount, wherein the thermoelectric cooler is arranged on the cooler mounting area of the base part, the component sub-mount extending above at least portions of the thermoelectric cooler and extending perpendicular to the upper surface of the base part, and wherein the component sub-mount adjoins the trace sub-mount. ### Claim 2 (depends on 1) The TO housing of claim 1, wherein the housing is a TO-56 style housing. ### Claim 3 (depends on 1) The TO housing of claim 1, further comprising the optoelectronic component connected to the two feedthroughs. ### Claim 4 (depends on 1) The TO housing of claim 1, wherein the two conductor traces extend along an angle to a lateral end face of the support. ### Claim 5 (depends on 1) The TO housing of claim 1, further comprising a trace sub-mount on a front side of the support, the two conductor traces being disposed on the trace sub-mount. ### Claim 6 (depends on 5) The TO housing of claim 5, wherein the trace sub-mount has through-holes with side walls that are metallized. ### Claim 7 (depends on 1) The TO housing of claim 1, wherein the two feedthroughs and the two conductor traces define signal paths having an impedance from 20 to 30Ω each. ### Claim 8 (depends on 1) The TO housing of claim 1, wherein the support has at least one of a height between 2.0 and 3.5 mm, a thickness between 0.3 and 1 mm, and a width between 1.0 and 2.0 mm, and/or wherein the base part has at least one of a diameter between 5 and 7 mm and a thickness between 0.5 and 2.5 mm. ### Claim 9 (depends on 1) The TO housing of claim 1, wherein the base part and the support are gold-plated. ### Claim 10 (depends on 1) The TO housing of claim 1, wherein the cooler mounting area in a central region of the upper surface of the base part and wherein the support is provided only on one side of the cooler mounting area. ### Claim 11 (depends on 1) The TO housing of claim 1, wherein the optoelectronic component is a DFB laser. ### Claim 12 (depends on 1) The TO housing of claim 1, wherein the thermoelectric cooler has an L-shaped portion, wherein the component sub-mount is arranged on a surface of the L-shaped thermoelectric cooler, the surface being oriented perpendicularly to the upper surface of the base part. ### Claim 13 (depends on 1) The TO housing of claim 1, wherein the component sub-mount is connected to the trace sub-mount by bonding wires. ### Claim 14 (depends on 13) The TO housing of claim 13, wherein the bonding wires have a length of less than 1 mm each. ### Claim 15 (depends on 1) The TO housing of claim 1, further comprising a driver circuit connected to the two feedthroughs, wherein the driver circuit has an impedance from 20 to 30Ω. ### Claim 16 (depends on 1) The TO housing of claim 1, wherein the base part and the support are stamped as a single piece. ### Claim 17 (depends on 1) The TO housing of claim 1, wherein the base part and the support are each stamped parts that are joined to each other soldering or welding. ### Claim 18 A transistor outline housing for connecting to an optoelectronic component, comprising: a base part having an upper surface, the upper surface having a cooler mounting area; two feedthroughs configured to connect to the optoelectronic component; a support that extends from the upper surface of the base part, wherein the support has two conductor traces arranged thereon, each of the two conductor traces being connected to a respective one of the two feedthroughs; a ground conductor trace arranged between the two conductor traces; and a trace sub-mount on a front side of the support, the two conductor traces being disposed on the trace sub-mount, wherein the trace sub-mount has through-holes with side walls that are metallized. ### Claim 19 A transistor outline housing for connecting to an optoelectronic component, comprising: a base part having an upper surface, the upper surface having a cooler mounting area; two feedthroughs configured to connect to the optoelectronic component; and a support that extends from the upper surface of the base part, wherein the support has two conductor traces arranged thereon, each of the two conductor traces being connected to a respective one of the two feedthroughs, wherein the cooler mounting area in a central region of the upper surface of the base part and wherein the support is provided only on one side of the cooler mounting area.