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US 10,763,636 B2Granted
Laser device
AssigneeO-Net Communications (Shenzhen) Limited
InventorsBouchaib Hraimel, Zining Huang
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Abstract
The present disclosure provides a laser device, where the laser device comprises a substrate, a seed laser disposed on the substrate, and a radiofrequency coil. Two connection ends of the radiofrequency coil are connected with corresponding pin ends of the seed laser, respectively.
Claims10
A laser device, comprising:
- a substrate;
- a seed laser disposed on the substrate;
- and
- a radiofrequency coil;
- wherein two connection ends of the radiofrequency coil are connected with corresponding pin ends of the seed laser, respectively;
- wherein characteristic impedance of the radio frequency coil matches with characteristic impedance of the seed laser;
- wherein the substrate is a printed circuit board (PCB) and the radiofrequency coil is disposed on a first end surface of the PCB, and the two pin ends of the seed laser are disposed on a second end surface of the PCB;
- wherein a through-hole of the PCB is located in an interval of a wire wrapping of the radiofrequency coil;
- a plurality of connection pins are disposed on the first and/or second end surface of the PCB;
- two connection pins of the first and/or second end surface of the PCB are connected with the pin ends of the seed laser, respectively;
- two connection pins of the first and/or second end surface of the PCB are connected with two connection ends of the radiofrequency coil.
8 more elements
Dependencies are inferred from the claim text.